HK1058334A1 - Heat-resistant resin film with metal layer and wiring board, and method for manufaacturing them - Google Patents

Heat-resistant resin film with metal layer and wiring board, and method for manufaacturing them

Info

Publication number
HK1058334A1
HK1058334A1 HK04101150A HK04101150A HK1058334A1 HK 1058334 A1 HK1058334 A1 HK 1058334A1 HK 04101150 A HK04101150 A HK 04101150A HK 04101150 A HK04101150 A HK 04101150A HK 1058334 A1 HK1058334 A1 HK 1058334A1
Authority
HK
Hong Kong
Prior art keywords
manufaacturing
heat
metal layer
wiring board
resin film
Prior art date
Application number
HK04101150A
Other languages
English (en)
Inventor
Masahiro Oguni
Miyoshi Yokura
Toshio Yoshimura
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001155171A external-priority patent/JP2002347171A/ja
Priority claimed from JP2001277912A external-priority patent/JP2003086937A/ja
Application filed by Toray Industries filed Critical Toray Industries
Publication of HK1058334A1 publication Critical patent/HK1058334A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
HK04101150A 2001-05-24 2004-02-18 Heat-resistant resin film with metal layer and wiring board, and method for manufaacturing them HK1058334A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001155171A JP2002347171A (ja) 2001-05-24 2001-05-24 樹脂付き金属箔及び樹脂付き金属箔を用いた配線板
JP2001277912A JP2003086937A (ja) 2001-09-13 2001-09-13 ３層型メッキプリント回路基板
PCT/JP2002/004773 WO2002094558A1 (fr) 2001-05-24 2002-05-17 Film en en resine thermoresistant a couche metallique, et panneau de cablage, et procede de fabrication du film et du panneau

Publications (1)

Publication Number Publication Date
HK1058334A1 true HK1058334A1 (en) 2004-05-14

Family

ID=26615625

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04101150A HK1058334A1 (en) 2001-05-24 2004-02-18 Heat-resistant resin film with metal layer and wiring board, and method for manufaacturing them

Country Status (7)

Country Link
US (1) US20030170431A1 (fr)
EP (1) EP1407879A4 (fr)
KR (1) KR20030016409A (fr)
CN (1) CN100344444C (fr)
HK (1) HK1058334A1 (fr)
TW (1) TW525420B (fr)
WO (1) WO2002094558A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200502319A (en) * 2002-12-13 2005-01-16 Kaneka Corp Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
JP2005317836A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 配線回路基板およびその製造方法
KR20070040826A (ko) * 2004-08-05 2007-04-17 가부시키가이샤 가네카 용액, 도금용 재료, 절연 시트, 적층체 및 인쇄 배선판
KR101195730B1 (ko) * 2004-10-14 2012-10-29 가부시키가이샤 가네카 도금용 재료, 상기 도금용 재료에 사용되는 폴리아미드산 용액, 폴리이미드 수지 용액 및 이들을 사용하여 제조되는 인쇄 배선판
JP4892834B2 (ja) * 2004-12-27 2012-03-07 宇部興産株式会社 接着性の改良されたポリイミドフィルム、その製法および積層体
KR100902928B1 (ko) * 2007-12-06 2009-06-15 엘지전자 주식회사 연성 필름, 그를 포함하는 표시 장치, 및 표시 장치의 제조방법
CN105816498A (zh) 2009-04-27 2016-08-03 玫琳凯有限公司 植物性抗痤疮制剂
JP5614217B2 (ja) * 2010-10-07 2014-10-29 デクセリアルズ株式会社 マルチチップ実装用緩衝フィルム
TW201239356A (en) * 2011-03-25 2012-10-01 Eps Bio Technology Corp Method of making a biochemical test strip
JP5127086B1 (ja) * 2011-03-31 2013-01-23 Ｊｘ日鉱日石金属株式会社 金属箔複合体及びそれを用いたフレキシブルプリント基板、並びに成形体及びその製造方法
CN103998022B (zh) 2011-12-19 2018-01-30 玫琳凯有限公司 用于改善肤色的植物提取物的组合
WO2015138237A1 (fr) 2014-03-10 2015-09-17 Mary Kay Inc. Compositions d'éclaircissement cutané
CN114786327A (zh) * 2015-01-19 2022-07-22 松下知识产权经营株式会社 多层印刷线路板、多层覆金属层压板和涂布有树脂的金属箔
EP3999577A1 (fr) * 2019-07-18 2022-05-25 SHPP Global Technologies B.V. Composition thermoplastique et articles métallisés préparés à partir de cette dernière
CN113584537B (zh) * 2021-08-03 2023-01-06 东强（连州）铜箔有限公司 一种带树脂层的极低粗糙度的极薄铜箔及其制造方法

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US3732792A (en) * 1970-12-14 1973-05-15 Ppg Industries Inc Image plane plate
US3932689A (en) * 1973-10-13 1976-01-13 Sumitomo Bakelite Company, Limited Flexible adhesive composition and method for utilizing same and article formed therefrom
JPS6031918B2 (ja) * 1977-09-26 1985-07-25 日本電解株式会社 フレキシブル銅張板の製造法
US4407883A (en) 1982-03-03 1983-10-04 Uop Inc. Laminates for printed circuit boards
EP0133533B1 (fr) * 1983-08-01 1993-04-21 Hitachi, Ltd. Matière résineuse à faible dilatation thermique pour film isolant.
JP2932397B2 (ja) * 1990-11-14 1999-08-09 日本真空技術株式会社 プリント基板の製造方法
JPH0621794A (ja) * 1992-02-20 1994-01-28 Sharp Corp ＣＢｉＣＭＯＳゲート
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JP3265027B2 (ja) 1993-01-20 2002-03-11 三菱伸銅株式会社 金属膜付きポリイミドフィルム
EP0618269B1 (fr) * 1993-04-02 1998-11-11 Hitachi, Ltd. Compositions de résine thermodurcissable et leur utilisation pour la fabrication d'objets en résine synthétique et de plaques de circuit à films minces
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JPH10317152A (ja) * 1997-05-14 1998-12-02 Arisawa Mfg Co Ltd 銅層を有する基材及びその製造方法
JP3786157B2 (ja) * 1998-07-31 2006-06-14 宇部興産株式会社 接着性の改良されたポリイミドフィルム、その製法および積層体
JP3565069B2 (ja) * 1998-12-28 2004-09-15 ソニーケミカル株式会社 両面フレキシブルプリント基板の製造方法
US6548179B2 (en) * 2000-08-24 2003-04-15 Dupont-Toray Co., Ltd. Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate

Also Published As

Publication number Publication date
CN100344444C (zh) 2007-10-24
TW525420B (en) 2003-03-21
KR20030016409A (ko) 2003-02-26
WO2002094558A1 (fr) 2002-11-28
EP1407879A4 (fr) 2006-04-12
US20030170431A1 (en) 2003-09-11
EP1407879A1 (fr) 2004-04-14
CN1462236A (zh) 2003-12-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110517