HK1152144A1 - Electronic device and method for connecting electronic circuit board - Google Patents

Electronic device and method for connecting electronic circuit board

Info

Publication number
HK1152144A1
HK1152144A1 HK11106035.1A HK11106035A HK1152144A1 HK 1152144 A1 HK1152144 A1 HK 1152144A1 HK 11106035 A HK11106035 A HK 11106035A HK 1152144 A1 HK1152144 A1 HK 1152144A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
electronic device
electronic circuit
electronic
connecting electronic
Prior art date
Application number
HK11106035.1A
Other languages
English (en)
Inventor
Yabe Masaaki
Koizumi Yoshiaki
Higuma Toshiyasu
Kushiro Noriyuki
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of HK1152144A1 publication Critical patent/HK1152144A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/79—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for data transfer in combination with power transfer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils
    • H04B5/263—Multiple coils at either side
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Near-Field Transmission Systems (AREA)
HK11106035.1A 2008-05-22 2011-06-14 Electronic device and method for connecting electronic circuit board HK1152144A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008134266A JP4698702B2 (ja) 2008-05-22 2008-05-22 電子機器
PCT/JP2009/054711 WO2009142053A1 (ja) 2008-05-22 2009-03-12 電子機器、電子回路基板の接続方法

Publications (1)

Publication Number Publication Date
HK1152144A1 true HK1152144A1 (en) 2012-02-17

Family

ID=41339992

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11106035.1A HK1152144A1 (en) 2008-05-22 2011-06-14 Electronic device and method for connecting electronic circuit board

Country Status (7)

Country Link
US (1) US8643219B2 (zh)
EP (3) EP3285271B1 (zh)
JP (1) JP4698702B2 (zh)
CN (1) CN102037526B (zh)
AU (1) AU2009250645B2 (zh)
HK (1) HK1152144A1 (zh)
WO (1) WO2009142053A1 (zh)

Families Citing this family (108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5435029B2 (ja) * 2009-06-04 2014-03-05 日本電気株式会社 半導体装置及び信号伝達方法
JP4669560B1 (ja) * 2009-12-11 2011-04-13 エンパイア テクノロジー ディベロップメント エルエルシー 非接触式の情報管理・充電システム、携帯通信端末および非接触式の情報・電力伝送ユニット
KR20120119927A (ko) * 2010-05-11 2012-11-01 삼성전자주식회사 무선 충전이 가능한 3ｄ 안경 및 무선전력전송 시스템
JP5598118B2 (ja) * 2010-06-28 2014-10-01 株式会社リコー 電子機器および画像形成装置
IT1400748B1 (it) 2010-06-30 2013-07-02 St Microelectronics Srl Apparato per il trasferimento wireless di energia fra due dispositivi e contemporaneo trasferimento di dati.
WO2012037444A2 (en) * 2010-09-17 2012-03-22 Cascade Microtech, Inc. Systems and methods for non-contact power and data transfer in electronic devices
JP5608026B2 (ja) * 2010-09-24 2014-10-15 Ｎｅｃトーキン株式会社 非接触電力伝送および通信システム
US20120203620A1 (en) 2010-11-08 2012-08-09 Douglas Howard Dobyns Techniques For Wireless Communication Of Proximity Based Marketing
US20130293191A1 (en) 2011-01-26 2013-11-07 Panasonic Corporation Non-contact charging module and non-contact charging instrument
US20130154553A1 (en) * 2011-02-22 2013-06-20 Daniel W. Steele Wireless Automated Vehicle Energizing System
JP5711572B2 (ja) * 2011-03-02 2015-05-07 日東電工株式会社 アイソレータ用回路基板、アイソレータおよびそれらの製造方法
US20120228955A1 (en) * 2011-03-07 2012-09-13 Advantest Corporation Transmission coil for wireless power transmission
JP5677875B2 (ja) * 2011-03-16 2015-02-25 日立マクセル株式会社 非接触電力伝送システム
US8929809B2 (en) 2011-03-22 2015-01-06 Radeum, Inc. Techniques for wireless communication of proximity based content
US8880100B2 (en) 2011-03-23 2014-11-04 Radium, Inc. Proximity based social networking
FR2974259B1 (fr) * 2011-04-18 2013-06-07 Commissariat Energie Atomique Recepteur alimente par une interface sans fil de type inductif
US20120274148A1 (en) * 2011-04-27 2012-11-01 Samsung Electro-Mechanics Co., Ltd. Contactless power transmission device and electronic device having the same
JP5708270B2 (ja) * 2011-06-03 2015-04-30 株式会社村田製作所 送電装置、受電装置、及び電力伝送システム
WO2012172812A1 (ja) 2011-06-14 2012-12-20 パナソニック株式会社 通信装置
KR101815323B1 (ko) 2011-09-08 2018-01-05 삼성전자주식회사 복수의 무선 전력 수신기로부터 무선 전력 공급기에 신호를 송신하는 방법 및 장치
FR2980055B1 (fr) * 2011-09-12 2013-12-27 Valeo Systemes Thermiques Dispositif de transmission de puissance inductif
US10204734B2 (en) 2011-11-02 2019-02-12 Panasonic Corporation Electronic device including non-contact charging module and near field communication antenna
EP2775632A4 (en) * 2011-11-02 2015-07-01 Panasonic Corp COIL FOR CONTACTLESS WIRELESS COMMUNICATION, TRANSMISSION COIL, MOBILE WIRELESS TERMINAL
WO2013084480A1 (ja) * 2011-12-07 2013-06-13 パナソニック株式会社 非接触充電モジュール及びそれを備えた携帯端末
US9727511B2 (en) 2011-12-30 2017-08-08 Bedrock Automation Platforms Inc. Input/output module with multi-channel switching capability
US11967839B2 (en) 2011-12-30 2024-04-23 Analog Devices, Inc. Electromagnetic connector for an industrial control system
US9467297B2 (en) 2013-08-06 2016-10-11 Bedrock Automation Platforms Inc. Industrial control system redundant communications/control modules authentication
US10834820B2 (en) 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Industrial control system cable
US8862802B2 (en) 2011-12-30 2014-10-14 Bedrock Automation Platforms Inc. Switch fabric having a serial communications interface and a parallel communications interface
US8971072B2 (en) 2011-12-30 2015-03-03 Bedrock Automation Platforms Inc. Electromagnetic connector for an industrial control system
US9437967B2 (en) 2011-12-30 2016-09-06 Bedrock Automation Platforms, Inc. Electromagnetic connector for an industrial control system
US10834094B2 (en) 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Operator action authentication in an industrial control system
JP2013169122A (ja) 2012-02-17 2013-08-29 Panasonic Corp 非接触充電モジュール及びそれを備えた携帯端末
AT512504B1 (de) * 2012-03-22 2013-09-15 Seibersdorf Labor Gmbh Vorrichtung und Verfahren zur Bestimmung der Kapazität
CN102680123A (zh) * 2012-05-30 2012-09-19 西安交通大学 一种保持架温度及应力在线监测系统及其方法
JP6112383B2 (ja) 2012-06-28 2017-04-12 パナソニックＩｐマネジメント株式会社 携帯端末
JP6008237B2 (ja) 2012-06-28 2016-10-19 パナソニックＩｐマネジメント株式会社 携帯端末
KR20140011069A (ko) * 2012-07-17 2014-01-28 한국전자통신연구원 무선 전력 전송 장치
US9654184B2 (en) * 2012-07-20 2017-05-16 WIPQTUS Inc. Transmitter to receiver communication link in a wireless power system
US9805863B2 (en) 2012-07-27 2017-10-31 Thoratec Corporation Magnetic power transmission utilizing phased transmitter coil arrays and phased receiver coil arrays
US10383990B2 (en) 2012-07-27 2019-08-20 Tc1 Llc Variable capacitor for resonant power transfer systems
WO2014018971A1 (en) 2012-07-27 2014-01-30 Thoratec Corporation Resonant power transfer systems with protective algorithm
EP2878061B1 (en) 2012-07-27 2023-10-25 Tc1 Llc Thermal management for implantable wireless power transfer systems
US10291067B2 (en) 2012-07-27 2019-05-14 Tc1 Llc Computer modeling for resonant power transfer systems
WO2014018967A1 (en) 2012-07-27 2014-01-30 Thoratec Corporation Self-tuning resonant power transfer systems
US10525181B2 (en) 2012-07-27 2020-01-07 Tc1 Llc Resonant power transfer system and method of estimating system state
EP2878062A4 (en) 2012-07-27 2016-04-20 Thoratec Corp RESONANT COILS AND RESONANT TRANSMISSION SYSTEMS
US9991731B2 (en) 2012-09-05 2018-06-05 Renesas Electronics Corporation Non-contact charging device with wireless communication antenna coil for data transfer and electric power transmitting antenna coil for transfer of electric power, and non-contact power supply system using same
JP6073098B2 (ja) * 2012-09-27 2017-02-01 シャープ株式会社 フレキシブル配線基板および情報処理装置
KR102036637B1 (ko) * 2012-11-13 2019-10-25 엘지전자 주식회사 Ｎｆｃ용 코일부 및 무선 충전용 코일부를 구비하는 무선 전력 수신장치의 수신코일
US9208982B2 (en) * 2012-12-03 2015-12-08 Broadcom Corporation Systems and methods for distributing power to integrated circuit dies
MX347685B (es) * 2013-01-11 2017-05-09 Koninklijke Philips Nv Transferencia inductiva inalambrica de energia.
JP6102359B2 (ja) * 2013-03-08 2017-03-29 株式会社オートネットワーク技術研究所 電気接続装置
US9680310B2 (en) 2013-03-15 2017-06-13 Thoratec Corporation Integrated implantable TETS housing including fins and coil loops
EP3490102B1 (en) 2013-03-15 2020-08-05 Tc1 Llc Malleable tets coil with improved anatomical fit
JP6159610B2 (ja) * 2013-07-19 2017-07-05 日東電工株式会社 回路基板及びそれを備えた携帯機器
US10613567B2 (en) 2013-08-06 2020-04-07 Bedrock Automation Platforms Inc. Secure power supply for an industrial control system
WO2015067854A1 (en) * 2013-11-08 2015-05-14 Nokia Technologies Oy Arrangement of a communication coil and an induction charging coil
US9855437B2 (en) 2013-11-11 2018-01-02 Tc1 Llc Hinged resonant power transfer coil
JP6521993B2 (ja) 2013-11-11 2019-05-29 ティーシー１ エルエルシー 通信を有する共振電力伝送システム
WO2015070200A1 (en) 2013-11-11 2015-05-14 Thoratec Corporation Resonant power transfer systems with communications
JP2015100232A (ja) * 2013-11-20 2015-05-28 日新電機株式会社 非接触給電システム
JP6474968B2 (ja) * 2013-12-26 2019-02-27 ホシデン株式会社 雄コネクタ、雌コネクタ及び雄コネクタと雌コネクタと接続構造
US10610692B2 (en) 2014-03-06 2020-04-07 Tc1 Llc Electrical connectors for implantable devices
US9621228B2 (en) 2014-08-29 2017-04-11 Freelinc Technologies Spatially aware communications using radio frequency (RF) communications standards
EP3826104B1 (en) 2014-09-22 2023-05-03 Tc1 Llc Antenna designs for communication between a wirelessly powered implant to an external device outside the body
JP2016073059A (ja) * 2014-09-29 2016-05-09 セイコーインスツル株式会社 非接触電力伝送装置、非接触電力伝送装置を搭載した電子機器、非接触電力伝送装置の製造方法
US9583874B2 (en) 2014-10-06 2017-02-28 Thoratec Corporation Multiaxial connector for implantable devices
US20160126639A1 (en) * 2014-10-14 2016-05-05 Samsung Electro-Mechanics Co., Ltd. Coil structure and wireless power receiving apparatus including the same
JP6512799B2 (ja) * 2014-11-27 2019-05-15 キヤノン株式会社 給電装置、制御方法及びプログラム
NL1041080B1 (en) * 2014-12-04 2016-10-11 Univ Delft Tech An inductive power transfer system, a method and a computer program product.
US10164685B2 (en) 2014-12-31 2018-12-25 Freelinc Technologies Inc. Spatially aware wireless network
JP6438773B2 (ja) * 2015-01-13 2018-12-19 ローム株式会社 ワイヤレス受電装置、電子機器、ワイヤレス送電装置からの最大送信電力の検出方法
WO2016166338A1 (en) * 2015-04-16 2016-10-20 Sanofi-Aventis Deutschland Gmbh Sensor and sensor assembly for capacitive determination of a filling level
JP6873971B2 (ja) 2015-07-31 2021-05-19 サノフィ−アベンティス・ドイチュラント・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 薬物送達デバイス用のセンサ
US11007322B2 (en) 2015-07-31 2021-05-18 Sanofi-Aventis Deutschland Gmbh Sensor, cartridge and drug delivery device
DK3328467T3 (da) 2015-07-31 2022-06-20 Sanofi Aventis Deutschland Sensor, patron og lægemiddeladministrationsanordning
EP3328468A1 (en) 2015-07-31 2018-06-06 Sanofi-Aventis Deutschland GmbH Sensor, cartridge and drug delivery device
US10148126B2 (en) 2015-08-31 2018-12-04 Tc1 Llc Wireless energy transfer system and wearables
WO2017062552A1 (en) 2015-10-07 2017-04-13 Tc1 Llc Resonant power transfer systems having efficiency optimization based on receiver impedance
WO2017110273A1 (ja) * 2015-12-21 2017-06-29 ホシデン株式会社 非接触通信モジュール
WO2017111910A1 (en) * 2015-12-21 2017-06-29 Intel Corporation High performance integrated rf passives using dual lithography process
JP6622649B2 (ja) * 2015-12-21 2019-12-18 ホシデン株式会社 非接触通信モジュール
EP3419143B1 (en) * 2016-02-17 2023-10-11 Fuji Corporation Non-contact power supply device
CN109121455B (zh) * 2016-04-06 2020-12-15 株式会社日立制作所 电力转换装置以及电力转换方法
EP3497775B1 (en) 2016-09-21 2022-07-13 Tc1 Llc Systems and methods for locating implanted wireless power transmission devices
US20180131412A1 (en) * 2016-11-10 2018-05-10 Integrated Device Technology, Inc. Methods for increasing data communication bandwidth between wireless power devices
US10571487B2 (en) 2016-11-30 2020-02-25 Formfactor Beaverton, Inc. Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test
JP6485607B2 (ja) * 2016-12-02 2019-03-20 株式会社村田製作所 Ｒｆｉｄタグ
US11197990B2 (en) 2017-01-18 2021-12-14 Tc1 Llc Systems and methods for transcutaneous power transfer using microneedles
US11095137B2 (en) * 2017-03-09 2021-08-17 Amosense Co., Ltd. Wireless power transmission device for vehicle
US10879736B2 (en) * 2017-03-16 2020-12-29 Shenzhen Yichong Wireless Power Technology Co. Ltd Wireless power transfer systems and methods using non-resonant power receiver
CN110521081B (zh) * 2017-03-16 2023-11-10 成都市易冲半导体有限公司 使用非谐振电能接收器的无线电能传输系统和方法
US20180269710A1 (en) * 2017-03-16 2018-09-20 Shenzhen Yichong Wireless Power Technology Co. Ltd. Power transmitter coil in wireless charging system
JP6755212B2 (ja) * 2017-03-24 2020-09-16 株式会社豊田中央研究所 スイッチ回路
JP6834698B2 (ja) * 2017-03-31 2021-02-24 Tdk株式会社 磁気結合装置およびこれを用いたワイヤレス電力伝送システム
US10686336B2 (en) 2017-05-30 2020-06-16 Wireless Advanced Vehicle Electrification, Inc. Single feed multi-pad wireless charging
WO2019135890A1 (en) 2018-01-04 2019-07-11 Tc1 Llc Systems and methods for elastic wireless power transmission devices
KR102330968B1 (ko) * 2018-01-15 2021-12-01 도판 인사츠 가부시키가이샤 전자 기기
TWI741129B (zh) * 2018-01-16 2021-10-01 日商凸版印刷股份有限公司 電子機器
US11462943B2 (en) 2018-01-30 2022-10-04 Wireless Advanced Vehicle Electrification, Llc DC link charging of capacitor in a wireless power transfer pad
JP7027962B2 (ja) * 2018-03-02 2022-03-02 三菱電機株式会社 照明器具
EP3611820A1 (en) 2018-08-15 2020-02-19 Koninklijke Philips N.V. Device and method for wireless power transfer
KR102645042B1 (ko) * 2018-09-14 2024-03-08 현대자동차주식회사 가변구조형 전자파차폐필터와 이를 구비한 차량용 무선충전기 및 그 제어방법
EP3849095B1 (en) * 2018-10-10 2024-04-17 Siemens Aktiengesellschaft System and modules for communication
DE102019106716A1 (de) * 2019-03-15 2020-09-17 Balluff Gmbh Vorrichtung zur induktiven Übertragung von elektrischer Energie und/oder von Daten und Verfahren zur Herstellung einer solchen Vorrichtung
DE102019211399A1 (de) * 2019-07-31 2021-02-04 Würth Elektronik eiSos Gmbh & Co. KG Spulen-Anordnung und Vorrichtung zur drahtlosen elektromagnetischen Energieübertragung
KR20220135780A (ko) * 2021-03-31 2022-10-07 삼성전자주식회사 무선 전력 수신, 무선 통신, 및 전기 자극을 수행하는 장치 및 방법

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567219B2 (ja) * 1985-07-03 1996-12-25 日本エルエスアイカード 株式会社 非接触方式による記憶基板とリ−ド・ライト装置間の書込み・読取り方法
DK0509125T3 (da) * 1991-04-19 1995-05-29 Siemens Ag Indretning til kontaktløs data- og energitransmission samt fremgangsmåde til betjening heraf
US5229652A (en) * 1992-04-20 1993-07-20 Hough Wayne E Non-contact data and power connector for computer based modules
US5434396A (en) * 1992-11-10 1995-07-18 Xicor Inc. Wireless powering and communication system for communicating data between a host system and a stand-alone device
JPH0766060A (ja) * 1993-08-25 1995-03-10 Tdk Corp ロータリートランス
JPH08241386A (ja) * 1995-03-03 1996-09-17 Hitachi Maxell Ltd 非接触メモリカード及びこれに搭載可能な電磁結合装置
JPH10106867A (ja) * 1996-08-07 1998-04-24 Sumitomo Wiring Syst Ltd 電気自動車用充電システム
EP0982832A3 (en) * 1996-08-07 2000-08-09 Sumitomo Wiring Systems, Ltd. Charging system for electric vehicle
US6210771B1 (en) * 1997-09-24 2001-04-03 Massachusetts Institute Of Technology Electrically active textiles and articles made therefrom
GB2337675B (en) * 1998-05-22 2001-04-11 Schlumberger Ltd Oil well monitoring and control system communication network
US6239879B1 (en) * 1998-07-29 2001-05-29 Hewlett-Packard Company Non-contacting communication and power interface between a printing engine and peripheral systems attached to replaceable printer component
JP2000276562A (ja) * 1999-03-23 2000-10-06 Oki Electric Ind Co Ltd 非接触データ転送装置及びメモリカード
JP2001033136A (ja) 1999-07-19 2001-02-09 Sharp Corp 冷蔵庫
AU2000251049A1 (en) * 2000-06-02 2001-12-17 Yamatake Corporation Electromagnetic induction coupling apparatus
JP3488869B2 (ja) * 2001-03-16 2004-01-19 Ｔｄｋ株式会社 平面コイルおよび平面トランス
US6847284B2 (en) * 2001-03-05 2005-01-25 Tdk Corporation Planar coil and planar transformer
JP2004088851A (ja) 2002-08-23 2004-03-18 Toritsu Tsushin Kogyo Kk 電源装置
WO2004088851A1 (ja) * 2003-03-31 2004-10-14 Fujitsu Limited 信号伝送方法
JP4131544B2 (ja) * 2004-02-13 2008-08-13 学校法人慶應義塾 電子回路
JP2005260122A (ja) * 2004-03-15 2005-09-22 Dainippon Printing Co Ltd 非接触電力伝送モジュール
JP2006173986A (ja) * 2004-12-15 2006-06-29 Keio Gijuku 電子回路
JP4972306B2 (ja) * 2004-12-21 2012-07-11 オンセミコンダクター・トレーディング・リミテッド 半導体装置及び回路装置
CA2511051A1 (en) * 2005-06-28 2006-12-29 Roger J. Soar Contactless battery charging apparel
EP1885019A1 (en) * 2006-07-24 2008-02-06 Schott Advanced Packaging Singapore Te. Ltd. A method of fabricating a 3D RFID antenna and device manufactured therewith
JP4014217B2 (ja) 2006-08-07 2007-11-28 ソニー・エリクソン・モバイルコミュニケーションズ株式会社 携帯通信端末
KR100836634B1 (ko) * 2006-10-24 2008-06-10 주식회사 한림포스텍 무선 데이타 통신과 전력 전송이 가능한 무접점 충전장치,충전용 배터리팩 및 무접점 충전장치를 이용한 휴대용단말기

Also Published As

Publication number Publication date
AU2009250645A1 (en) 2009-11-26
EP2284849B1 (en) 2018-07-25
EP3285271A1 (en) 2018-02-21
EP3285271B1 (en) 2019-08-21
JP4698702B2 (ja) 2011-06-08
WO2009142053A1 (ja) 2009-11-26
CN102037526B (zh) 2012-11-28
JP2009284657A (ja) 2009-12-03
EP2284849A4 (en) 2017-06-21
EP2284849A1 (en) 2011-02-16
CN102037526A (zh) 2011-04-27
US20110043050A1 (en) 2011-02-24
US8643219B2 (en) 2014-02-04
EP3273455B1 (en) 2019-08-28
EP3273455A1 (en) 2018-01-24
AU2009250645B2 (en) 2013-02-21

Similar Documents

Publication Publication Date Title
HK1152144A1 (en) Electronic device and method for connecting electronic circuit board
EP2227076A4 (en) MULTILAYER CONDUCTOR PLATE, METHOD FOR THE PRODUCTION THEREOF AND COMMUNICATION DEVICE
EP2381748A4 (en) PCB AND METHOD FOR THE PRODUCTION THEREOF
EP2357877A4 (en) PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
GB0805021D0 (en) Apparatus and method for electronic circuit manufacture
TWI341167B (en) Printed circuit board unit and electronic apparatus
EP2232592A4 (en) OVERMOLDED CIRCUIT BOARD AND METHOD
HK1158431A1 (zh) 種電路板組件和電路板
EP2538499A4 (en) SOCKET, PCB AND ELECTRONIC DEVICE
HK1158386A1 (en) Electronic device and integrated circuit utilized therein
TWI341706B (en) Circuit board and manufacture method thereof
EP2280594A4 (en) PCB AND METHOD FOR THE PRODUCTION THEREOF
EP2259666A4 (en) PRINTED CIRCUIT BOARD COMPRISING INTEGRATED ELECTRONIC COMPONENTS, AND METHOD FOR MANUFACTURING THE SAME
EP2153706A4 (en) ELECTRONIC SWITCHING DEVICE
EP2007180A4 (en) PCB, ELECTRONIC CIRCUIT ARRANGEMENT AND DISPLAY
TWI365391B (en) Circuit layout method and layout circuit
EP2248400A4 (en) METHOD FOR CONNECTING A FLEXIBLE CONDUCTOR PLATE AND ELECTRONIC ARRANGEMENT OBTAINED THEREFROM
EP2436723A4 (en) METHOD FOR MANUFACTURING PRE-PRINTED PRINTED CIRCUIT BOARD AND DEVICE FOR MANUFACTURING PRE-PRINTED PRINTED CIRCUIT BOARD
EP2046105A4 (en) PCB AND PORTABLE ELECTRONIC DEVICE
TWI371998B (en) Printed circuit board structure and method for manufacturing the same
EP2302083A4 (en) ELECTRONIC COMPONENT WELDING APPARATUS AND ELECTRONIC COMPONENT WELDING METHOD
EP2128736A4 (en) ELECTRONIC CIRCUIT ARRANGEMENT
EP2184960A4 (en) CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
TWI373293B (en) Printed circuit board and fabrication method thereof
EP2044820A4 (en) CONDUCTIVE TERMINAL BONDING METHOD AND PRINTED CIRCUIT BOARD

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200315