HK1205357A1 - 半導體器件和用於製造其的方法 - Google Patents
半導體器件和用於製造其的方法Info
- Publication number
- HK1205357A1 HK1205357A1 HK15105948.5A HK15105948A HK1205357A1 HK 1205357 A1 HK1205357 A1 HK 1205357A1 HK 15105948 A HK15105948 A HK 15105948A HK 1205357 A1 HK1205357 A1 HK 1205357A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Engineering & Computer Science (AREA)
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JP2013133174A JP6129659B2 (ja) | 2013-06-25 | 2013-06-25 | 半導体装置およびその製造方法 |
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JP6522402B2 (ja) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | 半導体装置 |
JP6449462B2 (ja) | 2015-07-16 | 2019-01-09 | 株式会社PEZY Computing | 半導体装置 |
JP6503264B2 (ja) * | 2015-08-27 | 2019-04-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017098334A (ja) * | 2015-11-19 | 2017-06-01 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017112327A (ja) * | 2015-12-18 | 2017-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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US20140374890A1 (en) | 2014-12-25 |
JP2015008229A (ja) | 2015-01-15 |
EP2822031A2 (en) | 2015-01-07 |
US20170323848A1 (en) | 2017-11-09 |
US9754865B2 (en) | 2017-09-05 |
EP2822031A3 (en) | 2015-06-10 |
CN104253102A (zh) | 2014-12-31 |
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