HK1153825A1 - Pellicle container - Google Patents

Pellicle container

Info

Publication number
HK1153825A1
HK1153825A1 HK11107875.2A HK11107875A HK1153825A1 HK 1153825 A1 HK1153825 A1 HK 1153825A1 HK 11107875 A HK11107875 A HK 11107875A HK 1153825 A1 HK1153825 A1 HK 1153825A1
Authority
HK
Hong Kong
Prior art keywords
pellicle container
pellicle
container
Prior art date
Application number
HK11107875.2A
Other languages
English (en)
Inventor
Horikoshijun
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of HK1153825A1 publication Critical patent/HK1153825A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Buffer Packaging (AREA)
HK11107875.2A 2009-08-06 2011-07-29 Pellicle container HK1153825A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009183033A JP2011034020A (ja) 2009-08-06 2009-08-06 ペリクル収納容器

Publications (1)

Publication Number Publication Date
HK1153825A1 true HK1153825A1 (en) 2012-04-05

Family

ID=43763126

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11107875.2A HK1153825A1 (en) 2009-08-06 2011-07-29 Pellicle container

Country Status (5)

Country Link
JP (1) JP2011034020A (zh)
KR (1) KR20110014951A (zh)
CN (1) CN101995764B (zh)
HK (1) HK1153825A1 (zh)
TW (1) TWI388475B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011095586A (ja) * 2009-10-30 2011-05-12 Shin-Etsu Chemical Co Ltd ペリクルおよびその製造方法
JP5586560B2 (ja) * 2011-10-28 2014-09-10 信越化学工業株式会社 ペリクル収容容器
JP5586559B2 (ja) * 2011-10-28 2014-09-10 信越化学工業株式会社 ペリクル収容容器
JP2014009020A (ja) * 2012-06-29 2014-01-20 Sekisui Plastics Co Ltd 梱包材および梱包体
NL2012362A (en) * 2013-03-27 2014-09-30 Asml Netherlands Bv Lithographic apparatus.
JP5984187B2 (ja) * 2013-04-22 2016-09-06 信越化学工業株式会社 ペリクルとフォトマスクのアセンブリ
CN103449025A (zh) * 2013-09-10 2013-12-18 昆山市巴城镇顺拓工程机械配件厂 半导体元件的托盘固定夹
JP6320309B2 (ja) * 2015-01-19 2018-05-09 信越化学工業株式会社 ペリクル収納容器
JP2016151633A (ja) * 2015-02-17 2016-08-22 信越化学工業株式会社 ペリクル収納容器
JP6275067B2 (ja) * 2015-02-24 2018-02-07 信越化学工業株式会社 ペリクル収納容器
JP6351178B2 (ja) * 2015-07-13 2018-07-04 信越化学工業株式会社 ペリクル収納容器およびペリクルの取り出し方法
EP3391140A1 (en) 2015-12-14 2018-10-24 ASML Netherlands B.V. A membrane assembly
CA3008474A1 (en) 2015-12-14 2017-06-22 Asml Netherlands B.V. A membrane for euv lithography
JP6604651B2 (ja) * 2016-02-22 2019-11-13 信越化学工業株式会社 ペリクル収納容器
JP6357218B2 (ja) * 2016-12-28 2018-07-11 積水化成品工業株式会社 梱包材および梱包体

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408000B2 (ja) * 1994-11-28 2003-05-19 菱電セミコンダクタシステムエンジニアリング株式会社 ペリクル剥離方法
JPH0955354A (ja) * 1995-08-14 1997-02-25 Shin Etsu Polymer Co Ltd ペリクル収納容器
JP3919260B2 (ja) * 1996-07-05 2007-05-23 信越ポリマー株式会社 ペリクル収納容器
JPH10114389A (ja) * 1996-10-07 1998-05-06 Nikon Corp ペリクル容器
JPH10114388A (ja) * 1996-10-07 1998-05-06 Nikon Corp ペリクル容器
JPH10198022A (ja) * 1997-01-07 1998-07-31 Shin Etsu Chem Co Ltd ペリクル収納容器
JPH1124240A (ja) * 1997-07-07 1999-01-29 Shin Etsu Chem Co Ltd ペリクルの収納方法及びペリクル収納容器
JPH1149267A (ja) * 1997-08-01 1999-02-23 Tenshiyou Denki Kogyo Kk 液晶板搬送容器
JP2003216303A (ja) * 2001-11-13 2003-07-31 Alps Electric Co Ltd 入力装置
JP2003243496A (ja) * 2002-02-15 2003-08-29 Dainippon Printing Co Ltd 基板収納ケース
JP3868401B2 (ja) * 2003-06-25 2007-01-17 株式会社スズセイ 筆記具のグリップ部分構造
JP4236535B2 (ja) * 2003-07-31 2009-03-11 旭化成エレクトロニクス株式会社 大型ペリクル収納容器
JP4455950B2 (ja) * 2004-07-28 2010-04-21 三菱電線工業株式会社 滑り止め
JP4391435B2 (ja) * 2005-03-22 2009-12-24 信越化学工業株式会社 ペリクル収納容器
JP2007065583A (ja) * 2005-09-02 2007-03-15 Shin Etsu Chem Co Ltd ペリクルのペリクル容器への収納方法、ペリクルのペリクル容器からの取り出し方法、ペリクルの輸送方法および保管方法、ペリクルを収納したペリクル容器の梱包方法ならびにペリクルを収納したペリクル容器の開封方法
JP2007328226A (ja) * 2006-06-09 2007-12-20 Shin Etsu Chem Co Ltd ペリクル収納容器及びその製造方法
JP4736972B2 (ja) * 2006-06-22 2011-07-27 パナソニック株式会社 多方向操作スイッチ
JP2008158116A (ja) * 2006-12-22 2008-07-10 Asahi Kasei Electronics Co Ltd ペリクルフレーム
JP4889510B2 (ja) * 2007-01-16 2012-03-07 信越化学工業株式会社 ペリクルフレーム内面への粘着剤の塗布方法
JP5269438B2 (ja) * 2007-03-13 2013-08-21 旭化成イーマテリアルズ株式会社 大型ペリクルの保護フィルム及び大型ペリクルの収納方法
CN102681334B (zh) * 2007-07-06 2015-09-30 旭化成电子材料株式会社 从容纳容器取出大型表膜构件的取出方法
JP4930850B2 (ja) * 2007-10-04 2012-05-16 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 防水構造及び電子機器の筐体
JP5051840B2 (ja) * 2007-11-22 2012-10-17 信越化学工業株式会社 ペリクル収納容器内にペリクルを保管する方法
JP5133229B2 (ja) * 2008-12-05 2013-01-30 信越ポリマー株式会社 ペリクル収納容器
JP2011031978A (ja) * 2009-08-05 2011-02-17 Shin Etsu Polymer Co Ltd 大型精密基板収納容器

Also Published As

Publication number Publication date
KR20110014951A (ko) 2011-02-14
CN101995764A (zh) 2011-03-30
CN101995764B (zh) 2013-01-23
TWI388475B (zh) 2013-03-11
JP2011034020A (ja) 2011-02-17
TW201105555A (en) 2011-02-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210721