HK1154990A1 - Semiconductor device and method for manufacturing the same - Google Patents
Semiconductor device and method for manufacturing the sameInfo
- Publication number
- HK1154990A1 HK1154990A1 HK11109085.4A HK11109085A HK1154990A1 HK 1154990 A1 HK1154990 A1 HK 1154990A1 HK 11109085 A HK11109085 A HK 11109085A HK 1154990 A1 HK1154990 A1 HK 1154990A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008097795 | 2008-04-04 | ||
| PCT/JP2008/069713 WO2009122607A1 (ja) | 2008-04-04 | 2008-10-30 | 半導体装置及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1154990A1 true HK1154990A1 (en) | 2012-05-04 |
Family
ID=41135019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK11109085.4A HK1154990A1 (en) | 2008-04-04 | 2011-08-29 | Semiconductor device and method for manufacturing the same |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8409932B2 (ko) |
| EP (1) | EP2261963A4 (ko) |
| JP (1) | JP5146678B2 (ko) |
| KR (1) | KR101261104B1 (ko) |
| CN (1) | CN101983419B (ko) |
| HK (1) | HK1154990A1 (ko) |
| TW (1) | TW200945457A (ko) |
| WO (1) | WO2009122607A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2736983A1 (en) * | 2008-09-11 | 2010-03-18 | Sumitomo Bakelite Co., Ltd. | Semiconductor device, and resin composition used for semiconductor device |
| JP2012054270A (ja) * | 2010-08-31 | 2012-03-15 | Toyoda Gosei Co Ltd | 発光装置の製造方法 |
| US8148210B1 (en) * | 2010-09-13 | 2012-04-03 | Infineon Technologies Ag | Method for fabricating a semiconductor chip panel |
| CN102254837A (zh) * | 2011-04-29 | 2011-11-23 | 永道无线射频标签(扬州)有限公司 | 电子标签倒贴片封装生产线封装工艺 |
| JP6051630B2 (ja) | 2011-07-13 | 2016-12-27 | 味の素株式会社 | 半導体パッケージ |
| JP6103377B2 (ja) * | 2013-06-19 | 2017-03-29 | シャープ株式会社 | 表示装置及びその製造方法 |
| JP6897620B2 (ja) * | 2018-03-30 | 2021-06-30 | 株式会社オートネットワーク技術研究所 | ワイヤハーネス |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245138A (ja) * | 1985-08-23 | 1987-02-27 | Sony Corp | 電子部品装置の製法 |
| JPS6285436A (ja) * | 1985-10-09 | 1987-04-18 | Sharp Corp | 半導体チツプの基板取付方法 |
| JP3235520B2 (ja) | 1997-07-10 | 2001-12-04 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JP3158399B2 (ja) | 1998-04-23 | 2001-04-23 | 日本電気株式会社 | 樹脂塗布方法 |
| JP3611463B2 (ja) * | 1998-10-27 | 2005-01-19 | 松下電器産業株式会社 | 電子部品の製造方法 |
| JP2002083832A (ja) * | 2000-09-08 | 2002-03-22 | Toppan Forms Co Ltd | Ｉｃチップの固定方法 |
| JP2003264205A (ja) * | 2002-03-08 | 2003-09-19 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP4607429B2 (ja) * | 2003-03-25 | 2011-01-05 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
| JP4383768B2 (ja) * | 2003-04-23 | 2009-12-16 | スリーエム イノベイティブ プロパティズ カンパニー | 封止用フィルム接着剤、封止用フィルム積層体及び封止方法 |
| JP3912324B2 (ja) * | 2003-05-15 | 2007-05-09 | エプソントヨコム株式会社 | 弾性表面波デバイスの製造方法 |
| JP3835556B2 (ja) * | 2003-10-27 | 2006-10-18 | セイコーエプソン株式会社 | 半導体装置の製造方法及び半導体装置の製造装置 |
| JP4754185B2 (ja) | 2004-05-27 | 2011-08-24 | リンテック株式会社 | 半導体封止用樹脂シートおよびこれを用いた半導体装置の製造方法 |
| JP4502870B2 (ja) | 2005-04-20 | 2010-07-14 | Ｎｅｃエンジニアリング株式会社 | 中空半導体パッケージの製造方法 |
| JP4544044B2 (ja) | 2005-06-08 | 2010-09-15 | Ｔｄｋ株式会社 | 半導体装置 |
| US7520052B2 (en) * | 2005-06-27 | 2009-04-21 | Texas Instruments Incorporated | Method of manufacturing a semiconductor device |
| US20070243667A1 (en) * | 2006-04-18 | 2007-10-18 | Texas Instruments Incorporated | POP Semiconductor Device Manufacturing Method |
| DE102007037248A1 (de) * | 2006-09-15 | 2008-03-27 | Samsung Electro - Mechanics Co., Ltd., Suwon | Verfahren zur Herstellung eines eine Metallfilm-Leiterbahn bildenden Körpers |
-
2008
- 2008-10-30 CN CN2008801284639A patent/CN101983419B/zh not_active Expired - Fee Related
- 2008-10-30 WO PCT/JP2008/069713 patent/WO2009122607A1/ja active Application Filing
- 2008-10-30 EP EP20080873748 patent/EP2261963A4/en not_active Withdrawn
- 2008-10-30 US US12/734,695 patent/US8409932B2/en not_active Expired - Fee Related
- 2008-10-30 JP JP2008279024A patent/JP5146678B2/ja not_active Expired - Fee Related
- 2008-10-30 KR KR1020107014645A patent/KR101261104B1/ko not_active IP Right Cessation
- 2008-11-20 TW TW097144791A patent/TW200945457A/zh not_active IP Right Cessation
-
2011
- 2011-08-29 HK HK11109085.4A patent/HK1154990A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101261104B1 (ko) | 2013-05-06 |
| KR20100114019A (ko) | 2010-10-22 |
| TW200945457A (en) | 2009-11-01 |
| EP2261963A4 (en) | 2013-09-11 |
| WO2009122607A1 (ja) | 2009-10-08 |
| US8409932B2 (en) | 2013-04-02 |
| JP2009267344A (ja) | 2009-11-12 |
| CN101983419B (zh) | 2012-08-08 |
| EP2261963A1 (en) | 2010-12-15 |
| CN101983419A (zh) | 2011-03-02 |
| TWI373077B (ko) | 2012-09-21 |
| US20100308476A1 (en) | 2010-12-09 |
| JP5146678B2 (ja) | 2013-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20181102 |