HK1205357A1 - 半導體器件和用於製造其的方法 - Google Patents

半導體器件和用於製造其的方法

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Publication number
HK1205357A1
HK1205357A1 HK15105948.5A HK15105948A HK1205357A1 HK 1205357 A1 HK1205357 A1 HK 1205357A1 HK 15105948 A HK15105948 A HK 15105948A HK 1205357 A1 HK1205357 A1 HK 1205357A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
Prior art date
Application number
HK15105948.5A
Other languages
English (en)
Inventor
山下尚德
清原俊範
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1205357A1 publication Critical patent/HK1205357A1/zh

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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L23/495Lead-frames or other flat leads
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