WO2017110273A1 - 非接触通信モジュール - Google Patents
非接触通信モジュール Download PDFInfo
- Publication number
- WO2017110273A1 WO2017110273A1 PCT/JP2016/083078 JP2016083078W WO2017110273A1 WO 2017110273 A1 WO2017110273 A1 WO 2017110273A1 JP 2016083078 W JP2016083078 W JP 2016083078W WO 2017110273 A1 WO2017110273 A1 WO 2017110273A1
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- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- communication module
- semiconductor component
- internal connection
- substrate
- Prior art date
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- 238000004891 communication Methods 0.000 title claims abstract description 252
- 239000004065 semiconductor Substances 0.000 claims abstract description 267
- 239000000758 substrate Substances 0.000 claims abstract description 247
- 230000004308 accommodation Effects 0.000 claims description 72
- 239000002184 metal Substances 0.000 claims description 64
- 239000004020 conductor Substances 0.000 claims description 61
- 239000011347 resin Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 238000007747 plating Methods 0.000 description 60
- 239000003054 catalyst Substances 0.000 description 46
- 238000000034 method Methods 0.000 description 31
- 239000007787 solid Substances 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 13
- 230000005672 electromagnetic field Effects 0.000 description 13
- 239000012466 permeate Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 11
- 238000000465 moulding Methods 0.000 description 7
- 150000004696 coordination complex Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H04B5/48—
Definitions
- the present invention relates to a contactless communication module for performing contactless communication.
- Non-contact communication greatly varies in communication accuracy depending on the design of an electric circuit for communication including a semiconductor chip and an antenna.
- the communication speed of non-contact communication is increased, the influence of the inductance (L) and / or capacitor (C) components of the antenna and the like on the signal quality (signal integrity) becomes obvious.
- Design difficulty increases. For this reason, it is difficult to design an electric circuit for non-contact communication and an electric circuit for main functions of an electronic device on the same substrate of the electronic device. In view of this, it is considered to modularize a contactless credit electric circuit and mount the module on a substrate of an electronic device.
- This non-contact communication module includes a semiconductor chip, an antenna, an island part, a plurality of lead terminals, and a resin base.
- the antenna has a configuration capable of contactless communication between the antenna and the antenna of the counterpart communication device.
- the semiconductor chip has an element for allowing the antenna to communicate in a contactless manner.
- the semiconductor chip is mounted on the island portion, and is connected to one end portions of the antenna and the lead terminal by a plurality of wires.
- the resin substrate has a rectangular shape, and has an upper surface, a lower surface, and four side surfaces. One end portions of the semiconductor chip, the antenna, and the lead terminal are sealed in the resin base. The remaining portion of the lead terminal protrudes from the side surface of the resin base.
- the non-contact communication module communication is performed in a non-contact manner between the antenna of the non-contact communication module and the counterpart communication device in a state where the counterpart communication device is disposed above the upper surface of the resin base.
- the antenna of the non-contact communication module is located on the same plane as the island part and below the semiconductor chip on the island part. That is, since the antenna is located far from the upper surface (communication area) of the resin base and the distance between the antenna and the antenna of the counterpart communication device is increased, the communication accuracy of the non-contact communication module is deteriorated.
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a non-contact communication module capable of improving communication accuracy.
- a non-contact communication module includes a base made of an insulating resin, an antenna, a semiconductor component, an internal connection portion, and an external connection portion.
- the counterpart communication device may be arranged at a short distance on one side of the base in the first direction.
- the antenna is provided on the base body at the first height position in the first direction so that the antenna can communicate with the counterpart communication device in a non-contact manner.
- the semiconductor component is used for non-contact communication with the antenna, and is provided on the base body at the first height position or the second height position.
- the second height position is the other position in the first direction than the first height position.
- the internal connection part electrically connects the antenna and the semiconductor component.
- the external connection part has a first part and a second part. The first part is provided on the base and is electrically connected to the semiconductor component. The second part protrudes or is exposed outside the substrate.
- Such a non-contact communication module can improve the communication accuracy. Since the antenna is disposed at the same height position as the semiconductor component or at one side in the first direction relative to the semiconductor component, the antenna and the counterpart communication device disposed at a short distance on one side in the first direction of the base body. This is because the distance in one direction is shortened.
- the antenna can be configured to be provided at the first height position in the base body.
- the semiconductor component can be configured to be provided in the base at the first height position or the second height position.
- the first part of the external connection part can be configured to be provided in the base. In the case of such a non-contact communication module, since the antenna and the semiconductor component are provided in the base, they are protected by the base.
- the internal connection portion may be a metal plate, a lead wire, a cable, or a conductive wire connecting the antenna and the semiconductor component and provided in the base.
- the internal connection portion is configured to be bent or curved so that the antenna is located at the first height position in the base and the semiconductor component is located at the second height position in the base. Is possible.
- the antenna can be easily disposed at the first height position and the semiconductor component can be easily disposed at the second position simply by bending or bending the internal connection portion.
- the antenna and the internal connection part are made of a single metal plate and can be provided in the base.
- the internal connection portion may be configured to be bent or curved so that the antenna is positioned at a first height position in the base and the semiconductor component is positioned at a second height position in the base. .
- the antenna can be easily disposed at the first height position and the semiconductor component can be easily disposed at the second position simply by bending or bending the internal connection portion.
- the non-contact communication module may further include a first substrate.
- the first substrate is a flexible substrate or a rigid flexible substrate, and can be configured to have an internal connection portion.
- the internal connection portion can be configured to be provided in the base.
- the internal connection part includes a first part provided with an antenna, a second part electrically connected to the semiconductor component, and an intermediate part between the first part and the second part of the internal connection part. Is possible.
- the intermediate portion may have a curved configuration such that the antenna is located at a first height position in the base and the semiconductor component is located at a second height position in the base. In the case of the non-contact communication module having such an aspect, the antenna can be easily disposed at the first height position and the semiconductor component can be easily disposed at the second position simply by bending the intermediate portion of the internal connection portion.
- the first substrate may further include an external connection portion.
- the non-contact communication module of such an aspect has a reduced number of parts. This is because the first substrate has an internal connection portion and an external connection portion.
- the antenna and the internal connection portion may be configured by a single metal plate extending in the second direction orthogonal to the first direction and provided in the base body.
- the semiconductor component can be configured to be connected to the internal connection portion on the other side in the first direction from the internal connection portion. In the case of the non-contact communication module of such an embodiment, the semiconductor component is simply connected to the internal connection portion on the other side in the first direction from the internal connection portion, and the semiconductor component is moved to the first height position. It can be easily arranged in the second position.
- the non-contact communication module may further include a second substrate extending in a second direction orthogonal to the first direction.
- the second substrate can be configured to have an internal connection provided in the base.
- the internal connection portion may be configured to have a first surface on one side in the first direction and a second surface on the other side in the first direction.
- the antenna can be configured to be provided on the first surface of the internal connection portion.
- the semiconductor component can be configured to be mounted on the second surface of the internal connection portion or connected to the internal connection portion on the other side in the first direction from the second surface of the internal connection portion. .
- the semiconductor component is mounted on the second surface of the internal connection portion or connected to the internal connection portion on the other side in the first direction from the second surface of the internal connection portion.
- the antenna can be easily arranged at the first height position and the semiconductor component can be easily arranged at the second position.
- the second substrate may further include an external connection part.
- the non-contact communication module of such an aspect has a reduced number of parts. This is because the second substrate has an internal connection portion and an external connection portion.
- the non-contact communication module can further include a third substrate.
- the third substrate can be a mounting substrate that is provided at least partially in the base and on which the semiconductor component is mounted.
- the internal connection portion may be configured to be connected to the third substrate and connected to the semiconductor component via the third substrate.
- the third substrate can be configured to have an external connection portion.
- the base can have a structure having a receiving hole opened outside the base.
- the internal connection portion can be configured to have a protruding portion disposed in the accommodation hole.
- the first part of the external connection part can be configured to have a protruding part arranged in the accommodation hole.
- the semiconductor component may be housed in the housing hole and electrically connected to the projecting portion of the internal connection portion and the projecting portion of the first portion of the external connection portion in the housing hole.
- the non-contact communication module of such an aspect improves the versatility. Insert a semiconductor component appropriately selected according to the application (for reception or transmission), function (communication speed or communication distance), etc. of the non-contact communication module into the accommodation hole, and connect the protruding part of the internal connection part and the external connection part. This is because the application and function of the non-contact communication module can be changed simply by electrically connecting to the protruding portion of the first part.
- the base body may further include a first protective part.
- the first protection part is a wall of the accommodation hole and can be configured to surround the semiconductor component in the accommodation hole. In the case of such a non-contact communication module, the semiconductor component in the accommodation hole is surrounded and protected by the first protection part.
- the base body may have a first outer surface located at the first height position.
- the antenna can be configured to be provided on the first outer surface.
- the semiconductor component can be configured to be mounted on the first outer surface.
- the base body may further include a second outer surface located at the second height position.
- the semiconductor component can be configured to be mounted not on the first outer surface but on the second outer surface.
- the base body may further include a third outer surface extending from the first outer surface to the second outer surface.
- the antenna can be a metal film formed on the first outer surface.
- the internal connection portion can be a metal film formed on at least the second outer surface and the third outer surface so as to be continuous with the antenna.
- the semiconductor component can be configured to be directly connected to the internal connection portion on the second outer surface.
- the antenna and the internal connection portion can be easily formed on the substrate by a printing method, a photolithography method, or the like.
- the internal connection portion can be a metal film formed on at least the second outer surface and the third outer surface so as to be connected to the antenna.
- the antenna is preferably made of a material other than the metal film.
- the external connection portion can be composed of a metal film formed on at least the second outer surface of the base.
- the first part of the external connection part is located on the second outer surface of the base body.
- the semiconductor component may be configured to be directly connected to the internal connection portion on the second outer surface and the first portion of the external connection portion.
- the external connection portion is easily formed on the second outer surface of the substrate by a printing method, a photolithography method, or the like.
- the mounting of semiconductor components is further simplified. This is because the semiconductor component can be connected to both the internal connection portion and the external connection portion on the second outer surface.
- the metal film may include a plating film.
- the base body may be configured to further include at least one second protection part.
- the second protection part may be configured to extend from the second outer surface in the first direction and to be disposed around the semiconductor component. In the case of such a non-contact communication module, the semiconductor component is protected by the second protection portion around the semiconductor component.
- the base body may further include at least one third protection unit.
- the third protection portion can be configured to extend from the third outer surface along the second outer surface and to be disposed around the semiconductor component. In the case of such a non-contact communication module, the semiconductor component is protected by the third protection portion around the semiconductor component.
- External connection can be a terminal, pin, lead wire or cable.
- the non-contact communication module can further include a first conductor.
- the first conductor can be arranged on the other side in the first direction with respect to the antenna.
- the first conductor shields a signal leaking from the other in the first direction rather than the first conductor, so that the signal may affect the antenna. Reduced.
- the non-contact communication module can further include a second conductor.
- the second conductor can be arranged on one side of the antenna in the first direction and connected to the ground.
- the second conductor can be configured to have an opening.
- the opening may be configured to be located on one side in the first direction with respect to at least a part of the antenna. The communication accuracy of the non-contact communication module having such a configuration is further improved.
- FIG. 8B is a schematic 8B-8B end view of the base of the non-contact communication module in FIG. 8A, exaggeratingly illustrating the metal complex in the base.
- the non-contact communication module M1 (hereinafter also referred to as module M1) according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1A to 2B.
- the module M1 can communicate with a counterpart communication device (not shown) in a contactless manner.
- the Z-Z ′ direction shown in FIGS. 1A to 1D is the thickness direction of the module M1 and corresponds to the first direction of the claims.
- the Z direction corresponds to one of the first directions
- the Z ′ direction corresponds to the other of the first directions.
- 1A to 1D is the longitudinal direction of the module M1 and corresponds to the second direction of the claims.
- the Y-Y ′ direction is orthogonal to the Z-Z ′ direction.
- the direction X-X ′ shown in FIGS. 1A to 1C is the short direction of the module M1.
- the X-X ′ direction is orthogonal to the Z-Z ′ direction and the Y-Y ′ direction.
- the module M1 includes a base body 100 (package), at least one antenna 200, at least one semiconductor component 300, at least one internal connection portion 400, and at least one external connection portion 500.
- the substrate 100 is a solid block made of insulating resin or a case made of insulating resin.
- the base body 100 can be a polygonal solid, a cylinder, a sphere, a hemisphere, a solid having an arc-shaped cross section, or the like.
- the base body 100 has a first outer surface 101 in the Z direction and a second outer surface 102 in the Z ′ direction.
- the first outer surface 101 has a communication area.
- the counterpart communication device can be arranged at a short distance on the Z direction side of the communication area of the base body 100.
- the second outer surface 102 can be, for example, a surface (mounting surface) that can be mounted on a substrate or the like of an electronic device (not shown) or a surface (fixed surface) that can be fixed to a frame or the like of the electronic device. It is not limited to.
- the base body 100 may further include at least one accommodation hole 110.
- the accommodation hole 110 may be a bottomed hole provided in the first outer surface 101 so as to open in the Z direction and extending in the Z-Z ′ direction.
- the accommodation hole 110 may be a bottomed hole provided in the second outer surface 102 so as to open in the Z ′ direction and extending in the Z-Z ′ direction.
- the accommodation hole 110 may be a through-hole that extends in the Z-Z ′ direction from the first outer surface 101 to the second outer surface 102 and opens in the Z direction and the Z ′ direction.
- the base body 100 is a rectangular solid block made of insulating resin, and has a receiving hole 110 that penetrates the base body 100 from the first outer surface 101 to the second outer surface 102. Note that the accommodation hole 110 can be omitted.
- At least one antenna 200 has a configuration capable of contactless communication with the counterpart communication device.
- the antenna 200 is configured to be capable of non-contact communication with a counterpart communication device using a communication method such as an electromagnetic coupling method, a magnetic field coupling method, UWB (Ultra Wide Band), wireless LAN, or Bluetooth (registered trademark).
- a communication method such as an electromagnetic coupling method, a magnetic field coupling method, UWB (Ultra Wide Band), wireless LAN, or Bluetooth (registered trademark).
- “Contactless communication” and “contactless communication” in the present invention are concepts including proximity contactless communication, ultra-wideband wireless communication, and narrowband wireless communication.
- Proximity contactless communication is broadband communication that uses a rectangular wave signal Crosstalk generated by high-speed Rise / Fall Time (high-frequency component), and is employed in an electromagnetic field coupling method or a magnetic field coupling method.
- Ultra-wideband wireless communication is wireless communication that uses a bandwidth of 500 MHz or more, and is adopted by UWB and the like.
- Narrowband wireless communication is (narrowband) wireless communication using modulated radio waves, and is adopted in a wireless LAN or Bluetooth (registered trademark).
- the “contactless communication” and “contactless communication” of the present invention are not limited to any communication method as long as the antenna of the present invention and the antenna of the counterpart communication device perform wireless communication without contact.
- the communication distance in the ZZ ′ direction from the antenna 200 to the counterpart communication device can be about 0 to several mm. It is.
- the antenna 200 has a configuration capable of contactless communication using a communication method such as a wireless LAN or Bluetooth (registered trademark)
- the communication distance from the antenna 200 to the counterpart communication device can be 0 to several tens of meters.
- the communication distance from antenna 200 to the counterpart communication device is arbitrarily set according to the communication method of antenna 200. Even if the communication distance from the antenna 200 to the counterpart communication device is zero, the antenna 200 and the antenna of the counterpart communication device are not in contact with each other.
- a signal received or transmitted by the antenna 200 can be transmitted at a wide bit rate from a low speed of 1 Kbps to a high speed of 10 Gbps or more. .
- the bit rate when the signal is a high-speed signal is approximately 1 Gbps or more.
- the antenna 200 has a configuration capable of non-contact communication using a communication method such as a wireless LAN or Bluetooth (registered trademark)
- the frequency of a signal received or transmitted by the antenna 200 can be 2.4 GHz or 5 GHz. It is.
- the speed of the signal received or transmitted by the antenna 200 can be arbitrarily set according to the communication method.
- the antenna 200 may be either a reception antenna or a transmission antenna.
- the at least one antenna 200 can be composed of a metal plate, a coil, a conductor, or the like.
- the antenna 200 has a configuration capable of non-contact communication using an electromagnetic field coupling method, it is preferable to increase the external dimensions of at least a part of the antenna 200 so that the area of the antenna 200 facing the antenna of the counterpart communication device is increased.
- the antenna 200 is preferably in a loop shape. Note that the shape of the antenna 200 can be changed as appropriate according to the communication method.
- the antenna 200 is disposed at a first height position in the Z-Z ′ direction in the base body 100 so as to be able to communicate with the counterpart communication device in a non-contact manner.
- the antenna 200 is disposed on the Z ′ direction side of the communication area of the base body 100.
- the antenna 200 is sealed in the base body 100 at the first height position.
- the antenna 200 is insert-molded in the base body 100 so as to be positioned at the first height position.
- the antenna 200 is accommodated in the base body 100 so as to be positioned at the first height position.
- any one of the following 1) to 3) is possible.
- the antenna 200 is held on the bottom or wall of the base body 100.
- the antenna 200 is supported by a support portion provided in the base body 100.
- the antenna 200 is supported by at least one internal connection part 400 in the base body 100.
- a plurality of antennas 200 can be provided.
- all of the plurality of antennas 200 may be reception antennas, all of the plurality of antennas 200 may be transmission antennas, or at least one of the plurality of antennas 200 is a reception antenna and the rest is transmission.
- An antenna may be used.
- At least one semiconductor component 300 is a semiconductor device packaged with a semiconductor element, a semiconductor chip, or an insulating resin for causing the antenna 200 to perform contactless communication (receive a signal without contact or transmit a signal without contact). It is.
- the semiconductor component 300 can be a comparator having hysteresis characteristics.
- the semiconductor component 300 can be a Redriver that controls the rise time (Rise Time) of a signal transmitted to the antenna 200.
- the semiconductor component 300 may be appropriately configured depending on the communication method and whether the semiconductor component 300 is for causing the antenna 200 to receive or transmit a signal.
- the semiconductor component 300 has at least one first and second connection portion.
- the first and second connection portions of the semiconductor component 300 are electrodes or pins.
- the at least one semiconductor component 300 is disposed in the base body 100 at the first height position or the second height position. More specifically, the end surface of the semiconductor component 300 in the Z ′ direction is disposed in the base body 100 at the first height position or the second height position.
- the second height position is located closer to the Z ′ direction than the first height position.
- the second height position is such that the antenna 200 located at the first height position is located on the Z direction side with respect to the end surface in the Z direction of the semiconductor component 300 located at the second height position. You may be located in the Z 'direction side rather than a height position.
- the base body 100 is a solid block and does not have the accommodating hole 110
- the semiconductor component 300 is sealed in the base body 100 at the first height position or the second height position.
- the semiconductor component 300 is insert-molded in the base body 100 so as to be located at the first height position or the second height position.
- the semiconductor component 300 is accommodated in the base body 100 so as to be positioned at the first height position or the second height position. In this case, any one of the following 1) to 3) is possible. 1) The semiconductor component 300 is held on the bottom or wall of the base body 100. 2) The semiconductor component 300 is supported by a support portion provided in the base body 100. 3) The semiconductor component 300 is supported by at least one of the at least one internal connection part 400 and the at least one external connection part 500.
- the semiconductor component 300 When the housing hole 110 is provided in the base body 100, the semiconductor component 300 is housed in the housing hole 110 of the base body 100 so as to be positioned at the first height position or the second height position.
- the semiconductor component 300 may be supported on the bottom of the accommodation hole 110 that is a bottomed hole, or the semiconductor component 300 may be supported hollowly in the accommodation hole 110.
- the semiconductor component 300 is hollow in the protruding portion 420 protruding into the receiving hole 110 of the at least one internal connection portion 400 and / or the protruding portion 511 protruding into the receiving hole 110 of the at least one external connection portion 500. It may be supported.
- the semiconductor component 300 is surrounded by the first protection part 110 a that is an annular wall of the accommodation hole 110.
- the semiconductor component 300 in the accommodation hole 110 is protected by the first protection part 110a.
- the dimension of the first protection part 110a in the Z-Z ′ direction is preferably larger than the dimension of the semiconductor component 300 supported in the accommodation hole 110 in the Z-Z ′ direction.
- the dimension in the Z-Z ′ direction of the first protection part 110 a may be substantially the same as or smaller than the dimension in the Z-Z ′ direction of the semiconductor component 300 supported in the accommodation hole 110.
- the at least one internal connection part 400 may be anything that electrically connects the antenna 200 and the semiconductor component 300.
- the internal connection unit 400 can be configured with, for example, a terminal, a pin, a lead wire, a cable, or a conductive wire.
- the internal connection part 400 may be directly connected to the antenna 200, or may be indirectly connected via an intermediate member having conductivity.
- the antenna 200 and the internal connection part 400 may be comprised integrally.
- the antenna 200 and the internal connection part 400 may be configured by a single metal plate (for example, a lead frame).
- the internal connection part 400 may be directly connected to the first connection part of the semiconductor component 300, or may be indirectly connected via an intermediate member having conductivity.
- the internal connection portion 400 can have a shape (for example, an engagement hole or an engagement recess) corresponding to the first connection portion of the semiconductor component 300.
- the intermediate member is a terminal, a pin, a lead wire, a cable, a conductive wire, or the like.
- At least one internal connection part 400 is arranged in the base body 100.
- the internal connection portion 400 is sealed in the base body 100.
- the internal connection part 400 is insert-molded in the base body 100.
- the base body 100 is a case, the internal connection portion 400 is accommodated in the base body 100.
- the internal connection part 400 has an embedded part 410 and a protruding part 420.
- the embedded portion 410 of the internal connection portion 400 is sealed in the base body 100.
- the embedded portion 410 of the internal connection portion 400 is insert-molded in the base body 100.
- the protruding portion 420 of the internal connection portion 400 protrudes into the accommodation hole 110 and is directly or indirectly connected to the first connection portion of the semiconductor component 300 as described above.
- the at least one internal connection part 400 may be configured to extend in a direction including the orthogonal component so that the antenna 200 is located away from the semiconductor component 300 in the direction including the orthogonal component.
- the antenna 200 is not positioned on the Z direction side of the semiconductor component 300, and the antenna 200 is arranged away from the semiconductor component 300 in a direction including a component in the orthogonal direction, or the antenna 200 is orthogonal to the semiconductor component 300.
- the orthogonal direction may be a direction orthogonal to the ZZ ′ direction, the YY ′ direction, the XX ′ direction, the YY ′ direction, and the X ⁇ direction.
- the direction may be other than the X ′ direction.
- the internal connection portion 400 is bent so that the antenna 200 is located at the first height position and the semiconductor component 300 is located at the second height position. Is curved or curved.
- the internal connection unit 400 can be plural.
- a plurality of internal connection portions 400 can be configured to electrically connect one antenna 200 and one semiconductor component 300.
- each internal connection portion 400 may electrically connect each antenna 200 and each semiconductor component 300, or a plurality of internal connection portions 400 may be connected to each antenna. 200 and each semiconductor component 300 may be electrically connected.
- the antenna 200 and the pair of internal connection portions 400 are formed of a single metal plate.
- the embedded portions 410 of the pair of internal connection portions 400 are integrally connected to both ends of the antenna 200.
- the embedded portion 410 of the antenna 200 and the pair of internal connection portions 400 is sealed in the base body 100.
- the protrusions 420 of the pair of internal connection parts 400 protrude into the accommodation holes 110 of the base body 100 and are connected to the first connection parts of the semiconductor component 300.
- the pair of internal connection portions 400 extend in a direction including components in the YY ′ direction (orthogonal direction), the antenna 200 is located at the first height position, and the semiconductor component 300 is located at the second height position. It is bent so that it is located.
- the semiconductor component 300 is connected to the internal connection portion 400 upward in the drawing, but is internally connected downward in the drawing (so as to be located on the Z ′ direction side from the internal connection portion 400).
- the unit 400 may be connected. This is also applicable when the base body 100 is a solid block without the case or the accommodation hole 110. In this case, the end surface of the semiconductor component 300 in the Z direction is located at the second height position.
- the at least one external connection unit 500 can be configured by terminals, pins, lead wires, or cables for externally connecting the module M1.
- the external connection unit 500 is partially held by the base body 100.
- the external connection unit 500 includes a first part 510 and a second part 520.
- the first part 510 may be directly connected to the second connection part of the semiconductor component 300, or may be indirectly connected via an intermediate member having conductivity.
- the first portion 510 can have a shape (for example, an engagement hole or an engagement recess) corresponding to the second connection portion of the semiconductor component 300.
- the intermediate member is a terminal, a pin, a lead wire, a cable, a conductive wire, or the like.
- the first part 510 is disposed in the base body 100.
- the base body 100 is a solid block and does not have the accommodation hole 110
- the first portion 510 is sealed in the base body 100.
- the first portion 510 is insert-molded in the base body 100.
- the base body 100 is a case
- the first part 510 is disposed in the base body 100.
- the housing hole 110 is provided in the base body 100
- the first part 510 has a buried part and a protruding part 511.
- the embedded portion of the first portion 510 is sealed in the base body 100.
- the embedded portion of the first portion 510 is insert-molded in the base body 100.
- the protruding portion 511 of the first portion 510 protrudes into the accommodation hole 110 and is directly or indirectly connected to the second connecting portion of the semiconductor component 300 as described above.
- the second part 520 is disposed outside the base body 100.
- the second part 520 can be connected to the substrate of the electronic device.
- the second part 520 is preferably exposed or protrudes from the second outer surface 102 or the side surface of the base body 100 to the outside of the base body 100.
- a plurality of external connection units 500 can be provided.
- a plurality of external connection portions 500 may be connected to a plurality of second connection portions of one semiconductor component 300, respectively.
- the first portion 510 of each external connection portion 500 may be connected to one second connection portion of each semiconductor component 300, or the first portion of the plurality of external connection portions 500.
- 510 may be connected to the plurality of second connection portions of the plurality of semiconductor components 300.
- the plurality of external connection units 500 may include external connection units for signal transmission, ground, and / or registers.
- the embedded portion of the first portion 510 of the plurality of external connection portions 500 is sealed in the base body 100, and the protruding portion 511 of the first portion 510 is one semiconductor component 300 in the accommodation hole 110.
- the second portion 520 of the external connection unit 500 protrudes outside the base body 100 from the side surface in the Y ′ direction, the side surface in the X direction, and the side surface in the X ′ direction of the base body 100.
- the pair of external connection units 500a is for signal transmission
- the other external connection units 500 are for ground and for registers.
- the module M1 may further include at least one island portion 600.
- At least one island part 600 is hollowly supported by the external connection part 500 in the base body 100 as a case or in the accommodation hole 110 of the base body 100.
- the island part 600 supports the semiconductor component 300 placed thereon in a hollow manner.
- the semiconductor component 300 may be connected to the ground external connection portion 500 via the island portion 600.
- the island part 600 can be omitted.
- the island portion 600 is hollowly supported in the accommodation hole 110 of the base body 100 by a plurality of external connection portions 500.
- the semiconductor component 300 is hollowly supported in the accommodation hole 110 by the island portion 600, the protruding portion 420 of the internal connection portion 400, and the protruding portion 511 of the external connection portion 500.
- the module M1 may further include a first conductor S.
- the 1st conductor S is comprised by the resin plate etc. by which the metal was vapor-deposited on the metal plate and the outer surface.
- the first conductor S is disposed on the Z ′ direction side of the antenna 200 in the base body 100.
- the base body 100 is a solid block, the first conductor S may be held in a holding hole provided in the base body 100 so as to be positioned on the Z ′ direction side of the antenna 200 or inside the base body 100. (It may be insert-molded). In FIG. 1 to FIG. 2B, the former.
- the base body 100 is a case, the first conductor S is accommodated in the base body 100 so as to be positioned on the Z ′ direction side of the antenna 200.
- the first conductor S In a state where the module M1 is mounted on the substrate of the electronic device, the first conductor S is positioned between the antenna 200 and the substrate of the electronic device. Since the first conductor S blocks a signal leaking from the substrate of the electronic device (a signal leaking from the other of the first direction with respect to the first conductor S), the signal may affect the antenna 200. Is reduced. Note that the first conductor S may be grounded. In this case, the first conductor S may be connected to the ground external connection portion 500. The first conductor S can be omitted.
- the module M1 is as follows.
- the base body 100 is a solid block having an accommodation hole 110.
- the antenna 200 and the pair of internal connection portions 400 are configured by a single metal plate.
- the pair of internal connection portions 400 are made of a metal plate, and the embedded portions of the pair of internal connection portions 400 are directly connected to the antenna 200.
- the antenna 200 and the internal connection unit 400 described above are prepared, and a plurality of external connection units 500 and island units 600 are prepared. Thereafter, a mold (not shown) is clamped, and the antenna 200, the internal connection part 400, the first part 510 of the external connection part 500, and the island part 600 are arranged in the cavity of the mold. In the mold clamping process, the antenna 200 is disposed at a position corresponding to the first height position in the cavity, the protruding portion 420 of the internal connecting portion 400 and the protruding portion of the first portion 510 of the external connecting portion 500.
- the second portion 520 of the external connection portion 500 is accommodated in the accommodation hole of the mold, and the protrusion of the mold is the protrusion 420 of the internal connection portion 400, the external connection portion Abutting against the projecting portion 511 and the island portion 600 of the first portion 510 of 500.
- an insulating resin is injected into the cavity, and the antenna 200, the embedded portion 410 of the internal connection portion 400, and the embedded portion of the first portion 510 of the external connection portion 500 are insert-molded into the insulating resin.
- the cured insulating resin becomes the base body 100, and the accommodation hole 110 is formed in the base body 100 according to the shape of the protrusion of the mold.
- the antenna 200, the embedded portion 410 of the internal connection portion 400, and the embedded portion of the first portion 510 are sealed to the base body 100, and the antenna 200 is disposed at the first height position in the base body 100.
- the protruding portion 420 of the internal connecting portion 400, the protruding portion 511 of the first portion 510 of the external connecting portion 500, and the island portion 600 are disposed in the accommodation hole 110, and the second portion 520 of the external connecting portion 500 is exposed from the base body 100 to the outside. Protruding. Thereafter, the mold is separated and the antenna 200, the internal connection part 400, the external connection part 500, the island part 600, and the base body 100 are taken out.
- the semiconductor component 300 is prepared.
- the semiconductor component 300 is accommodated in the accommodation hole 110, placed on the island portion 600, and disposed at the first height position or the second height position in the base body 100.
- the first connection portion of the semiconductor component 300 is connected to the protruding portion 420 of the internal connection portion 400 with solder or the like, and the second connection portion of the semiconductor component 300 is soldered to the protruding portion 511 of the first portion 510 of the external connection portion 500. Connect with etc.
- the island portion 600 may be omitted.
- an insulating resin may be potted in the housing hole 110, and the housing hole 110 may be filled with the insulating resin.
- the base body 100 is a solid block without the accommodation hole 110.
- the mold clamping step includes arranging the first conductor S on the Z ′ direction side of the antenna 200 in the cavity, and the insert molding step is performed on the insulating resin injected into the cavity. You may make it further include carrying out insert molding of the conductor S.
- the prepared internal connection portion 400 When the semiconductor component 300 is disposed at the second height position, the prepared internal connection portion 400 has the antenna 200 positioned at the first height position and the semiconductor component 300 positioned at the second height position. Thus, it is good that it is previously bent or curved. As described above, the module M1 is manufactured.
- the module M1 described above has the following technical features.
- the communication accuracy of the module M1 is improved.
- the reason is as follows. Since the antenna 200 is located at the first height position in the base body 100 and the semiconductor component 300 is located at the first height position or the second height position, the antenna 200 communicates with the first outer surface 101 of the base body 100. Located near the area. For this reason, when the counterpart communication device is arranged near the Z direction side of the communication area, the distance in the Z-Z ′ direction between the antenna 200 and the counterpart communication device becomes short. In particular, when the antenna 200 at the first height position is located on the Z direction side with respect to the end surface in the Z direction of the semiconductor component 300 at the second height position, ZZ ′ between the antenna 200 and the counterpart communication device. Since the distance in the direction is closer than the distance in the ZZ ′ direction between the semiconductor component 300 and the counterpart communication device, the communication accuracy of the module M1 can be further improved.
- the dimension of the module M1 in the Z-Z ′ direction is larger than when the antenna 200 and the semiconductor component 300 are aligned in the ZZ ′ direction. Get smaller. Even when the antenna 200 is located at the first height position and the semiconductor component 300 is located at the second height position, the antenna 200 is spaced from the semiconductor component 300 in the direction orthogonal to the ZZ ′ direction. By disposing the module, the size of the module M1 in the ZZ ′ direction can be reduced while improving the communication accuracy of the module M1.
- the versatility of the module M1 is improved.
- the reason is as follows.
- the semiconductor component 300 appropriately selected according to the application (for reception or transmission), function (communication speed or communication distance) of the module M1 is inserted into the case or the accommodation hole 110, and the semiconductor component 300 is connected to the internal connection portion.
- the application and function of the module M1 can be changed simply by electrically connecting the protrusions 420 of the 400 and the protrusions 511 of the first part 510 of the external connection part 500.
- the antenna 200 and the internal connection part 400 are configured by one metal plate, it is easy to arrange the antenna 200 at the first height position and the semiconductor component 300 at the second height position. become.
- the reason is as follows.
- the base body 100 is a solid block without the case or the accommodation hole 110, a part of the internal connection portion 400 is bent or curved, and the internal connection portion 400 is connected to the semiconductor component 300.
- the antenna 200 can be disposed at the first height position and the semiconductor component 300 can be disposed at the second height position simply by disposing 400 and the semiconductor component 300 within the base body 100.
- the base body 100 is a solid block having the accommodation hole 110, a part of the internal connection portion 400 is bent or curved, the antenna 200 and the internal connection portion 400 are disposed in the base body 100, and the semiconductor component 300 is placed on the base body 100.
- the antenna 200 can be disposed at the first height position and the semiconductor component 300 can be disposed at the second height position simply by being accommodated in the accommodation hole 110 and connected to the protruding portion 420 of the internal connection portion 400.
- the module M1 can acquire the technical feature similar to this paragraph.
- the number of parts of the module M1 is reduced.
- module M1' (hereinafter also referred to as module M1') according to the second embodiment of the present invention will be described in detail with reference to FIG. 3A.
- 3A also shows the Z-Z ′ direction and the Y-Y ′ direction as in FIG. 1D.
- the module M1 ' is different from the module M1 in that it does not include the island portion 600 but further includes a substrate 700 (third substrate).
- Other configurations of the module M1 ' are the same as the configuration of the module M1. Hereinafter, only the difference will be described in detail, and the description overlapping with the module M1 in the description of the module M1 'will be omitted.
- the substrate 700 is a rigid substrate, a flexible substrate, or a rigid flexible substrate. At least one semiconductor component 300 is mounted on the mounting surface of the substrate 700.
- the mounting surface of the substrate 700 may be either the Z direction surface or the Z ′ direction surface of the substrate 700.
- the substrate 700 is disposed in the base body 100 such that the end surface in the Z ′ direction of at least one semiconductor component 300 is positioned at the first height position or the second height position in the base body 100.
- the substrate 700 When the base body 100 is a solid block and does not have the accommodation hole 110, the substrate 700 has an end face in the Z ′ direction of at least one semiconductor component 300 positioned at the first height position or the second height position. As described above, the substrate 100 is sealed. In other words, the substrate 700 is insert-molded in the base body 100.
- the substrate 700 is accommodated in the base body 100 so that the end surface in the Z ′ direction of at least one semiconductor component 300 is located at the first height position or the second height position. .
- any one of the following 1) to 3) is possible.
- the substrate 700 is held on the bottom or wall of the substrate 100.
- the substrate 700 is supported by a support portion provided in the base body 100.
- the substrate 700 is supported by at least one of the internal connection part 400 and the external connection part 500 in the base body 100.
- the housing hole 110 When the housing hole 110 is provided in the base body 100, it can be any of the following 1) to 3). 1) A part of the substrate 700 (for example, an end in the Y direction, an end in the Y ′ direction, and an end in the X direction so that the at least one semiconductor component 300 is positioned at the first height position or the second height position. End portions and / or end portions in the X ′ direction) are sealed in the base body, and a part of the mounting surface of the substrate 700 is exposed to the outside of the base body 100 through the accommodation hole 110.
- the substrate 700 is placed on the bottom of the accommodation hole 110 which is a bottomed hole so that the at least one semiconductor component 300 is positioned at the first height position or the second height position, and A part of the mounting surface is exposed outside the base body 100 through the accommodation hole 110.
- the substrate 700 is hollowly supported by the internal connection part 400 and / or the external connection part 500 in the accommodation hole 110 so that the at least one semiconductor component 300 is located at the first height position or the second height position.
- a part of the mounting surface of the substrate 700 is exposed outside the base body 100 through the accommodation hole 110. In FIG. 3A, it is 1).
- the at least one internal connection part 400 is connected to the substrate 700 and is connected to the first connection part of the semiconductor component 300 via the substrate 700.
- the first part 510 of at least one external connection part 500 is connected to the substrate 700 and is connected to the second connection part of the semiconductor component 300 via the substrate 700.
- On or in the surface of the substrate 700 at least one first conductive line (not shown) and at least one second conductive line (not shown) are provided.
- At least one first conductive line connects the internal connection part 400 and the first connection part of the semiconductor component 300.
- At least one second conductive line connects the first part 510 of the external connection part 500 and the second connection part of the semiconductor component 300.
- the plurality of first conductive lines are connected to the plurality of internal connection portions 400 and the plurality of first portions of the one semiconductor component 300. Each connection is connected.
- a plurality of first conductive lines may connect the plurality of internal connection portions 400 and one first connection portion of the plurality of semiconductor components 300, respectively.
- the plurality of first conductive lines may connect the plurality of internal connection portions 400 and the plurality of first connection portions of the plurality of semiconductor components 300, respectively.
- the plurality of second conductive lines are connected to the first portion 510 of the plurality of external connection portions 500 and one semiconductor component 300.
- the plurality of second connection portions are respectively connected.
- a plurality of second conductive lines are connected to a first portion 510 of the plurality of external connection portions 500 and a second connection portion of one of the plurality of semiconductor components 300.
- a plurality of second conductive lines respectively connect the first portion 510 of the plurality of external connection portions 500 and the plurality of second connection portions of the plurality of semiconductor components 300. Also good.
- the module M1 ' is as follows.
- the base body 100 is a solid block having an accommodation hole 110.
- the antenna 200 and the pair of internal connection portions 400 are configured by a single metal plate.
- the pair of internal connection portions 400 are made of a metal plate, and the embedded portions of the pair of internal connection portions 400 are directly connected to the antenna 200.
- the antenna 200 and the internal connection unit 400 described above are prepared, and a plurality of external connection units 500 and a substrate 700 are prepared.
- the internal connection portion 400 and the external connection portion 500 are connected to the substrate 700 with solder or the like.
- a mold (not shown) is clamped, and the antenna 200, the internal connection part 400, the first part 510 of the external connection part 500, and the substrate 700 are arranged in the cavity of the mold.
- the antenna 200 is disposed at a position corresponding to the first height position in the cavity
- the second part 520 of the external connection unit 500 is accommodated in the mold accommodation hole
- the protrusion of the mold abuts a part of the mounting surface of the substrate 700.
- an insulating resin is injected into the cavity, and the antenna 200, the internal connection portion 400, the substrate 700, and the first portion 510 of the external connection portion 500 are insert-molded into the insulating resin.
- the cured insulating resin becomes the base body 100, and the accommodation hole 110 is formed in the base body 100 according to the shape of the protrusion of the mold.
- the antenna 200, the internal connection portion 400, the substrate 700, and the first portion 510 of the external connection portion 500 are sealed with the base body 100, and the antenna 200 is disposed at the first height position in the base body 100.
- a part of the mounting surface of the substrate 700 is exposed to the outside from the accommodation hole 110, and the second part 520 of the external connection part 500 protrudes from the base body 100 to the outside. Thereafter, the mold is separated and the antenna 200, the internal connection part 400, the external connection part 500, the substrate 700 and the base body 100 are taken out.
- the semiconductor component 300 is prepared.
- the semiconductor component 300 is accommodated in the accommodation hole 110 and mounted on the substrate 700.
- the semiconductor component 300 is disposed at the first height position or the second height position in the base body 100, and the first connection portions of the semiconductor component 300 are connected to the internal connection portion 400 via the substrate 700, respectively.
- the second connection part of the component 300 is connected to the first part 510 of the external connection part 500 via the substrate 700.
- an insulating resin may be potted in the accommodation hole 110 as in the method for manufacturing the module M1.
- the semiconductor component 300 is disposed at the second height position, the prepared internal connection portion 400 has the antenna 200 positioned at the first height position and the semiconductor component 300 positioned at the second height position. Thus, it is good that it is bent or curved.
- the module M1 ′ includes the first conductor S, it is possible to hold the first conductor S on the base body 100 as in the method for manufacturing the module M1. As described above, the module M1 'is manufactured.
- the module M1 'described above has the first to fifth technical features of the module M1.
- module M1 ′′ (hereinafter also referred to as module M1 ′′) according to the third embodiment of the present invention will be described in detail with reference to FIG. 3B.
- 3B also shows the Z-Z ′ direction and the Y-Y ′ direction as in FIG. 1D.
- the module M 1 ′′ is different from the module M 1 ′ in that it includes a substrate 700 ′ (third substrate) instead of the external connection unit 500 and the substrate 700.
- the other configuration of the module M1 ′′ is the same as that of the module M1 ′.
- the difference will be described in detail, and the description overlapping with the module M1 'in the description of the module M1 "will be omitted.
- the substrate 700 ′ has the same configuration as the substrate 700 except that the substrate 700 ′ is different from the substrate 700 in that the end in the Y ′ direction protrudes outside the base body 100.
- the substrate 700 ' has an external connection portion 710'.
- the external connection part 710 ' has a first part 711' and a second part 712 '.
- the first part 711 ′ is a part in the base body 100 of the substrate 700 ′.
- the second portion 712 ′ is an end portion that protrudes outside the base body 100 of the substrate 700 ′.
- At least one first conductive line (not shown) is provided on and / or in the surface of the substrate 700 ′.
- At least one first conductive line of the substrate 700 ′ has the same configuration as the first conductive line of the substrate 700.
- At least one second conductive line (not shown) is further provided on the surface of the external connection portion 710 'and / or inside the external connection portion 710'. At least one second conductive line of the external connection portion 710 ′ has the same configuration as the second conductive line of the substrate 700 except for the following points. At least one second conductive line of the external connection portion 710 ′ is connected to the second connection portion of the semiconductor component 300 and has an end located outside the base body 100. The end of the second conductive line is provided in the second portion 712 '.
- the second part 712 ' may be directly connected to the board of the electronic device, or may be indirectly connected to the board via a cable or the like. In the latter case, the first outer surface 101 of the base body 100 may be fixed to the housing of the electronic device with an adhesive or the like.
- the antenna 200 and the pair of internal connection portions 400 are prepared, and the substrate 700' is prepared.
- the internal connection portion 400 is connected to the substrate 700 ′ with solder or the like. Thereafter, a mold (not shown) is clamped, and portions other than the antenna 200, the internal connection part 400, and the second part 712 'of the substrate 700' are disposed in the cavity of the mold.
- the antenna 200 is disposed at a position corresponding to the first height position in the cavity, the second portion 712 ′ of the substrate 700 ′ is accommodated in the mold accommodation hole, And the protrusion of the mold abuts a part of the mounting surface of the substrate 700 ′.
- an insulating resin is injected into the cavity, and portions other than the antenna 200, the internal connection portion 400, and the second portion 712 'of the substrate 700' are insert-molded into the insulating resin.
- the cured insulating resin becomes the base body 100, and the accommodation hole 110 is formed in the base body 100 according to the shape of the protrusion of the mold.
- portions other than the antenna 200, the internal connection portion 400, and the second portion 712 ′ of the substrate 700 ′ are sealed to the base body 100, and the antenna 200 is disposed at the first height position in the base body 100. .
- a part of the mounting surface of the substrate 700 is exposed to the outside from the accommodation hole 110, and the second portion 712 ′ of the substrate 700 ′ protrudes from the base body 100 to the outside.
- the mold is separated and the antenna 200, the internal connection part 400, the substrate 700 'and the base body 100 are taken out.
- the semiconductor component 300 may be mounted on the substrate 700 ′ instead of the substrate 700.
- the manufacturing method of the module M1 ′′ can be 1) and / or 2) as in the manufacturing method of the module M1.
- An insulating resin may be potted in the accommodation hole 110.
- the module M ⁇ b> 1 ′′ includes the first conductor S
- the first conductor S may be held on the base body 100. As described above, the module M1 ′′ is manufactured.
- the above-described module M1 ′′ has the first to fifth technical features of the module M1.
- the substrate 700 ′ has the external connection portion 710 ′, the number of parts of the module M ⁇ b> 1 ′′ is further reduced.
- module M2 a non-contact communication module M2 (hereinafter also referred to as module M2) according to the fourth embodiment of the present invention will be described in detail with reference to FIG.
- module M2 a non-contact communication module M2 (hereinafter also referred to as module M2) according to the fourth embodiment of the present invention will be described in detail with reference to FIG.
- the Z-Z ′ direction and the Y-Y ′ direction are shown as in FIG. 1D.
- the module M2 is different from the module M1 in that it does not include the island portion 600 and includes a substrate 800 (first substrate) instead of the internal connection portion 400.
- the other configuration of the module M2 is the same as that of the module M1.
- only the difference will be described in detail, and the description overlapping with the module M1 in the description of the module M2 will be omitted.
- the substrate 800 is a flexible substrate or a rigid flexible substrate.
- the substrate 800 has an internal connection portion 810.
- the internal connection part 810 includes a first part 811, a second part 812, and an intermediate part 813.
- At least one antenna 200 is provided on the first part 811.
- the antenna 200 is composed of a metal plate, a coil, a conductor, or the like.
- the second part 812 is electrically connected to the semiconductor component 300.
- the semiconductor component 300 is mounted on the second part 812.
- the mounting surface of the second portion 812 may be either the Z-direction surface or the Z′-direction surface of the second portion 812.
- At least one first conductive line (not shown) is provided on or inside the internal connection portion 810.
- At least one first conductive line of the internal connection portion 810 has the same configuration as the first conductive line of the substrate 700 except for the following points.
- At least one first conductive line connects the antenna 200 and the first connection portion of the semiconductor component 300.
- the first part 510 of at least one external connection part 500 is connected to the second part 812 of the substrate 800. That is, at least one external connection part 500 is connected to the second connection part of the semiconductor component 300 via the substrate 800.
- At least one second conductive line (not shown) is provided on or inside the substrate 800.
- At least one second conductive line of the substrate 800 has the same configuration as the second conductive line of the substrate 700.
- the intermediate portion 813 is curved so that at least one antenna 200 is located at the first height position, and an end surface in the Z ′ direction of at least one semiconductor component 300 is located at the second height position.
- the substrate 800 When the base body 100 is a solid block and does not have the accommodation hole 110, the substrate 800 has at least one antenna 200 positioned at the first height position, and the at least one semiconductor component 300 in the Z ′ direction. It is sealed in the base body 100 so that the end face is located at the second height position. In other words, the substrate 800 is insert-molded in the base body 100.
- the substrate 800 is arranged such that at least one antenna 200 is positioned at the first height position, and an end surface in the Z ′ direction of at least one semiconductor component 300 is positioned at the second height position. Further, it is accommodated in the base body 100. In this case, any one of the following 1) to 3) is possible. 1) The first portion 811 of the substrate 800 is held on the wall or the like of the base body 100, and the second portion 812 of the substrate 800 is held on the bottom or wall of the base body 100. 2) The first part 811 of the substrate 800 is supported by a first support part provided in the base body 100, and the second part 812 of the substrate 800 is supported by a second support part provided in the base body 100. 3) The first portion 811 of the substrate 800 is held by the wall of the base 100, the first support portion, or the like, and the second portion 812 of the substrate 800 is supported by at least one external connection portion 500 in the base 100.
- the substrate 800 When the housing hole 110 is provided in the base body 100, the substrate 800 has at least one antenna 200 positioned at the first height position, and the end surface in the Z ′ direction of at least one semiconductor component 300 has the second height. It is sealed in the base body 100 so as to be positioned. In other words, the substrate 800 is insert-molded in the base body 100. In this case, any one of the following 1) to 3) is possible. 1) A part of the mounting surface of the second portion 812 of the substrate 800 forms the bottom surface of the accommodation hole 110. 2) The second portion 812 of the substrate 800 is placed on the bottom of the accommodation hole 110 which is a bottomed hole, and a part of the mounting surface of the second portion 812 is exposed to the outside of the base body 100 through the accommodation hole 110. Yes.
- the second part 812 of the substrate 800 is hollowly supported in the accommodation hole 110 by at least one external connection part 500, and a part of the mounting surface of the second part 812 is exposed to the outside of the base body 100 through the accommodation hole 110. Yes. In FIG. 4, it is 1).
- the base body 100 is a solid block having an accommodation hole 110.
- the substrate 800 provided with the antenna 200 in the first portion 811 and the plurality of external connection portions 500 are prepared.
- the external connection portion 500 is connected to the second portion 812 of the substrate 800 with solder or the like.
- a mold (not shown) is clamped, and the antenna 200, the substrate 800, and the first part 510 of the external connection unit 500 are disposed in the cavity of the mold.
- the antenna 200 is disposed at a position corresponding to the first height position in the cavity
- the second part 520 of the external connection unit 500 is accommodated in the mold accommodation hole
- the protrusion of the mold abuts a part of the mounting surface of the second portion 812 of the substrate 800.
- an insulating resin is injected into the cavity, and the antenna 200, the substrate 800, and the first portion 510 of the external connection portion 500 are insert-molded into the insulating resin.
- the cured insulating resin becomes the base body 100, and the accommodation hole 110 is formed in the base body 100 according to the shape of the protrusion of the mold.
- the antenna 200, the substrate 800, and the first portion 510 of the external connection portion 500 are sealed with the base body 100, and the antenna 200 is disposed at the first height position in the base body 100.
- a part of the mounting surface of the second part 812 of the substrate 800 is exposed to the outside from the accommodation hole 110, and the second part 520 of the external connection part 500 protrudes from the base body 100 to the outside.
- the mold is separated and the antenna 200, the substrate 800, the external connection portion 500, and the base body 100 are taken out.
- the semiconductor component 300 is prepared.
- the semiconductor component 300 is accommodated in the accommodation hole 110 and mounted on the second part 812 of the substrate 800.
- the semiconductor component 300 is disposed at the second height position in the base body 100, the first connection portions of the semiconductor component 300 are connected to the first conductive lines of the internal connection portions 810 of the substrate 800, respectively.
- the second connection parts are connected to the first part 510 of the external connection part 500 through the second conductive lines of the substrate 800, respectively.
- an insulating resin may be potted in the accommodation hole 110 as in the method for manufacturing the module M1.
- the module M2 includes the first conductor S
- the first conductor S can be held on the base body 100 as in the method for manufacturing the module M1.
- the module M2 is manufactured.
- the module M2 described above has the first to fourth technical features of the module M1.
- a non-contact communication module M3 (hereinafter also referred to as a module M3) according to Embodiment 5 of the present invention will be described in detail with reference to FIG. 5A.
- a module M3 hereinafter also referred to as a module M3 according to Embodiment 5 of the present invention will be described in detail with reference to FIG. 5A.
- the Z-Z ′ direction and the Y-Y ′ direction are shown as in FIG. 1D.
- the module M3 is different from the module M1 in that the module M3 includes at least one antenna 200 ′ and at least one internal connection part 400 ′ instead of at least one antenna 200 and at least one internal connection part 400. ing.
- Other configurations of the module M3 are the same as the configuration of the module M1. Hereinafter, only the difference will be described in detail, and the description overlapping with the module M1 in the description of the module M3 will be omitted.
- the at least one antenna 200 ′ and the at least one internal connection part 400 ′ are configured by a single metal plate (for example, a lead frame).
- a pair of internal connection portions 400 '(one shown in the figure) is integrally connected to both ends of the antenna 200'.
- At least one antenna 200 ′ and at least one internal connection part 400 ′ are arranged in the base body 100 in the same manner as the antenna 200 and the internal connection part 400 of the module M ⁇ b> 1. At least one antenna 200 'is located at the first height position. Since at least one internal connection part 400 ′ extends in the YY ′ direction, the antenna 200 is arranged away from the semiconductor component 300 in the YY ′ direction (a direction orthogonal to the ZZ ′ direction). Yes.
- the at least one semiconductor component 300 is located at the second height position in the base body 100 and in the Z ′ direction with respect to the internal connection portion 400 ′. In this case, the end surface of the semiconductor component 300 in the Z direction is located at the second height position.
- the first connection portion of the semiconductor component 300 is connected to the internal connection portion 400 ′ directly or indirectly via an intermediate member.
- the intermediate member is a lead wire, a cable, a conductive wire, or the like.
- the housing hole 110 may be a bottomed hole provided in the second outer surface 102 and opened in the Z ′ direction, or from the first outer surface 101 to the second. It may be a through-hole penetrating the outer surface 102 and opening in the Z direction and the Z ′ direction.
- at least one semiconductor component 300 is directly or intermediately provided on the protrusion 420 ′ of the internal connection part 400 ′ in the Z ′ direction rather than at least one internal connection part 400 ′ in the accommodation hole 110. Connected indirectly through.
- the internal connection portion 400 ′ has a buried portion 410 ′ and a protruding portion 420 ′.
- the embedded portion 410 ′ is sealed in the base body 100.
- the protruding portion 420 ′ protrudes into the accommodation hole 110 and is connected to the first connection portion of the semiconductor component 300 as described above.
- the module M3 may further include an island part 600 and / or a first conductor S.
- the module M3 is manufactured in the same manner as the module M1.
- the module M3 has the first to fifth technical features of the module M1.
- FIG. 5B also shows the Z-Z ′ direction and the Y-Y ′ direction as in FIG. 1D.
- the module M3 ' is different from the module M3 in that it does not include the island portion 600 but further includes a substrate 700 (third substrate).
- Other configurations of the module M3 ' are the same as the configuration of the module M3.
- the difference will be described in detail, and the description overlapping with the module M3 in the description of the module M3 'will be omitted.
- the substrate 700 of the module M3 ' has substantially the same configuration as the substrate 700 of the module M1'.
- the mounting surface of the substrate 700 of the module M3 ′ is the surface of the substrate 700 in the Z ′ direction.
- At least one semiconductor component 300 is mounted on the mounting surface of the substrate 700.
- the internal connection portion 400 ′ is connected to the surface in the Z direction of the substrate 700 (the surface opposite to the mounting surface) and is connected to the first connection portion of the semiconductor component 300 through the substrate 700. In this way, the semiconductor component 300 is connected to the internal connection portion 400 ′ via the substrate 700 on the Z ′ direction side of the internal connection portion 400 ′ and is positioned at the second height position of the base body 100.
- the module M3 ' may further include a first conductor S.
- This module M3 ' is manufactured in the same manner as the module M1'.
- the module M3 ' has the first to fifth technical features of the module M1.
- a non-contact communication module M3 ′′ (hereinafter also referred to as a module M3 ′′) according to Embodiment 7 of the present invention will be described in detail with reference to FIG. 5C.
- a module M3 ′′ (hereinafter also referred to as a module M3 ′′) according to Embodiment 7 of the present invention will be described in detail with reference to FIG. 5C.
- the Z-Z ′ direction and the Y-Y ′ direction are shown as in FIG. 1D.
- the module M3 ′′ is different from the module M3 ′ in that the module M3 ′′ includes a substrate 700 ′ (third substrate) instead of the external connection unit 500 and the substrate 700.
- the other configuration of the module M3 ′′ is the same as that of the module M3 ′.
- the difference will be described in detail, and the description overlapping with the module M3 'in the description of the module M3 "will be omitted.
- the substrate 700 ′ of the module M3 ′′ has substantially the same configuration as the substrate 700 ′ of the module M1 ′′.
- the substrate 700 ' has an external connection portion 710'.
- the external connection part 710 ' has a first part 711' and a second part 712 '.
- the first outer surface 101 of the base body 100 may be fixed to the housing of the electronic device with an adhesive or the like.
- the mounting surface of the substrate 700 ′ of the module M ⁇ b> 3 ′′ is a surface in the Z ′ direction of the substrate 700 ′.
- At least one semiconductor component 300 is mounted on the mounting surface of the substrate 700 '.
- At least one internal connection portion 400 ′ is connected to the surface in the Z direction (surface opposite to the mounting surface) of the substrate 700 ′ and is connected to the first connection portion of the semiconductor component 300 via the substrate 700 ′. Yes. In this way, the semiconductor component 300 is connected to the internal connection portion 400 ′ via the substrate 700 in the Z ′ direction from the internal connection portion 400 ′ and is positioned at the second height position of the base body 100.
- the module M3 ′′ may further include a first conductor S.
- the module M3 ′′ is manufactured in the same manner as the module M1 ′′.
- the module M3 ′′ has the first to fifth technical features of the module M1.
- the substrate 700 ′ has the external connection portion 710 ′, the number of parts of the module M ⁇ b> 3 ′′ is further reduced.
- a non-contact communication module M4 (hereinafter also referred to as a module M4) according to an eighth embodiment of the present invention will be described in detail with reference to FIG. 6A.
- 6A also shows the Z-Z ′ direction and the Y-Y ′ direction, as in FIG. 1D.
- the module M4 is different from the module M2 in that the module M4 includes a substrate 800 ′′ (second substrate) instead of the substrate 800.
- Other configurations of the module M4 are the same as the configuration of the module M2.
- the difference will be described in detail, and the description overlapping with the module M2 in the description of the module M4 will be omitted.
- the substrate 800 ′′ of the module M4 is a rigid substrate, a flexible substrate, or a rigid flexible substrate.
- the substrate 800 ′′ of the module M4 has substantially the same configuration as the substrate 800 of the module M2, except that it extends in the Y-Y ′ direction, and is disposed on the base body 100 in the same manner as the substrate 800 of the module M2.
- the substrate 800 ′′ has an internal connection portion 810 ′′.
- the internal connection portion 810 ′′ includes a first portion 811 ′′ and a second portion 812 ′′.
- At least one antenna 200 is provided on the surface 811 a ′′ (first surface of the claims) in the Z direction of the first portion 811 ′′. At least one antenna 200 is located at a first height position in the base body 100.
- the mounting surface 812 a ′′ (second surface of claims) of the substrate 800 ′′ is a surface in the Z ′ direction of the second portion 812 ′′ of the internal connection portion 810 ′′ of the substrate 800 ′′.
- At least one semiconductor component 300 is mounted on the mounting surface 812 a ′′ of the second part 812 ′′ of the internal connection part 810 ′′.
- at least one semiconductor component 300 is disposed on the Z ′ direction side of the mounting surface 812a ′′ of the second part 812 ′′ of the internal connection part 810 ′′ and is disposed on the substrate 800 ′′ via an intermediate member. It may be connected indirectly.
- the intermediate member is a terminal, a pin, a lead wire, a cable, a conductive wire, or the like.
- At least one semiconductor component 300 is connected to the internal connection portion 810 ′′ in the Z ′ direction with respect to the internal connection portion 810 ′′ and positioned at the second height position in the base body 100.
- the end surface in the Z direction of at least one semiconductor component 300 is located at the second height position.
- the antenna 200 is disposed away from the semiconductor component 300 in the YY ′ direction (a direction orthogonal to the ZZ ′ direction). Yes.
- at least one external connection unit 500 of the module M4 has the same configuration as the external connection unit 500 of the module M2.
- the housing hole 110 When the housing hole 110 is provided in the base body 100, the housing hole 110 may be a bottomed hole provided in the second outer surface 102 and opened in the Z ′ direction, or from the first outer surface 101 to the second. It may be a through-hole penetrating through the outer surface 102 and opening in the ZZ ′ direction. In any case, at least one semiconductor component 300 is connected to the second part 812 ′′ in the Z ′ direction rather than the second part 812 ′′ of the internal connection part 810 ′′ in the accommodation hole 110.
- the module M4 may further include a first conductor S. This module M4 is manufactured in the same manner as the module M2. The module M4 has the same technical features as the module M2.
- a non-contact communication module M4 ' (hereinafter also referred to as a module M4') according to Embodiment 9 of the present invention will be described in detail with reference to FIG. 6B.
- 6B also shows the Z-Z ′ direction and the Y-Y ′ direction as in FIG. 1D.
- the module M4 ' is different from the module M4 in that the module M4' includes a substrate 800 "" (second substrate) instead of the external connection unit 500 and the substrate 800 ".
- Other configurations of the module M4 ' are the same as the configuration of the module M4. Hereinafter, only the difference will be described in detail, and the description overlapping with the module M4 in the description of the module M4 'will be omitted.
- the substrate 800 ′′ ′′ of the module M4 ′ is a rigid substrate, a flexible substrate, or a rigid flexible substrate.
- the substrate 800 '' 'of the module M4' has substantially the same configuration as the substrate 800 'of the module M2 "' except that it extends in the Y-Y 'direction.
- the substrate 800 ′′ ′′ has an internal connection portion 810 ′′ ′′ and an external connection portion 820 ′′ ′′. Portions other than the internal connection portion 810 ′′ ′′ of the substrate 800 ′′ ′′ and the second portion 822 ′ of the external connection portion 820 ′′ ′′ are disposed in the base body 100.
- the internal connection part 810 "" has a first part 811 "" and a second part 812 "".
- At least one antenna 200 is provided on the surface 811 a ′′ ′′ (first surface of the claims) of the first portion 811 ′′ ′′ in the Z direction. At least one antenna 200 is located at a first height position in the base body 100.
- the mounting surface 812a ′ ′′ (the second surface of the claims) of the substrate 800 ′′ ′′ is in the Z ′ direction of the second portion 812 ′ ′′ of the internal connection portion 810 ′ ′′ of the substrate 800 ′ ′′.
- At least one semiconductor component 300 is mounted on the mounting surface 812 a ′′ of the second portion 812 ′′ ′′ of the internal connection portion 810 ′′ ′′.
- at least one semiconductor component 300 is disposed on the Z ′ direction side of the mounting surface 812a ′ ′′ of the second part 812 ′ ′′ of the internal connection part 810 ′ ′′, and the substrate 800 ′′ is interposed via an intermediate member. Indirectly connected to '.
- the intermediate member is a terminal, a pin, a lead wire, a cable, a conductive wire, or the like.
- at least one semiconductor component 300 is connected to the internal connection portion 810 ′′ in the Z ′ direction relative to the internal connection portion 810 ′ ′′ and positioned at the second height position in the base body 100. .
- the antenna 200 is disposed away from the semiconductor component 300 in the YY ′ direction (a direction perpendicular to the ZZ ′ direction). ing.
- the external connection portion 820 ′ ′′ of the substrate 800 ′′ ′′ of the module M 4 ′ has the same configuration as the external connection portion 820 ′ of the substrate 800 ′ of the module M 2 ′′ ′′.
- the external connection part 820 “" has a first part 821 “" and a second part 822 “".
- the first part 821 ′′ ′′ is a part in the base body 100 of the external connection part 820 ′′ ′′.
- the second portion 822 ′′ ′′ is a portion protruding outside the base body 100 of the external connection portion 820 ′.
- the housing hole 110 When the housing hole 110 is provided in the base body 100, the housing hole 110 may be a bottomed hole provided in the second outer surface 102 and opened in the Z ′ direction, or from the first outer surface 101 to the second. It may be a through-hole penetrating through the outer surface 102 and opening in the ZZ ′ direction. In any case, at least one semiconductor component 300 is connected to the second part 812 ′ ′′ in the Z ′ direction rather than the second part 812 ′ ′′ of the internal connection part 810 ′ ′′ in the receiving hole 110. Yes.
- the module M4 ' may further include a first conductor S.
- This module M4 ' is manufactured in the same manner as the module M2 "'.
- the module M4 ' has the same technical features as the module M2 "".
- a non-contact communication module M5 (hereinafter also referred to as a module M5) according to Embodiment 10 of the present invention will be described in detail with reference to FIGS. 7A to 9B.
- 7A to 8A also show the Z-Z ′ direction, the Y-Y ′ direction, and the X-X ′ direction, as in FIG. 1A and the like.
- 8B to 9B show the Z-Z 'direction and the Y-Y' direction.
- the module M5 includes a base body 100 ′, at least one antenna 200 ′′, at least one semiconductor component 300, at least one internal connection portion 900, and at least one external connection portion 1000.
- the base body 100 ' is a solid block made of insulating resin.
- the base body 100 ' has a first outer surface 101'.
- the first outer surface 101 ′ is the entire region or a partial region (hereinafter referred to as a first region) (refer to FIGS. 7A to 8B) of the surface (surface) in the Z direction of the base body 100 ′ (see FIGS. 7A to 8B). It is located at the first height position in the 'direction.
- the first outer surface 101 ' has a communication area.
- the counterpart communication device can be arranged in a short distance in the Z direction of the communication area of the base body 100 ′.
- the base body 100 ′ may further include a second outer surface 102 ′.
- the second outer surface 102 ' may be an outer surface located at the second height position of the base body 100'.
- the second height position is located closer to the Z ′ direction than the first height position.
- the second outer surface 102 ' can be a second region different from the first region of the surface in the Z direction of the base body 100'.
- the base body 100 ′ may further include a thick part 110 ′ and a thin part 120 ′.
- the thick portion 110 ′ can be provided at an arbitrary position of the base body 100 ′.
- the thick portion 110 ′ can be an end portion of the base body 100 ′ in the Y direction or an intermediate portion of the base body 100 ′ in the YY ′ direction.
- the surface in the Z direction of the thick portion 110 ′ can be the first outer surface 101 ′.
- the dimension of the thick portion 110 'in the Z-Z' direction is such that the first outer surface 101 'is positioned at the first height position in the Z-Z' direction.
- the thin portion 120 ′ can be provided at any location different from the thick portion 110 ′ of the base body 100 ′.
- the surface in the Z direction of the thin portion 120 ′ can be the second outer surface 102 ′.
- the dimension of the thin part 120 ′ in the ZZ ′ direction is smaller than the dimension of the thick part 110 ′ in the ZZ ′ direction, and the second outer surface 102 ′ is positioned at the second height position in the ZZ ′ direction.
- the dimensions are such that
- the thin wall portion 120 ′ may be provided on the base body 100 ′ so as to be positioned next to the thick wall portion 110 ′.
- the thick portion 110 ′ is an end portion in the Y direction of the base body 100 ′
- the thin portion 120 ′ is an end portion in the Y ′ direction of the base body 100 ′ as shown in FIGS. 7A to 8B. It can be an intermediate portion in the 100 ′ YY ′ direction.
- the thin part 120 ′ can be an end part in the Y direction or an end part in the Y ′ direction of the base body 100 ′.
- the base body 100 ′ may further include a third outer surface 103 ′.
- the third outer surface 103 ′ can be a third region different from the first region and the second region of the surface in the Z direction of the base body 100 ′.
- the third outer surface 103 ' extends obliquely or at a right angle from the first outer surface 101' to the second outer surface 102 '.
- the third outer surface 103 ′ can be a flat surface, a circular arc surface, or an uneven surface. 7A to 8B, the third outer surface 103 'is a flat surface extending obliquely from the first outer surface 101' to the second outer surface 102 '.
- the base body 100 ′ may further include a fourth outer surface 104 ′.
- the fourth outer surface 104 ′ can be a region of at least a part of the surface (back surface) in the Z ′ direction of the base body 100 ′.
- the fourth outer surface 104 ′ can be, for example, a mounting surface that can be mounted on a substrate or the like of an electronic device (not shown) or a fixed surface that can be fixed to a frame or the like of the electronic device, but is not limited thereto.
- the base body 100 ′ may further include at least one fifth outer surface 105 ′.
- the fifth outer surface 105 ′ is preferably a side surface of the base body 100 ′ and extends from at least one of the first outer surface 101 ′ and the second outer surface 102 ′ to the fourth outer surface 104 ′.
- the fifth outer surface 105 ' can be a flat surface, a circular arc surface, or an uneven surface. 7A-8B, a plurality of arcuate fifth outer surfaces 105 'extend from the second outer surface 102' to the fourth outer surface 104 '.
- the second outer surface 102 ′ can be at least a part of the Z′-direction surface (back surface) of the base body 100 ′. It is.
- the second outer surface 102 ′ can be, for example, a mounting surface that can be mounted on a substrate or the like of an electronic device (not shown) or a fixed surface that can be fixed to a frame or the like of the electronic device. Not.
- the third outer surface 103 ′ is, for example, a side surface of the base body 100 ′ or a wall surface of a hole or a notch provided in the base body 100 ′ and extends from the first outer surface 101 ′ to the second outer surface 102 ′. It should be extended.
- the third outer surface 103 ′ can also be a flat surface, an arc surface, or an uneven surface. Note that the base body 100 ′ of another aspect may also have a thick part and a thin part.
- the second outer surface 102 ', the third outer surface 103', the fourth outer surface 104 ', the fifth outer surface 105', the thick portion 110 'and / or the thin portion 120' can be omitted.
- the at least one antenna 200 ′′ is provided on the first outer surface 101 ′ of the base body 100 ′ so as to be able to communicate with the counterpart communication device in a non-contact manner and is positioned at the first height position.
- the antenna 200 ′′ can be configured to be able to communicate with the counterpart communication device using the same communication method as the antenna 200 of the module M 1.
- the at least one antenna 200 ′′ can be composed of a metal plate, a coil, a conductor, or the like.
- the at least one antenna 200 ′′ can be a metal film formed on the first outer surface 101 ′ of the base body 100 ′ in any of the above-described aspects.
- This antenna 200 '' is created on the first outer surface 101 'by drawing with a printing machine such as an ink jet printer, or after forming a metal film on the first outer surface 101' by sputtering, electroless plating or vapor deposition, It can be created by removing unnecessary portions of the metal film (portions other than the antenna 200 ′′) by laser or chemical etching.
- At least one antenna 200 ′′ may be a plating film (metal film) formed on the first plating catalyst 130 ′ on the first outer surface 101 ′ of the base body 100 ′ of any of the above-described aspects. It is.
- the first plating catalyst 130 ′ is formed on the first outer surface 101 ′ of the base body 100 ′ and has a shape corresponding to the shape of the antenna 200 ′′.
- the metal complex M is dispersed in the substrate 100 ′ as shown in FIG. 8B.
- a part of the metal complex M on the first outer surface 101 ′ (the part corresponding to the shape of the antenna 200 ′′) is activated by the laser.
- the activated metal complex M is the first plating catalyst 130 '.
- an antenna 200 ′′ is formed by electroless plating.
- the size of the metal complex M is exaggerated for explanation.
- the metal complex is not shown.
- the first plating catalyst 130 ′ and the antenna 200 ′′ can also be produced by a known production method of MoldedMInterconnect Device (MID).
- the shape of the antenna 200 ′′ can be appropriately changed according to the communication method.
- the antenna 200 ′′ has a loop shape.
- a plurality of antennas 200 '' can be provided. In this case, all of the plurality of antennas 200 ′′ may be reception antennas, all of the plurality of antennas 200 ′′ may be transmission antennas, or some of the plurality of antennas 200 ′′ may be reception antennas. And the remainder may be a transmission antenna.
- the at least one semiconductor component 300 can have the same configuration as the semiconductor component 300 of the first embodiment.
- the semiconductor component 300 is mounted on the first outer surface 101 ′ or the second outer surface 102 ′ of the base body 100 ′ according to any one of the above aspects.
- the antenna 200 ′′ on the first outer surface 101 ′ is higher than the end surface in the Z direction of the semiconductor component 300 on the second outer surface 102 ′. It may be located on the direction side.
- the first outer surface 101 ′ is preferably located on the Z direction side with respect to the end surface in the Z direction of the semiconductor component 300 on the second outer surface 102 ′.
- the at least one internal connection portion 900 may be anything that electrically connects the antenna 200 ′′ and the semiconductor component 300.
- the at least one internal connection part 900 can be constituted by a terminal, a pin, a lead wire, a cable or the like.
- the internal connection portion 900 may be provided on the base body 100 'according to any one of the above aspects, or may be provided within the base body 100' according to any one of the above aspects. It may be provided outside the base body 100 ′ of the embodiment.
- the at least one internal connection portion 900 can be a metal film formed on the base body 100 'according to any one of the above aspects.
- at least one internal connection unit 900 can be configured as follows in the following cases A) to C).
- the antenna 200 ′′ and the semiconductor component 300 are provided on the first outer surface 101 ′ of the base body 100 ′ (see FIG. 9A).
- C) The antenna 200 ′′ is provided on the first outer surface 101 ′ of the base body 100 ′, and the semiconductor component 300 is provided on the second outer surface 102 ′, which is at least a partial region of the surface in the Z ′ direction of the base body 100 ′. (See FIG. 9B).
- the internal connection portion 900 may be formed on the first outer surface 101 '. In the case of any of B) and C), it is as the following a) or b). a) The internal connection portion 900 is formed on the second outer surface 102 ′ and the third outer surface 103 ′. b) The internal connection portion 900 is formed on the first outer surface 101 ′, the second outer surface 102 ′, and the third outer surface 103 ′.
- the internal connection portion 900 that is a metal film is formed on one or more outer surfaces of the base body 100 ′ by the same method as the antenna 200 ′′ that is a metal film.
- the internal connection portion 900 may be continuous with the antenna 200 ′′ that is a metal film, or may be connected to the antenna 200 ′′ that is formed of a material other than the metal film. In the former case, the antenna 200 ′′ and at least one internal connection part 900 are formed of one metal film.
- the at least one internal connection portion 900 can be a plating film (metal film) formed on the second plating catalyst 140 ′ on the outer surface of the base body 100 ′.
- the internal connection portion 900 and the second plating catalyst 140 ' can be configured as follows in the cases A) to C).
- the second plating catalyst 140 ′ is formed on the first outer surface 101 ′ according to the shape of the internal connection portion 900, and the internal connection portion 900 is the second plating catalyst 140 on the first outer surface 101 ′. 'Formed on. In the case of any of B) and C), it is as the following c) or d).
- the second plating catalyst 140 ′ is formed on the second outer surface 102 ′ and the third outer surface 103 ′ according to the shape of the inner connection portion 900, and the inner connection portion 900 includes the second outer surface 102 ′ and the third outer surface 102 ′. It is formed on the second plating catalyst 140 ′ on the outer surface 103 ′.
- the second plating catalyst 140 ′ is formed on the first outer surface 101 ′, the second outer surface 102 ′, and the third outer surface 103 ′ according to the shape of the inner connection portion 900, and the inner connection portion 900 is the first outer surface. 101 ′, the second outer surface 102 ′ and the third outer surface 103 ′ are formed on the second plating catalyst 140 ′. In any case, it is preferable that the second plating catalyst 140 ′ is continuous with the first plating catalyst 130 ′ and the internal connection portion 900 is continuous with the antenna 200 ′′.
- the first plating catalyst 130 ′ and the second plating catalyst 140 ′ may be configured by one plating catalyst, and the antenna 200 ′′ and the internal connection portion 900 may be configured by one plating film.
- the internal connection portion 900 that is a plating film may be connected to an antenna 200 ′′ other than the plating film.
- the second plating catalyst 140 ′ is formed on the above-described one or more outer surfaces of the base 100 ′ by the same method as the first plating catalyst 130 ′, and the internal connection portion 900 that is a plating film is also a plating film. It is formed on the second plating catalyst 140 ′ by the same method as the antenna 200 ′′.
- the internal connection part 900 has a first part and a second part.
- the first part of the internal connection unit 900 is connected to or continuous with the antenna 200 ′′.
- the second part of the internal connection part 900 is connected to the first connection part of the semiconductor component 300.
- the internal connection part 900 of any of the above-described aspects can be used. It can be arbitrarily routed to the outer surface.
- the second plating catalyst 140 ′ can be arbitrarily formed on the outer surface of the base body 100 ′ according to the shape of the internal connection part 900.
- the internal connection portion 900 of any of the above-described aspects is configured to extend in the direction including the orthogonal component so that the antenna 200 ′′ is located away from the semiconductor component 300 in the direction including the orthogonal component. It is possible. In this case, the antenna 200 ′′ is not disposed on the Z direction side of the semiconductor component 300, and the antenna 200 ′′ is disposed away from the semiconductor component 300 in a direction including a component in the orthogonal direction, or the antenna 200 ′′ is a semiconductor. Arranged at an interval in a direction orthogonal to the component 300.
- the orthogonal direction may be a direction orthogonal to the ZZ ′ direction, the YY ′ direction, the XX ′ direction, the YY ′ direction, and the X ⁇ direction.
- the direction may be other than the X ′ direction.
- the internal connection portion 900 is a pair, one of which is a plating film formed so as to be continuous with the first end of the loop-shaped antenna 200 ′′, and the other is the antenna. It is a plating film formed to be continuous with the second end of 200 ′′.
- the second plating catalyst 140 ' is also a pair, one of which is continuous with the first end of the first plating catalyst 130' and the other of which is continuous with the second end of the first plating catalyst 130 '. In this way, the pair of internal connection portions 900 connect the loop-shaped antenna 200 ′′ and the semiconductor component 300.
- At least one external connection unit 1000 is connected to the semiconductor component 300 and can be externally connected.
- At least one external connection unit 1000 includes a first part 1100 and a second part 1200.
- the first part 1100 is connected to the second connection part of the semiconductor component 300.
- the second part 1200 can be connected to the substrate of the electronic apparatus outside the base body 100 ′.
- the at least one external connection unit 1000 can be composed of terminals, pins, lead wires, cables, conductive wires, or the like.
- the external connection portion 1000 may be provided on the base body 100 ′ according to any one of the above aspects, or may be provided within the base body 100 ′ according to any one of the above aspects. It may be provided outside the base body 100 ′ of the embodiment.
- At least one external connection part 1000 can be a metal film.
- at least one external connection unit 1000 can be configured as follows in the above cases A) to C).
- the external connection portion 1000 is preferably formed on the first outer surface 101 '.
- the first portion 1100 is located on the first outer surface 101 '.
- the second portion 1200 is located on the first outer surface 101 ′ and exposed outside the base body 100 ′.
- the external connection portion 1000 includes a first outer surface 101 ′ (the surface of the base body 100 ′), a second outer surface 102 ′ (the back surface of the base body 100 ′), and a third outer surface 103 ′ (the base body 100). Good to be formed on the 'side').
- the first portion 1100 is located on the first outer surface 101 '.
- the second portion 1200 is located on the second outer surface 102 ′ and exposed outside the base body 100 ′.
- the external connection portion 1000 is preferably formed on the second outer surface 102 '.
- the first portion 1100 is located on the second outer surface 102 '.
- the second portion 1200 is located on the second outer surface 102 ′ and exposed outside the base body 100 ′.
- the external connection unit 1000 includes a second outer surface 102 ′ (a part of the surface of the base body 100 ′), a fourth outer surface 104 ′ (the back surface of the base body 100 ′), and a fifth outer surface. It is good to form on outer surface 105 '(side surface of base
- the first portion 1100 is located on the second outer surface 102 '.
- the second portion 1200 is located on the fourth outer surface 104 ′ and exposed outside the base body 100 ′.
- the external connection part 1000 is preferably formed on the second outer surface 102 '.
- the first portion 1100 is located on the second outer surface 102 '.
- the second portion 1200 is located on the second outer surface 102 ′ and exposed outside the base body 100 ′.
- the above-described external connection portion 1000 is formed on the above-described one or more outer surfaces of the base body 100 ′ by the same method as the antenna 200 ′′ that is a metal film.
- At least one external connection portion 1000 can be a plating film (metal film) formed on the third plating catalyst 150 ′ on the outer surface of the base body 100 ′.
- the external connection part 1000 and the third plating catalyst 150 ' can be configured as follows in the cases A) to C).
- the third plating catalyst 150 ′ is formed on the first outer surface 101 ′ according to the shape of the external connection part 1000.
- the external connection portion 1000 has the same configuration as the above e) except that it is formed on the third plating catalyst 150 ′ of the first outer surface 101 ′.
- the third plating catalyst 150 ′ has a first outer surface 101 ′ (surface of the base body 100 ′), a second outer surface 102 ′ (back surface of the base body 100 ′), and a third outer surface 103 ′ according to the shape of the external connection part 1000. It is formed on (side surface of the base body 100 ').
- the external connection part 1000 has the same configuration as f) above except that it is formed on the third plating catalyst 150 'on the first outer surface 101', the second outer surface 102 'and the third outer surface 103'.
- the third plating catalyst 150 ′ is formed on the second outer surface 102 ′ according to the shape of the external connection part 1000.
- the external connection part 1000 has the same configuration as g) except that the external connection part 1000 is formed on the third plating catalyst 150 'on the second outer surface 102'.
- the third plating catalyst 150 ′ includes a second outer surface 102 ′ (a part of the surface of the base body 100 ′) and a fourth outer surface 104 according to the shape of the external connection part 1000. It is formed on “(the back surface of the substrate 100)” and the fifth outer surface 105 ′ (the side surface of the substrate 100 ′).
- the external connection part 1000 has the same configuration as h) except that the external connection part 1000 is formed on the third plating catalyst 150 ′ of the second outer surface 102 ′, the fourth outer surface 104 ′, and the fifth outer surface 105 ′.
- the third plating catalyst 150 ′ is formed on the second outer surface 102 ′ according to the shape of the external connection part 1000.
- the external connection portion 1000 can be configured in the same manner as in the case of the external connection portion 1000 C, which is a metal film, except that the external connection portion 1000 is formed on the third plating catalyst 150 ′ on the second outer surface 102 ′. .
- the third plating catalyst 150 ' accordinging to any one of the above-described aspects is formed on one or a plurality of outer surfaces of the substrate 100' by the same method as the first plating catalyst 130 '. Thereafter, the external connection portion 1000 that is a plating film is formed on the third plating catalyst 150 ′ by the same method as the antenna 200 ′′ that is a plating film.
- the external connection part 1000 of any of the above-described aspects is optional on the outer surface of the base body 100 ′ as long as the first part 1100 is connected to the second connection part of the semiconductor component 300 and the second part 1200 can be externally connected. Can be routed to.
- the second part 1200 may be provided on the side surface of the base body 100 ′.
- the third plating catalyst 150 ′ can be arbitrarily formed on the outer surface of the base body 100 ′ according to the shape of the external connection part 1000.
- the plurality of external connections 1000 may include external connections for signal transmission, ground, and / or registers.
- a plurality of third plating catalysts 150 ′ can be provided in accordance with the number of external connection parts 1000.
- a plurality of external connection portions 1000 are formed on the second outer surface 102 ', the fourth outer surface 104', and the fifth outer surface 105 'of the base body 100'.
- the first part 1100 of the external connection part 1000 is located on the second outer surface 102 ′ and is connected to the second connection part of one semiconductor component 300.
- the second part 1200 of the external connection part 1000 is located on the fourth outer surface 104 ′ and exposed outside the base body 100 ′.
- the base body 100 ' may further include at least one second protection unit 160'.
- the at least one second protection part 160 ′ is a wall extending in the ZZ ′ direction from the second outer surface 102 ′ of the base body 100 ′ of any of the above-described aspects, and is a semiconductor component on the second outer surface 102 ′. It is arranged around 300.
- the dimension in the Z-Z ′ direction of the second protective part 160 ′ is preferably larger than the dimension in the Z-Z ′ direction of the semiconductor component 300 on the second outer surface 102 ′.
- the dimension in the Z-Z ′ direction of the second protection part 160 ′ may be the same as or smaller than the dimension in the Z-Z ′ direction of the semiconductor component 300 on the second outer surface 102 ′.
- the semiconductor component 300 is protected by the second protection unit 160 '.
- 9A to 9B, the second protection part 160 ' is not shown.
- the second protection unit 160 ' can be omitted.
- the base body 100 ′ When the surface of the base body 100 ′ in the Z direction includes the first outer surface 101 ′, the second outer surface 102 ′, and the third outer surface 103 ′, the base body 100 ′ further includes at least one third protective portion 170 ′. It is possible to have a configuration provided.
- the at least one third protection part 170 ′ is a wall extending from the third outer surface 103 ′ of the base body 100 ′ along the second outer surface 102 ′, and is disposed around the semiconductor component 300 on the second outer surface 102 ′.
- the third protective portion 170 ′ may be integrated with the second outer surface 102 ′, may extend so as to contact the second outer surface 102 ′, or may be Z ⁇ with respect to the second outer surface 102 ′.
- the height position of the end surface in the Z direction of the third protection portion 170 ′ is preferably located on the Z direction side relative to the height position of the end surface in the Z direction of the semiconductor component 300 on the second outer surface 102 ′.
- the height position of the end surface in the Z direction of the third protection part 170 ′ is the same as the height position of the end surface in the Z direction of the semiconductor component 300 on the second outer surface 102 ′ or on the Z ′ direction side. Also good.
- the semiconductor component 300 is protected by the third protection unit 170 ′. 7A to 8A, the two third protection portions 170 'extend from the third outer surface 103' along the second outer surface 102 '.
- the third protection unit 170 ' can be omitted.
- the module M5 may further include at least one island portion 600 '.
- At least one island portion 600 ′ may be provided on the first outer surface 101 ′ or the second outer surface 102 ′ of the base body 100 ′ in any of the above aspects.
- At least one island portion 600 ′ may be formed of a metal plate, or may be formed of a metal film (including a plating film) as in the antenna 200 ′′.
- a semiconductor component 300 is placed on the island portion 600 ′. Note that the island portion 600 'can be omitted.
- the module M5 may further include a first conductor S, like the module M1.
- the module M5 described above has the following technical features. First, the module M5 has the same features as the first and second technical features of the module M1.
- the versatility of module M5 is improved.
- the reason is as follows.
- a semiconductor component 300 appropriately selected according to the application (for reception or transmission), function (communication speed or communication distance) of the module M5 is mounted on the first outer surface 101 ′ or the second outer surface 102 ′ of the base body 100 ′.
- the application and function of the module M5 can be changed by simply connecting the semiconductor component 300 to the internal connection unit 900 and the external connection unit 1000.
- the antenna 200 ′′ On the first outer surface 101 ′ (first height position) and the semiconductor component 300 on the second outer surface 102 ′ (second height position).
- the reason is as follows.
- the antenna 200 ′′ is provided on the first outer surface 101 ′.
- the semiconductor component 300 can be disposed at the second height position simply by mounting on the second outer surface 102 ′.
- the antenna 200 ′′, the internal connection portion 900, and the external connection portion 1000 are metal films formed on the base body 100 ′, the number of components of the module M5 is reduced.
- the antenna 200 ′′, the internal connection part 900, and the external connection part 1000 are metal films on the base body 100 ′, they can be freely patterned on the base body 100 ′.
- the antenna and / or the internal connection portion is made of a metal plate
- a mold for creating the antenna and / or the internal connection portion is required.
- the antenna 200 ′′, the internal connection portion 900, and the external connection portion 1000 are metal films on the base body 100 ′, a mold for forming the antenna 200 ′′, the internal connection portion 900, and the external connection portion 1000 is used. do not need. Therefore, the cost of the module M5 can be reduced.
- the contactless communication module described above is not limited to the above-described embodiment, and can be arbitrarily changed in design within the scope of the claims.
- the non-contact communication module can further include a second conductor.
- the second conductor is composed of a metal plate or a resin plate having a metal deposited on the outer surface.
- the second conductor is disposed in the Z direction with respect to the antennas 200, 200 ′, 200 ′′ (that is, between the antennas 200, 200 ′, 200 ′′ and the antenna of the counterpart communication device) and connected to the ground. Is done. More specifically, the second conductor is on or in the first outer surface 101, 101 ′ of the base body 100, 100 ′ so as to be positioned in the Z direction with respect to the antennas 200, 200 ′, 200 ′′. Is provided.
- the second conductor has an opening.
- the opening is located on the Z direction side with respect to at least a part of the antennas 200, 200 ′, 200 ′′.
- the antenna 200, 200 ′, 200 ′′ of any of the above-described modes is configured to transmit a signal by the electromagnetic field coupling method
- the electromagnetic field radiated from the antenna 200, 200 ′, 200 ′′ is the ground. It spreads in the direction of the connected second conductor. Since the opening is provided in the second conductor as described above, the electromagnetic field that has flowed from the antenna 200, 200 ′, 200 ′′ to the second conductor passes through the opening, and the antenna 200, 200 ′, 200 ′. It becomes easy to propagate to the antenna of the counterpart communication device located in the Z direction.
- the electromagnetic field radiated from the antennas 200, 200 ', 200' ' can flow in a desired direction (the direction of the antenna of the counterpart communication device).
- the antenna according to any one of the aspects described above is configured to receive a signal by the electromagnetic field coupling method
- the electromagnetic field output from the antenna of the counterpart communication device spreads in the direction of the second conductor connected to the ground. Since the opening is provided in the second conductor, an electromagnetic field that has flowed from the antenna of the counterpart communication device to the second conductor is easily propagated to the antennas 200, 200 ', and 200' 'through the opening.
- the electromagnetic field output from the antenna of the counterpart communication device can flow in a desired direction (directions of the antennas 200, 200 ', 200' ').
- the opening may be provided in the second conductor so as to surround the antenna body.
- the outer dimension of the opening may be made larger than the outer dimension of the antenna body, and the antenna body may be arranged in the opening in a planar position. This makes it easier for the electromagnetic field radiated from the antenna body to propagate through the opening to the antenna of the counterpart communication device, and the electromagnetic field output from the antenna of the counterpart communication device further opens the aperture. It becomes easier to propagate through the antenna body.
- the configuration of the second conductor described above is not limited to the case where the antennas 200, 200 ′, and 200 ′′ are of the electromagnetic coupling method, and electromagnetic waves other than the electromagnetic fields are transmitted from the antennas 200, 200 ′, and 200 ′′. Even if it is emitted, it is applicable.
- the non-contact communication module M1 can be configured to include a metal case S 'instead of the first conductor S.
- the non-contact communication module M1 "" has the same configuration as the non-contact communication module M1 except that the first conductor S is replaced with a metal case S '. At least a portion where the antenna 200 of the base body 100 is embedded is inserted into the metal case S ′ of the non-contact communication module M ⁇ b> 1 ′′ ′′. That is, the metal case S ′ surrounds the antenna 200.
- the metal case S ' includes a first plate S1', a second plate S2 ', a third plate S3', and a fourth plate S4 '.
- the third plate S3 ' connects the end of the first plate S1' in the X direction and the end of the second plate S2 'in the X direction.
- the fourth plate S4 ' connects the end in the X' direction of the first plate S1 'and the end in the X' direction of the second plate S2 '.
- the third plate S3 'and the fourth plate S4' are partially provided with notches, but the notches may not be provided.
- the first plate S ⁇ b> 1 ′ is disposed on the first outer surface 101 of the base body 100 ′′ so as to be positioned on the Z direction side of at least a part of the antenna 200.
- the first plate S1 ' functions as the second conductor described above.
- the first plate S1 ' has an opening S1a'.
- the opening S1a ' is provided in a portion on the Z direction side of at least a part of the antenna 200 of the first plate S1'.
- the opening S ⁇ b> 1 a ′ is disposed on the Z direction side of the substantially rectangular antenna body of the antenna 200. That is, the antenna body is located in the opening S1a 'when viewed from the Z direction.
- the second plate S ⁇ b> 2 ′ is disposed on the second outer surface 102 of the base body 100 ′′ so as to be positioned on at least a part of the antenna 200 on the Z ′ direction side.
- the metal case S ′ may further include a connection portion S5 ′.
- the connecting portion S5 ' can be connected to the ground line of the substrate of the electronic device.
- a through hole 120 may be provided in the base body 100 ′′ of the non-contact communication module M 1 ′′ ′′.
- the through-hole 120 penetrates the inner part of the antenna 200 of the base body 100 ′′ in the Z-Z ′ direction.
- the shape of the through hole 120 can be arbitrarily set.
- the through hole 120 has a T shape.
- a plurality of pieces 210 extending from the antenna 200 protrude into the through hole 120 from the wall surface of the through hole 120.
- the pieces 210 protrude from the wall surface in the X direction of the through hole 120, the wall surface in the X ′ direction of the through hole 120, and the wall surface in the Y direction of the through hole 120.
- the piece 210 is connected to a connecting material before the antenna 200 is insert-molded into the base body 100. After the insert molding, a plurality of pieces 210 and a connecting material are arranged in the through hole 120 of the base body 100. Thereafter, the piece 210 is separated from the connecting material and remains in a state in which the piece 210 protrudes into the through hole 120.
- the non-contact communication module other than the above-described non-contact communication module M1 can also be configured to include a metal case S 'instead of the first conductor S.
- the non-contact communication module base 100 other than the non-contact communication module M1 ′ ′′ described above can also be provided with a through hole 120, and a plurality of pieces projecting from the through hole 120 to the antenna 200.
- a portion 210 can be provided.
- the metal case S ′ may be provided in a module other than the non-contact communication module M ⁇ b> 1 ′′ ′′.
- an insulator may be interposed between the antenna 200 ′′, the internal connection portion 900 and / or the external connection portion 1000, and the metal case S ′ so as not to contact each other.
- the internal connection portions of the non-contact communication modules M1 'and M1 can be configured by all or part of a flexible substrate or a rigid flexible substrate (first substrate).
- the antenna 200 is provided on the first part of the internal connection part.
- the internal connection portion can be configured to be curved so that the antenna 200 is located at the first height position and the semiconductor component 300 is located at the second height position.
- the first substrate may have an external connection portion.
- the internal connection portions of the non-contact communication modules M1 'and M1 can be formed of a multilayer substrate.
- the multilayer substrate has a plurality of layers stacked in the first direction.
- the plurality of layers can be configured to include a first layer and a second layer.
- the first layer may have a configuration in which an antenna is provided and the antenna is disposed at the first height position.
- the second layer may have a configuration in which a semiconductor component is mounted and disposed so that the semiconductor component is positioned at the second height position.
- a plurality of layers may be provided between the first and second layers, or may not be provided.
- the antenna of the present invention is not limited to an antenna for non-contact communication, and can be an antenna for non-contact charging.
- the semiconductor component of the present invention is a semiconductor element, semiconductor chip, or insulation for causing the antenna to perform non-contact power transmission (non-contact power transmission or non-contact power reception).
- a semiconductor device packaged with resin is preferable.
- the configuration of the module of the present invention other than this can be the same as that of the module described above.
- the materials, shapes, dimensions, number, arrangement, etc. constituting each component of the non-contact communication module in the above-described embodiments and design modifications are examples, and as long as similar functions can be realized. It is possible to change the design arbitrarily.
- the above-described embodiments and design modification examples can be combined with each other as long as they do not contradict each other.
- the first direction of the present invention can be arbitrarily set.
- the second direction of the present invention can be arbitrarily set as long as it is orthogonal to the first direction of the present invention.
- Non-contact communication module 100 Base 101: First outer surface 102: Second outer surface 110: Housing hole 200: Antenna 300: Semiconductor component 400: Internal connection unit 500: External Connection part 510: First part 520: Second part 600: Island part 700: Substrate (third substrate) 700 ': Substrate (third substrate) 710 ′: external connection portion 711 ′: first portion 712 ′: second portion S: first conductor S ′: metal case S1 ′: first plate (second conductor) S1a ′: Opening S2 ′: Second plate (first conductor) M2: non-contact communication module 100: base 101: first outer surface 102: second outer surface 110: receiving hole 200: antenna 300: semiconductor component 800: substrate (first substrate) 810: Internal connection part 811: 1st part 812: 2nd part 813: Intermediate part 500: External connection part 510: 1st part 520: 2nd part M3, M3 ', M
Abstract
Description
100:基体
101:第1外面
102:第2外面
110:収容孔
200:アンテナ
300:半導体部品
400:内部接続部
500:外部接続部
510:第1部
520:第2部
600:アイランド部
700:基板(第3基板)
700’:基板(第3基板)
710’:外部接続部
711’:第1部
712’:第2部
S:第1導電体
S’:金属ケース
S1’:第1板(第2導電体)
S1a’:開口
S2’:第2板(第1導電体)
M2:非接触通信モジュール
100:基体
101:第1外面
102:第2外面
110:収容孔
200:アンテナ
300:半導体部品
800:基板(第1基板)
810:内部接続部
811:第1部
812:第2部
813:中間部
500:外部接続部
510:第1部
520:第2部
M3、M3’、M3’’:非接触通信モジュール
100:基体
101:第1外面
102:第2外面
110:収容孔
200’:アンテナ
300:半導体部品
400’:内部接続部
500:外部接続部
510:第1部
520:第2部
700:基板(第3基板)
700’:基板(第3基板)
710’:外部接続部
711’:第1部
712’:第2部
M4、M4’:非接触通信モジュール
100:基体
101:第1外面
102:第2外面
110:収容孔
200’:アンテナ
300:半導体部品
800’’:基板(第2基板)
810’’:内部接続部
811’’:第1部
811a’’:第1部のZ方向の面(第1面)
812’’:第2部
812a’’:実装面(第2面)
500:外部接続部
510:第1部
520:第2部
800’’’:基板(第2基板)
810’’’:内部接続部
811’’’:第1部
811a’’’:第1部のZ方向の面(第1面)
812’’’:第2部
812a’’’:実装面(第2面)
820’’’:外部接続部
821’’’:第1部
822’’’:第2部
M5:非接触通信モジュール
100’:基体
101’:第1外面
102’:第2外面
103’:第3外面
104’:第4外面
105’:第5外面
110’:厚肉部
120’:薄肉部
130’:第1めっき触媒
140’:第2めっき触媒
150’:第3めっき触媒
160’:第2保護部
170’:第3保護部
200’’:アンテナ
300:半導体部品
600’:アイランド部
900:内部接続部
1000:外部接続部
1100:第1部
1200:第2部
Claims (22)
- 絶縁樹脂製の基体であって、相手方通信装置が前記基体の第1方向の一方側に近距離配置され得る前記基体と、
相手方通信装置と非接触で通信可能となるように前記基体に前記第1方向における第1高さ位置で設けられたアンテナと、
前記アンテナに非接触で通信をさせるための半導体部品であって、前記基体に前記第1高さ位置又は前記第1高さ位置よりも前記第1方向の他方の第2高さ位置で設けられた前記半導体部品と、
前記アンテナと前記半導体部品とを電気的に接続した内部接続部と、
前記基体に設けられており且つ前記半導体部品に電気的に接続された第1部、及び前記基体外に突出又は露出した第2部を有する外部接続部とを備えている非接触通信モジュール。 - 請求項1記載の非接触通信モジュールにおいて、
前記アンテナは、前記基体内に前記第1高さ位置で設けられており、
前記半導体部品は、前記基体内に前記第1高さ位置又は前記第2高さ位置で設けられており、
前記外部接続部の前記第1部は、前記基体内に設けられている非接触通信モジュール。 - 請求項2記載の非接触通信モジュールにおいて、
前記内部接続部は、前記アンテナと前記半導体部品とを接続した金属板、リード線、ケーブル又は導電ワイヤーであり且つ前記基体内に設けられており、前記内部接続部は、前記アンテナが前記基体内の前記第1高さ位置に位置し且つ前記半導体部品が前記基体内の前記第2高さ位置に位置するように、折り曲げられている又は湾曲している非接触通信モジュール。 - 請求項2記載の非接触通信モジュールにおいて、
前記アンテナ及び前記内部接続部は、一枚の金属板で構成されており且つ前記基体内に設けられており、
前記内部接続部は、前記アンテナが前記基体内の前記第1高さ位置に位置し且つ前記半導体部品が前記基体内の前記第2高さ位置に位置するように、折り曲げられている又は湾曲している非接触通信モジュール。 - 請求項2記載の非接触通信モジュールにおいて、
前記内部接続部を有するフレキシブル基板又はリジッドフレキシブル基板である第1基板を更に備えており、
前記内部接続部が、前記基体内に設けられており、
前記内部接続部は、前記アンテナが設けられた第1部と、
前記半導体部品に電気的に接続された第2部と、
当該内部接続部の前記第1部と前記第2部の間の中間部とを有しており、
前記中間部は、前記アンテナが前記基体内の前記第1高さ位置に位置し且つ前記半導体部品が前記基体内の前記第2高さ位置に位置するように、湾曲している非接触通信モジュール。 - 請求項5記載の非接触通信モジュールにおいて、
前記第1基板は、前記外部接続部を更に有している非接触通信モジュール。 - 請求項2記載の非接触通信モジュールにおいて、
前記アンテナ及び前記内部接続部は、前記第1方向に直交する第2方向に延びた一枚の金属板で構成されており且つ前記基体内に設けられており、
前記半導体部品が、前記内部接続部よりも前記第1方向の他方側で当該内部接続部に接続されている非接触通信モジュール。 - 請求項2記載の非接触通信モジュールにおいて、
前記第1方向に直交する第2方向に延びた第2基板を更に備えており、
前記第2基板は、前記基体内に設けられた前記内部接続部を有しており、
前記内部接続部は、前記第1方向の一方側の第1面と、
前記第1方向の他方側の第2面とを有しており、
前記アンテナは、前記内部接続部の前記第1面上に設けられており、
前記半導体部品は、前記内部接続部の前記第2面上に実装されている又は前記内部接続部の前記第2面よりも前記第1方向の他方側で当該内部接続部に接続されている非接触通信モジュール。 - 請求項8記載の非接触通信モジュールにおいて、
前記第2基板は、前記外部接続部を更に有している非接触通信モジュール。 - 請求項2~5及び7~8の何れかに記載の非接触通信モジュールにおいて、
少なくとも部分的に前記基体内に設けられており且つ前記半導体部品が実装された第3基板を更に備えており、
前記内部接続部は、前記第3基板に接続されており且つ当該第3基板を介して前記半導体部品に接続されている非接触通信モジュール。 - 請求項10記載の非接触通信モジュールにおいて、
前記第3基板は、前記外部接続部を有している非接触通信モジュール。 - 請求項1~11の何れかに記載の非接触通信モジュールにおいて、
前記基体は、当該基体外に開口した収容孔を有しており、
前記内部接続部は、前記収容孔内に配置された突出部を有しており、
前記外部接続部の前記第1部は、前記収容孔内に配置された突出部を有しており、
前記半導体部品は、前記収容孔内に収容されており且つ前記収容孔内で前記内部接続部の前記突出部及び前記外部接続部の前記第1部の前記突出部に電気的に接続されている非接触通信モジュール。 - 請求項12記載の非接触通信モジュールにおいて、
前記基体は、前記収容孔の壁であって、前記収容孔内の前記半導体部品を取り囲む第1保護部を更に有している非接触通信モジュール。 - 請求項1記載の非接触通信モジュールにおいて、
前記基体は、前記第1高さ位置に位置する第1外面と、
前記第2高さ位置に位置する第2外面とを有しており、
前記アンテナは、前記第1外面上に設けられており、
前記半導体部品は、前記第1外面上又は前記第2外面上に実装されている非接触通信モジュール。 - 請求項14記載の非接触通信モジュールにおいて、
前記基体は、前記第1外面から前記第2外面まで延びた第3外面を更に有しており、
前記アンテナは、前記第1外面上に形成された金属膜であり、
前記内部接続部は、前記アンテナに連続するように、少なくとも前記第2外面及び前記第3外面上に形成された金属膜であり、
前記半導体部品は、前記第2外面上の前記内部接続部に直接接続されている非接触通信
モジュール。 - 請求項14記載の非接触通信モジュールにおいて、
前記基体は、前記第1外面から前記第2外面まで延びた第3外面を更に有しており、
前記内部接続部は、前記アンテナに接続されるように、少なくとも前記第2外面及び前記第3外面上に形成された金属膜であり、
前記半導体部品は、前記第2外面上の前記内部接続部に直接接続されている非接触通信モジュール。 - 請求項15又は16記載の非接触通信モジュールにおいて、
前記外部接続部は、前記基体の少なくとも前記第2外面上に形成された金属膜であり、
前記外部接続部の前記第1部は、前記第2外面上に位置しており、
前記半導体部品は、前記第2外面上の前記内部接続部及び前記外部接続部の前記第1部に直接接続されている非接触通信モジュール。 - 請求項14~17の何れかに記載の非接触通信モジュールにおいて、
前記基体は、前記第2外面から前記第1方向に延びており且つ前記半導体部品の周りに配置された少なくとも一つの第2保護部を更に有している非接触通信モジュール。 - 請求項15~17の何れかに記載の非接触通信モジュールにおいて、
前記基体は、前記第3外面から前記第2外面に沿って延びており且つ前記半導体部品の周りに配置された少なくとも一つの第3保護部を更に有している非接触通信モジュール。 - 請求項1~5、7~8、10及び14~16の何れかに記載の非接触通信モジュールにおいて、
前記外部接続部は端子、ピン、リード線又はケーブルである非接触通信モジュール。 - 請求項1~20の何れかに記載の非接触通信モジュールにおいて、
前記アンテナに対して前記第1方向の他方側に配置された第1導電体を更に備えている非接触通信モジュール。 - 請求項1~20の何れかに記載の非接触通信モジュールにおいて、
前記アンテナに対して前記第1方向の一方側に配置されており且つグランド接続される第2導電体を更に備えており、
前記第2導電体は、開口を有しており、
前記開口は、前記アンテナの少なくとも一部に対して前記第1方向の一方側に位置している非接触通信モジュール。
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