CN102714163A - 非导体基材镀敷的改良方法 - Google Patents
非导体基材镀敷的改良方法 Download PDFInfo
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Abstract
本发明描述了一种处理能够被激光活化的热塑性基材的方法，该热塑性基材中分散有金属化合物。该基材与一种含水组合物接触，该含水组合物包含：(i)硫醇官能有机化合物；(ii)乙氧基化醇表面活性剂；和(iii)黄原胶。通过使用该处理组合物，当该基材此后被激光活化并以无电镀敷方法镀敷时，可本质上消除基材上无关的镀敷。
Description
技术领域
本发明涉及用于改良非导体基材镀敷的处理组成物。
背景技术
模制的单片制品可用于例如形成印刷电路板。在许多情况下，使用两个独立的模制步骤来形成所述制品的两个部分。双射成型是将两种射出成型的聚合物组合来制造具有两个部分的装置例如模制互连装置(包括印刷电路板)的方法。此方法也用于制造双色模制塑料制品和用于将硬塑料和软塑料组合在一个模制零件上。
模制互连装置(MID)被运用于许多种产业及应用中，包括例如，传感器、开关、连接器、仪表板和控制器。在模制的塑胶结构上，MID一般在模制的塑料结构上具有至少一个通常由镀敷导电金属产生的电气轨迹。
一种制造MID的方法包括使用第一塑料材料在塑模中模制部分结构，接着将在第一塑模中已经制造的结构置于第二塑模中，然后以第二塑料材料模制该零件的第二部分。对这两种塑料材料进行选择以便使得导电性材料能够镀敷于其中的一种塑料材料之上而不能镀敷于另一种塑料材料之上。能够镀敷于可镀塑料上的导电性材料成为导电性轨迹或其它特征。这种导电性轨迹可向应用的元件送入或从中送出数据信号、控制信号或电力。可使用光成像方法，该方法中应用掩模并且将所覆盖的掩模有选择地曝露于紫外光(UV)中以有选择地硬化掩模以形成非电路区域。化学去除未曝光的掩模部分以露出电路图案。然后用铜或其它金属镀敷该图案以获得期望的电路性能。
在塑料注射成型的最近发展中，已可用单射的方式模制MID。例如，可由单一的光敏非导体材料例如掺杂有机金属络合物的热塑性塑料来产生结构。然后例如通过激光在模制结构上写入互连路径，该激光使金属原子脱离有机配位体从而可使所述金属原子作为铜镀敷的晶核。激光光束在基材的表面产生局部活化，从而制作出所需的电路布置图。之后，将其浸入金属镀浴液(通常为铜)中，从而金属镀敷在已被激光光束蚀刻的区域上，进而在所述区域中产生轨迹或其它特征。这种方法被称为激光直写结构(LaserDirect Structure,LDS)法，该方法为设计者提供了更简单的单射模制方法，其可在模制工艺完全之后不需要更换工具的条件下创建电路图，并且该方法能够产生具有更高分辨率及更小覆盖区的元件。
该LDS方法提供了一种简单的三步骤法，其包括：(1)利用含金属化合物的可激光活化的非导体基材，以标准注射成型法来创建基材；(2)用激光活化非导体材料，以便金属化合物分解成为它的伴生金属，该金属作为在基材上进行后续无电镀敷的种子层；以及(3)无电镀敷非导体基材的活化部分。
激光活化步骤创造出了一种微蚀刻的表面，该表面为后续施用于其上的无电金属提供了极为优异的结合特性。无电金属可包括铜或铜合金，但是也可以使用其它无电金属。
由这种LDS方法形成的基材伴随的一个问题是会发生无关的镀敷(extraneous plating)，特别是在基材的粗糙区域上或者基材的机械损伤区域上。
基于此，本发明的一个目的是提供一种处理模制互连装置的方法，以避免不良的无关镀敷。
发明内容
本发明的一个目的是提供一种处理金属浸渍的(metalimpregnated)非导体基材的方法。
本发明的另一个目的是提供一种处理可激光活化的模制互连装置(MID)的方法。
本发明的另一个目的是提供一种使可激光活化的MID上的无关镀敷降至最低的方法。
为此，本发明一般地涉及一种处理可激光活化的非导体基材的方法，此方法包括下列步骤：
a)用含水组合物处理所述非导体基材，该含水组合物包含：
i)硫醇官能有机化合物的含水混合物；
ii)优选地，表面活性剂；和
iii)优选地，黄原胶(xanthan gum)；和
b)激光活化所述非导体基材的表面。
在另一个实施方式中，本发明一般地涉及一种处理激光活化的热塑性基材的方法，所述热塑性基材中分散有金属化合物，此方法包括下列步骤：
a)将所述基材与含水组合物接触，该含水组合物包含：
i)硫醇官能有机化合物的含水混合物；
ii)优选地，表面活性剂；和
iii)优选地，黄原胶；和
b)有选择地将该基材与激光光束接触，使得基材与激光光束接触的部分变得易于接受无电镀敷；
由此，当该处理的激光活化的基材随后以无电镀敷进行镀敷时，能够本质上消除基材上的无关镀敷。
具体实施方式
如上所述，可以使用含有金属化合物并能够被激光活化的非导体材料来制造模制互连装置(MID)和其它类似基材。激光处理活化了非导体基材的选择区域，所述区域接着镀敷以无电金属，例如无电铜或铜合金。伴随这种类型的基材和其加工方法的一个问题是会发生无关的镀敷，特别是在元件的粗糙区域上或者是在元件的其它被机械磨损或粗糙化的区域上。
本发明的发明人已发现，用本发明的处理组合物来处理含金属的非导体基材能够本质上消除或防止无关镀敷的出现。
本发明的处理组合物典型地包含：
a)硫醇官能有机化合物的含水混合物；
b)优选地，表面活性剂；和
c)优选地，黄原胶。
通常，使用黄原胶和表面活性剂在水中乳化所述硫醇官能有机化合物。
黄原胶在组合物中的浓度优选在约1~10克/升的范围内。
表面活性剂优选乙氧基化醇，更优选C-10醇乙氧基化物。然而，其它类似的表面活性剂也可用于本发明。适合的乙氧基化醇为例如购自BASF公司的商品名称为
的产品。乙氧基化醇在组合物中的浓度优选在约0.1~10克/升的范围内。
硫醇(Thiol)为含有-SH官能团的有机化合物，其亦称为硫醇(mercaptan)。可用于本发明组合物的各种硫醇包括，例如C12~C18链长的硫醇。例如但非限制性地适合的硫醇官能有机物包括烷硫醇，如十二烷硫醇、月桂基硫醇、鲸蜡基硫醇(cetyl mercaptan)和硬脂基硫醇(stearyl mercaptan)，以及巯基乙酸烷基酯、巯基乙酸硬脂基酯、巯基乙酸鲸蜡基酯、甲基硫醇、正丁基硫醇、环己基硫醇、正十二烷基硫醇、正丙基硫醇、正辛基硫醇和叔壬基硫醇。在一个实施方式中，硫醇官能有机物为硬脂基硫醇。
通常可用于本发明组合物中的硫醇官能有机化合物的浓度为约1~20克/升。
本发明的含水乳化液组合物特别适用于处理可激光活化的MID或其它类似基材的表面，所述类似基材包含如热塑性树脂、热固性树脂和陶瓷等非导体材料，所述非导体材料以浸渍或者其它方式含有分散于其中的铜或其它金属化合物。所述处理组合物的应用有利地消除了这些非导体基材上的无关镀敷。
例如但非限制性地该非导体基材可包括，例如热塑性树脂、热固性树脂或陶瓷材料。在一个实施方式中，非导体基材包含热塑性树脂，如聚碳酸酯/丙烯腈-丁二烯-苯乙烯(PC/ABS)混合树脂、交联聚对苯二甲酸丁二醇酯(PBT)、尼龙、液晶聚合物或其它类似材料。
所述金属化合物典型地包含非导电金属氧化物，如Naundorf等人的第7,060,421号美国专利及Zaderej的第2008/0171181号美国专利公开中所述，其各自主题的完整内容皆由引用方式并入本文。在一个实施方式中，该金属化合物含有铜。
激光用来提供电磁辐射，以将金属核从金属化合物中释放出来。在一个实施方式中，激光为市售Nd:YAG激光。实施本发明时也可使用其它激光。
本发明还涉及一种处理非导体基材的方法，所述非导体基材中分散有含有金属的化合物，其中该非导体基材能够被激光选择性活化以利于在其上镀敷，该方法包括以下步骤：
a)用含水组合物处理非导体基材，该含水组合物包含：
i)硫醇官能有机化合物；
ii)优选地，表面活性剂；和
iii)优选地，黄原胶；
b)有选择地激光活化所述非导体基材的部分表面；
之后，通过在基材的活化部分上无电镀敷的方式来镀敷该经处理并活化的基材。
非导体基材通常可由各种方式与含水组合物接触，包括但不限于浸渍、喷涂和水平溢流。其它方法也为本领域技术人员所公知。
优选地，将所述组合物在约50℃的温度下与非导体基材接触足够长的时间以获得所需的结果。然而，预期20~70℃的温度也可以使用。除此之外，基于接触的方法，接触时间一般在约10~300秒的范围内。
Claims (14)
1.一种处理能够被激光活化的非导体基材的方法，该方法包括下列步骤：
a)用含水组合物处理该非导体基材，该含水组合物包含：
i)硫醇官能有机化合物；和
ii)优选地，表面活性剂；
b)有选择地激光活化该非导体基材的部分表面；
c)将基材与无电镀浴接触，使得与激光接触的基材区域被镀敷，而未与激光接触的区域则不被镀敷。
2.如权利要求1所述的方法，其中硫醇官能有机化合物是从由十二烷硫醇、月桂基硫醇、鲸蜡基硫醇和硬脂基硫醇、巯基乙酸烷基酯、巯基乙酸硬脂基酯、巯基乙酸鲸蜡基酯、甲基硫醇、正丁基硫醇、环己基硫醇、正十二烷基硫醇、正丙基硫醇、正辛基硫醇和叔壬基硫醇以及一或多种前述硫醇的组合所构成的群组中选出的。
3.如权利要求2所述的方法，其中硫醇官能有机化合物包含硬脂基硫醇。
4.如权利要求1所述的方法，其中硫醇官能有机化合物在含水组合物中的浓度在约1至约20克/升之间。
5.如权利要求1所述的方法，其中表面活性剂包含乙氧基化醇表面活性剂。
6.如权利要求5所述的方法，其中乙氧基化醇表面活性剂在含水组合物中的浓度在约0.1至约10克/升之间。
7.如权利要求1所述的方法，其中含水组合物还包含黄原胶。
8.如权利要求1所述的方法，其中含水组合物包含表面活性剂。
9.如权利要求1所述的方法，其中无电镀浴包含无电镀铜浴。
10.如权利要求1所述的方法，其中非导体基材是从由热塑性树脂和热固性树脂所构成的群组中选出的。
11.如权利要求10所述的方法，其中非导体基材为热塑性树脂，该热塑性树脂是从由聚碳酸酯/丙烯腈-丁二烯-苯乙烯混合树脂、交联聚对苯二甲酸丁二醇酯、尼龙和液晶聚合物所构成的群组中选出的。
12.如权利要求11所述的方法，其中非导体基材为聚碳酸酯/丙烯腈-丁二烯-苯乙烯混合树脂。
13.如权利要求1所述的方法，其中非导体基材浸渍有铜化合物。
14.如权利要求7所述的方法，其中含水组合物包含表面活性剂。
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| PCT/US2010/056121 WO2011093934A1 (en) | 2010-01-26 | 2010-11-10 | Method for improving plating on non-concuctive substrates |
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| Publication number | Publication date |
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| EP2529395A4 (en) | 2015-05-06 |
| WO2011093934A8 (en) | 2012-08-23 |
| ES2742198T3 (es) | 2020-02-13 |
| US20130136869A1 (en) | 2013-05-30 |
| US9067238B2 (en) | 2015-06-30 |
| JP2013518180A (ja) | 2013-05-20 |
| TW201129714A (en) | 2011-09-01 |
| WO2011093934A1 (en) | 2011-08-04 |
| US20110183082A1 (en) | 2011-07-28 |
| US8974869B2 (en) | 2015-03-10 |
| EP2529395A1 (en) | 2012-12-05 |
| JP5612127B2 (ja) | 2014-10-22 |
| EP2529395B1 (en) | 2019-08-07 |
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