HK1044737A1 - Method for manufacturing encapsulated electronicalcomponents. - Google Patents

Method for manufacturing encapsulated electronicalcomponents.

Info

Publication number
HK1044737A1
HK1044737A1 HK02105587A HK02105587A HK1044737A1 HK 1044737 A1 HK1044737 A1 HK 1044737A1 HK 02105587 A HK02105587 A HK 02105587A HK 02105587 A HK02105587 A HK 02105587A HK 1044737 A1 HK1044737 A1 HK 1044737A1
Authority
HK
Hong Kong
Prior art keywords
electronic components
electrically conducting
adhesive film
conducting support
support
Prior art date
Application number
HK02105587A
Other languages
English (en)
Inventor
Johannes Bernardus Pet Janssen
Johannes Bernardus De Vrught
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19769109&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1044737(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Publication of HK1044737A1 publication Critical patent/HK1044737A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2924/3025—Electromagnetic shielding
HK02105587A 1999-04-29 2002-07-30 Method for manufacturing encapsulated electronicalcomponents. HK1044737A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011929A NL1011929C2 (nl) 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen.
PCT/NL2000/000280 WO2000066340A1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronical components

Publications (1)

Publication Number Publication Date
HK1044737A1 true HK1044737A1 (en) 2002-11-01

Family

ID=19769109

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02105587A HK1044737A1 (en) 1999-04-29 2002-07-30 Method for manufacturing encapsulated electronicalcomponents.

Country Status (11)

Country Link
US (2) US6613607B2 (nl)
EP (2) EP1338397A3 (nl)
JP (2) JP2002543604A (nl)
KR (1) KR100701720B1 (nl)
AT (1) ATE258846T1 (nl)
AU (1) AU4624900A (nl)
DE (1) DE60008093T2 (nl)
HK (1) HK1044737A1 (nl)
NL (1) NL1011929C2 (nl)
SG (1) SG121813A1 (nl)
WO (1) WO2000066340A1 (nl)

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NL1020594C2 (nl) 2002-05-14 2003-11-17 Fico Bv Werkwijze voor het met behulp van een folielaag omhullen van een elektronische component.
TW560026B (en) * 2002-08-27 2003-11-01 Uni Tek System Inc Singulation method of the array-type work piece to be singulated having metal layer singulation street, and the array-type work piece to be singulated applying the method
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
US7238551B2 (en) * 2004-11-23 2007-07-03 Siliconix Incorporated Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
US7394150B2 (en) * 2004-11-23 2008-07-01 Siliconix Incorporated Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
US20070130759A1 (en) * 2005-06-15 2007-06-14 Gem Services, Inc. Semiconductor device package leadframe formed from multiple metal layers
GB0516625D0 (en) * 2005-08-15 2005-09-21 Eurocut Ltd Orthopaedic surgical instrument
JP4782522B2 (ja) * 2005-09-27 2011-09-28 ソニーケミカル＆インフォメーションデバイス株式会社 光機能素子パッケージ及びその製造方法
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US6921682B2 (en) 2005-07-26
WO2000066340A1 (en) 2000-11-09
US20020064926A1 (en) 2002-05-30
KR100701720B1 (ko) 2007-03-29
EP1338397A3 (en) 2004-03-24
AU4624900A (en) 2000-11-17
EP1175290B1 (en) 2004-02-04
NL1011929C2 (nl) 2000-10-31
JP3744927B2 (ja) 2006-02-15
US20040005737A1 (en) 2004-01-08
EP1338397A2 (en) 2003-08-27
DE60008093D1 (de) 2004-03-11
EP1175290A1 (en) 2002-01-30
SG121813A1 (en) 2006-05-26
US6613607B2 (en) 2003-09-02
JP2004349728A (ja) 2004-12-09
JP2002543604A (ja) 2002-12-17
KR20020000883A (ko) 2002-01-05
ATE258846T1 (de) 2004-02-15

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