HK1062926A1 - Regeneration method for a plating solution. - Google Patents

Regeneration method for a plating solution.

Info

Publication number
HK1062926A1
HK1062926A1 HK04105703A HK04105703A HK1062926A1 HK 1062926 A1 HK1062926 A1 HK 1062926A1 HK 04105703 A HK04105703 A HK 04105703A HK 04105703 A HK04105703 A HK 04105703A HK 1062926 A1 HK1062926 A1 HK 1062926A1
Authority
HK
Hong Kong
Prior art keywords
tin
ions
solution
regeneration
plating solution
Prior art date
Application number
HK04105703A
Other languages
English (en)
Inventor
Thomas Beck
Hans-Jurgen Schreier
Sven Lamprecht
Rolf Schoder
Kai-Jens Matejat
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1062926A1 publication Critical patent/HK1062926A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Electrolytic Production Of Metals (AREA)
HK04105703A 2001-07-03 2004-08-03 Regeneration method for a plating solution. HK1062926A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10132478A DE10132478C1 (de) 2001-07-03 2001-07-03 Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
PCT/EP2002/006654 WO2003004725A2 (en) 2001-07-03 2002-06-17 Regeneration method for a plating solution

Publications (1)

Publication Number Publication Date
HK1062926A1 true HK1062926A1 (en) 2004-12-03

Family

ID=7690626

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04105703A HK1062926A1 (en) 2001-07-03 2004-08-03 Regeneration method for a plating solution.

Country Status (16)

Country Link
US (1) US20040245108A1 (de)
EP (1) EP1427869B1 (de)
JP (1) JP4157838B2 (de)
KR (1) KR100827259B1 (de)
CN (1) CN1232677C (de)
AT (1) ATE289633T1 (de)
AU (1) AU2002321069A1 (de)
BR (1) BR0210829B1 (de)
CA (1) CA2450258A1 (de)
DE (2) DE10132478C1 (de)
ES (1) ES2236552T3 (de)
HK (1) HK1062926A1 (de)
MX (1) MXPA03011772A (de)
MY (1) MY130423A (de)
TW (1) TWI279456B (de)
WO (1) WO2003004725A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130093154A (ko) 2003-07-16 2013-08-21 인터디지탈 테크날러지 코포레이션 무선 통신 시스템의 네트워크 관리 엔티티들간의 정보 전송 방법 및 시스템
EP1630252A1 (de) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
EP2298960A1 (de) 2009-08-24 2011-03-23 ATOTECH Deutschland GmbH Verfahren zum stromlosen Abscheiden von Zinn und Zinnlegierungen
DE102009060676B4 (de) 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
CN102586851B (zh) * 2011-01-06 2015-03-04 宝山钢铁股份有限公司 一种缓解并减少镀锡溶液产生锡泥的电解方法
EP2671968B1 (de) * 2012-06-05 2014-11-26 ATOTECH Deutschland GmbH Verfahren und Regenerierungsvorrichtung zur Regenerierung einer Plattierungszusammensetzung
CN106868577B (zh) * 2015-05-12 2018-06-08 江苏理工学院 减少污染的超临界复合电铸体系回收利用装置
CN106011810B (zh) * 2016-06-02 2019-01-11 东莞市智源电子科技有限公司 铜基材的化学锡镀液中四价锡的去除工艺
US20190271093A1 (en) * 2016-10-24 2019-09-05 Atotech Deutschland Gmbh A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method
CN110387540A (zh) * 2019-08-30 2019-10-29 江苏上达电子有限公司 一种化锡槽内二价锡的补充系统及方法
CN111676470A (zh) * 2020-05-29 2020-09-18 广东天承科技有限公司 一种简易可溶性的高价锡的还原方法
CN114232030B (zh) * 2021-12-23 2023-04-18 广东鑫菱环境科技有限公司 一种pcb甲基磺酸退锡废液循环再生方法
WO2024116456A1 (ja) * 2022-11-28 2024-06-06 株式会社村田製作所 めっき組成物の再生方法および再生装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1527576A (en) * 1923-02-19 1925-02-24 Wheeling Steel & Iron Company Process of coating conducting materials with tin
US3784455A (en) * 1971-12-28 1974-01-08 Western Electric Co Methods of electrolytic regenerative etching and metal recovery
DE2401719B2 (de) * 1974-01-15 1978-01-19 Vereinigte Aluminium Werke Ag, 5300 Bonn Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden
JPS5226315A (en) * 1975-08-25 1977-02-26 Fuji Photo Film Co Ltd Process for the recovery of silver from fixer
DE2742718C2 (de) * 1977-09-22 1984-04-19 ESTEL HOOGOVENS B.V., 1970 Ijmuiden Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten
US4432844A (en) * 1982-01-28 1984-02-21 Fujisash Company Process for regeneration of electrolyte containing tin salts by reducing the same
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
DE3634710A1 (de) * 1986-10-11 1988-04-21 Ver Glaswerke Gmbh Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung
CA2083196C (en) * 1991-11-27 1998-02-17 Randal D. King Process for extending the life of a displacement plating bath
JPH06256999A (ja) * 1993-03-05 1994-09-13 Kawasaki Steel Corp 錫めっき液を回収再生する方法
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
US5705048A (en) * 1996-03-27 1998-01-06 Oxley Research, Inc. Apparatus and a process for regenerating a CUCl2 etchant
DE19719020A1 (de) * 1997-05-07 1998-11-12 Km Europa Metal Ag Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体

Also Published As

Publication number Publication date
BR0210829B1 (pt) 2011-07-26
ES2236552T3 (es) 2005-07-16
EP1427869B1 (de) 2005-02-23
MXPA03011772A (es) 2004-04-02
BR0210829A (pt) 2005-05-03
EP1427869A2 (de) 2004-06-16
DE10132478C1 (de) 2003-04-30
JP4157838B2 (ja) 2008-10-01
TWI279456B (en) 2007-04-21
KR20040030725A (ko) 2004-04-09
DE60203050D1 (de) 2005-03-31
KR100827259B1 (ko) 2008-05-07
JP2004534151A (ja) 2004-11-11
MY130423A (en) 2007-06-29
CA2450258A1 (en) 2003-01-16
US20040245108A1 (en) 2004-12-09
DE60203050T2 (de) 2006-02-23
WO2003004725A3 (en) 2004-04-15
WO2003004725A2 (en) 2003-01-16
CN1232677C (zh) 2005-12-21
CN1524132A (zh) 2004-08-25
ATE289633T1 (de) 2005-03-15
AU2002321069A1 (en) 2003-01-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150617