HK1197317A1 - 半導體發光器件和發光模塊 - Google Patents
半導體發光器件和發光模塊Info
- Publication number
- HK1197317A1 HK1197317A1 HK14110755A HK14110755A HK1197317A1 HK 1197317 A1 HK1197317 A1 HK 1197317A1 HK 14110755 A HK14110755 A HK 14110755A HK 14110755 A HK14110755 A HK 14110755A HK 1197317 A1 HK1197317 A1 HK 1197317A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- emitting module
- module
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011172875A JP5662277B2 (ja) | 2011-08-08 | 2011-08-08 | 半導体発光装置及び発光モジュール |
PCT/JP2012/001804 WO2013021519A1 (en) | 2011-08-08 | 2012-03-14 | Semiconductor light emitting device and light emitting module |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1197317A1 true HK1197317A1 (zh) | 2015-01-09 |
Family
ID=45955060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14110755A HK1197317A1 (zh) | 2011-08-08 | 2014-10-27 | 半導體發光器件和發光模塊 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9171882B2 (zh) |
EP (1) | EP2742531A1 (zh) |
JP (1) | JP5662277B2 (zh) |
CN (1) | CN103828053A (zh) |
HK (1) | HK1197317A1 (zh) |
TW (1) | TWI475722B (zh) |
WO (1) | WO2013021519A1 (zh) |
Families Citing this family (43)
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TWI440210B (zh) | 2007-01-22 | 2014-06-01 | Cree Inc | 使用發光裝置外部互連陣列之照明裝置及其製造方法 |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US11251348B2 (en) | 2011-06-24 | 2022-02-15 | Creeled, Inc. | Multi-segment monolithic LED chip |
US9653643B2 (en) | 2012-04-09 | 2017-05-16 | Cree, Inc. | Wafer level packaging of light emitting diodes (LEDs) |
US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
US11160148B2 (en) | 2017-06-13 | 2021-10-26 | Ideal Industries Lighting Llc | Adaptive area lamp |
DE102013103600A1 (de) * | 2013-04-10 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Modul mit wenigstens zwei Halbleiterchips |
EP3017483B1 (en) * | 2013-07-03 | 2020-05-06 | Lumileds Holding B.V. | Led with stress-buffer layer under metallization layer |
JP2015050270A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 半導体発光装置 |
JP6303344B2 (ja) * | 2013-09-05 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置 |
JP2015079929A (ja) | 2013-09-11 | 2015-04-23 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP6428249B2 (ja) * | 2013-12-25 | 2018-11-28 | 日亜化学工業株式会社 | 発光装置 |
JP6219177B2 (ja) * | 2014-01-17 | 2017-10-25 | スタンレー電気株式会社 | 半導体発光装置 |
JP6379542B2 (ja) * | 2014-03-14 | 2018-08-29 | 日亜化学工業株式会社 | 照明装置 |
JP2015195332A (ja) | 2014-03-27 | 2015-11-05 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
US9620436B2 (en) | 2014-04-09 | 2017-04-11 | Invensas Corporation | Light emitting diode device with reconstituted LED components on substrate |
DE102014106791B4 (de) | 2014-05-14 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement, Beleuchtungsvorrichtung und Verfahren zur Herstellung eines Halbleiterbauelements |
TWI614920B (zh) | 2014-05-19 | 2018-02-11 | 晶元光電股份有限公司 | 光電元件及其製造方法 |
US9831387B2 (en) * | 2014-06-14 | 2017-11-28 | Hiphoton Co., Ltd. | Light engine array |
DE102014215939A1 (de) | 2014-08-12 | 2016-02-18 | Osram Gmbh | Beleuchtungsvorrichtung und Verfahren zum Herstellen einer solchen |
JP6295171B2 (ja) | 2014-09-16 | 2018-03-14 | アルパッド株式会社 | 発光ユニット及び半導体発光装置 |
CN104409466B (zh) * | 2014-12-08 | 2017-08-18 | 厦门市三安光电科技有限公司 | 倒装高压发光器件及其制作方法 |
KR20160141301A (ko) | 2015-05-29 | 2016-12-08 | 삼성전자주식회사 | 반도체 발광 소자 패키지 |
US9853017B2 (en) * | 2015-06-05 | 2017-12-26 | Lumens Co., Ltd. | Light emitting device package and light emitting device package module |
DE102015111558B4 (de) | 2015-07-16 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und ein Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102016103328A1 (de) * | 2016-02-25 | 2017-08-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
JP6855787B2 (ja) * | 2016-12-26 | 2021-04-07 | 日亜化学工業株式会社 | 発光素子 |
TWI778010B (zh) * | 2017-01-26 | 2022-09-21 | 晶元光電股份有限公司 | 發光元件 |
KR102317874B1 (ko) * | 2017-02-09 | 2021-10-28 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
JP7290001B2 (ja) | 2017-08-03 | 2023-06-13 | クリーエルイーディー・インコーポレーテッド | 高密度ピクセル化ledチップ、チップアレイデバイス、及びその製造方法 |
US10734363B2 (en) | 2017-08-03 | 2020-08-04 | Cree, Inc. | High density pixelated-LED chips and chip array devices |
US10529773B2 (en) | 2018-02-14 | 2020-01-07 | Cree, Inc. | Solid state lighting devices with opposing emission directions |
DE102018119538A1 (de) * | 2018-08-10 | 2020-02-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauteil und herstellungsverfahren für optoelektronische halbleiterbauteile |
US10903265B2 (en) | 2018-12-21 | 2021-01-26 | Cree, Inc. | Pixelated-LED chips and chip array devices, and fabrication methods |
US11817526B2 (en) | 2019-10-29 | 2023-11-14 | Creeled, Inc. | Texturing for high density pixelated-LED chips and chip array devices |
JP7389331B2 (ja) | 2019-10-31 | 2023-11-30 | 日亜化学工業株式会社 | 発光デバイスの製造方法 |
JP7319551B2 (ja) * | 2020-03-31 | 2023-08-02 | 日亜化学工業株式会社 | 発光装置 |
US11804416B2 (en) * | 2020-09-08 | 2023-10-31 | UTAC Headquarters Pte. Ltd. | Semiconductor device and method of forming protective layer around cavity of semiconductor die |
US11437548B2 (en) | 2020-10-23 | 2022-09-06 | Creeled, Inc. | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
JP7223046B2 (ja) * | 2021-02-24 | 2023-02-15 | 晶元光電股▲ふん▼有限公司 | 光電部品 |
TWI787890B (zh) * | 2021-06-30 | 2022-12-21 | 錼創顯示科技股份有限公司 | 微型發光二極體顯示裝置 |
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JP5101645B2 (ja) | 2010-02-24 | 2012-12-19 | 株式会社東芝 | 半導体発光装置 |
JP5197654B2 (ja) | 2010-03-09 | 2013-05-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5202559B2 (ja) | 2010-03-09 | 2013-06-05 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP2011199193A (ja) | 2010-03-23 | 2011-10-06 | Toshiba Corp | 発光装置及びその製造方法 |
JP5101650B2 (ja) | 2010-03-25 | 2012-12-19 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5356312B2 (ja) | 2010-05-24 | 2013-12-04 | 株式会社東芝 | 半導体発光装置 |
JP5325834B2 (ja) | 2010-05-24 | 2013-10-23 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5281612B2 (ja) | 2010-05-26 | 2013-09-04 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5426481B2 (ja) | 2010-05-26 | 2014-02-26 | 株式会社東芝 | 発光装置 |
JP2011253925A (ja) | 2010-06-02 | 2011-12-15 | Toshiba Corp | 発光装置の製造方法 |
US20110298001A1 (en) | 2010-06-03 | 2011-12-08 | Kabushiki Kaisha Toshiba | Method for manufacturing light-emitting device and light-emitting device manufactured by the same |
TW201145614A (en) | 2010-06-03 | 2011-12-16 | Toshiba Kk | Method for manufacturing light-emitting device and light-emitting device manufactured by the same |
JP5390472B2 (ja) | 2010-06-03 | 2014-01-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5337105B2 (ja) | 2010-06-03 | 2013-11-06 | 株式会社東芝 | 半導体発光装置 |
JP2011253975A (ja) | 2010-06-03 | 2011-12-15 | Toshiba Corp | 発光装置およびその製造方法 |
JP5337106B2 (ja) | 2010-06-04 | 2013-11-06 | 株式会社東芝 | 半導体発光装置 |
JP5343040B2 (ja) | 2010-06-07 | 2013-11-13 | 株式会社東芝 | 半導体発光装置 |
JP5449039B2 (ja) | 2010-06-07 | 2014-03-19 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5759790B2 (ja) | 2010-06-07 | 2015-08-05 | 株式会社東芝 | 半導体発光装置の製造方法 |
JP5603793B2 (ja) | 2011-02-09 | 2014-10-08 | 株式会社東芝 | 半導体発光装置 |
-
2011
- 2011-08-08 JP JP2011172875A patent/JP5662277B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-14 EP EP12714398.0A patent/EP2742531A1/en not_active Withdrawn
- 2012-03-14 CN CN201280044655.8A patent/CN103828053A/zh active Pending
- 2012-03-14 WO PCT/JP2012/001804 patent/WO2013021519A1/en active Application Filing
- 2012-03-20 TW TW101109505A patent/TWI475722B/zh not_active IP Right Cessation
-
2014
- 2014-02-10 US US14/176,721 patent/US9171882B2/en active Active
- 2014-10-27 HK HK14110755A patent/HK1197317A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN103828053A (zh) | 2014-05-28 |
WO2013021519A1 (en) | 2013-02-14 |
TWI475722B (zh) | 2015-03-01 |
US20140175471A1 (en) | 2014-06-26 |
EP2742531A1 (en) | 2014-06-18 |
JP5662277B2 (ja) | 2015-01-28 |
JP2013038212A (ja) | 2013-02-21 |
US9171882B2 (en) | 2015-10-27 |
TW201308673A (zh) | 2013-02-16 |
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