HK1037692A1 - Method for partially plating on a base - Google Patents

Method for partially plating on a base

Info

Publication number
HK1037692A1
HK1037692A1 HK01108332A HK01108332A HK1037692A1 HK 1037692 A1 HK1037692 A1 HK 1037692A1 HK 01108332 A HK01108332 A HK 01108332A HK 01108332 A HK01108332 A HK 01108332A HK 1037692 A1 HK1037692 A1 HK 1037692A1
Authority
HK
Hong Kong
Prior art keywords
plating
base
bases
plated
assembly
Prior art date
Application number
HK01108332A
Other languages
English (en)
Inventor
Ryoh Itoh
Original Assignee
Ryoh Itoh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoh Itoh filed Critical Ryoh Itoh
Publication of HK1037692A1 publication Critical patent/HK1037692A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
HK01108332A 1999-12-21 2001-11-27 Method for partially plating on a base HK1037692A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36333699 1999-12-21

Publications (1)

Publication Number Publication Date
HK1037692A1 true HK1037692A1 (en) 2002-02-15

Family

ID=18479078

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01108332A HK1037692A1 (en) 1999-12-21 2001-11-27 Method for partially plating on a base

Country Status (9)

Country Link
US (1) US6743477B2 (ko)
EP (1) EP1111090B1 (ko)
KR (1) KR100495340B1 (ko)
CN (1) CN1323190C (ko)
AT (1) ATE509137T1 (ko)
DK (1) DK1111090T3 (ko)
HK (1) HK1037692A1 (ko)
SG (1) SG92768A1 (ko)
TW (1) TWI238031B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5095909B2 (ja) 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 触媒組成物および析出方法
DE10348734B4 (de) * 2003-10-16 2006-04-20 OTB Oberflächentechnik in Berlin GmbH & Co. Verfahren zum selektiven Galvanisieren von Metalloberflächen und Selektiv-Galvanisierungssystem für Metalloberflächen
EP1767663A1 (en) * 2005-09-23 2007-03-28 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method for partially metallizing a product
CN101517124B (zh) * 2006-09-26 2012-05-02 帝斯曼知识产权资产管理有限公司 一种金属化构件的方法
CN101082126B (zh) * 2007-07-10 2010-05-19 东莞市通旺达五金制品有限公司 一种铝散热器内孔局部化学镀工艺
KR100959878B1 (ko) 2008-05-16 2010-05-27 (주)옵티스 베이스의 부분 도금방법
CN103220884A (zh) * 2012-01-18 2013-07-24 光宏精密股份有限公司 线路基板结构及其制作方法
CN103074651B (zh) * 2013-02-16 2015-05-13 马国荣 用于盖板局部镀金的电镀夹具
US9506150B2 (en) * 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
KR101866081B1 (ko) * 2016-10-31 2018-06-08 현대자동차주식회사 자동차용 수지 부품의 부분 도금 방법 및 이를 통해 도금된 자동차용 수지 부품
CN106543564A (zh) * 2016-11-25 2017-03-29 厦门建霖工业有限公司 一种可以用水进行粗化的水电镀材料的制备方法
CN111155075A (zh) * 2019-12-31 2020-05-15 娄底市安地亚斯电子陶瓷有限公司 一种异形陶瓷二次金属化方法
CN113355661B (zh) * 2021-05-31 2023-01-03 江苏软讯科技有限公司 一种高活性高稳定胶体钯催化剂及其制备工艺

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JPS59133359A (ja) * 1983-01-18 1984-07-31 Sanritsu Kogyo Kk 無電解メツキ法
JPS61108195A (ja) * 1984-11-01 1986-05-26 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 基板上に電気的に連続した層を形成する方法
US4865873A (en) * 1986-09-15 1989-09-12 General Electric Company Electroless deposition employing laser-patterned masking layer
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
JPH0660416B2 (ja) * 1986-11-18 1994-08-10 三共化成株式会社 プラスチック成形品の製法
JPS63157876A (ja) * 1986-12-20 1988-06-30 Toobi:Kk 金属パタ−ンプリントフイルムの製造方法
JP2603828B2 (ja) 1986-12-27 1997-04-23 三共化成 株式会社 回路基板等の成形品の製法
US4940608A (en) * 1988-11-07 1990-07-10 Okuno Chemical Industry Co., Ltd. Local electroless plating process for plastics
JP2966031B2 (ja) * 1989-07-25 1999-10-25 大日本印刷株式会社 微細パターンの形成方法
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5156732A (en) * 1990-07-11 1992-10-20 Sumitomo Metal Mining Co. Ltd. Polyimide substrate and method of manufacturing a printed wiring board using the substrate
JPH05202483A (ja) * 1991-04-25 1993-08-10 Shipley Co Inc 無電解金属化方法と組成物
US5225315A (en) * 1991-09-19 1993-07-06 Dymax Corporation Water soluble formulation for masking and the like, and method utilizing the same
JP3016922B2 (ja) 1991-09-30 2000-03-06 ローム株式会社 合成樹脂製回路基板における導体パターンの形成方法
JPH077245A (ja) * 1993-06-18 1995-01-10 Hitachi Chem Co Ltd 水溶性レジスト
JPH07316825A (ja) * 1994-05-25 1995-12-05 Sankyo Kasei Co Ltd 部分メッキした芳香族系ポリエステル液晶ポリマー成形品の製造法
EP0861923B1 (en) * 1997-02-26 1999-12-29 Murata Manufacturing Co., Ltd. Activating catalytic solution for electroless plating and method for electroless plating
JP4012600B2 (ja) * 1997-06-23 2007-11-21 富士通株式会社 酸感応性重合体、レジスト組成物、レジストパターン形成方法、および半導体装置の製造方法
JP3031459B2 (ja) 1997-06-26 2000-04-10 大塚化学株式会社 立体回路基板の作製方法
JP3616488B2 (ja) * 1997-11-10 2005-02-02 三共化成株式会社 成形回路部品の製造方法
JPH11186697A (ja) * 1997-12-19 1999-07-09 Fuji Film Olin Kk 金属画像の形成方法
JP3997590B2 (ja) * 1998-02-05 2007-10-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
EP1008910A1 (en) * 1998-12-11 2000-06-14 Shipley Company LLC Photoimageable compositions having improved stripping ability and resolution

Also Published As

Publication number Publication date
EP1111090A2 (en) 2001-06-27
ATE509137T1 (de) 2011-05-15
SG92768A1 (en) 2002-11-19
TWI238031B (en) 2005-08-11
US6743477B2 (en) 2004-06-01
EP1111090B1 (en) 2011-05-11
US20010019739A1 (en) 2001-09-06
EP1111090A3 (en) 2003-07-09
KR100495340B1 (ko) 2005-06-14
KR20010062231A (ko) 2001-07-07
CN1323190C (zh) 2007-06-27
CN1300877A (zh) 2001-06-27
DK1111090T3 (da) 2011-08-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20121220