HK1032882A1 - Electronic device manufacturing method and electronic device. - Google Patents

Electronic device manufacturing method and electronic device.

Info

Publication number
HK1032882A1
HK1032882A1 HK01103397A HK01103397A HK1032882A1 HK 1032882 A1 HK1032882 A1 HK 1032882A1 HK 01103397 A HK01103397 A HK 01103397A HK 01103397 A HK01103397 A HK 01103397A HK 1032882 A1 HK1032882 A1 HK 1032882A1
Authority
HK
Hong Kong
Prior art keywords
electronic device
manufacturing
device manufacturing
electronic
Prior art date
Application number
HK01103397A
Other languages
English (en)
Inventor
Gosuke Oshima
Masashi Miki
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of HK1032882A1 publication Critical patent/HK1032882A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK01103397A 1999-07-13 2001-05-16 Electronic device manufacturing method and electronic device. HK1032882A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11198987A JP2001024312A (ja) 1999-07-13 1999-07-13 電子装置の製造方法及び電子装置並びに樹脂充填方法

Publications (1)

Publication Number Publication Date
HK1032882A1 true HK1032882A1 (en) 2001-08-03

Family

ID=16400235

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01103397A HK1032882A1 (en) 1999-07-13 2001-05-16 Electronic device manufacturing method and electronic device.

Country Status (6)

Country Link
US (2) US6628526B1 (xx)
JP (1) JP2001024312A (xx)
KR (2) KR100691076B1 (xx)
CN (1) CN1209802C (xx)
HK (1) HK1032882A1 (xx)
TW (1) TW529323B (xx)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040177921A1 (en) * 2001-06-29 2004-09-16 Akira Yamauchi Joining method using anisotropic conductive adhesive
US6849806B2 (en) * 2001-11-16 2005-02-01 Texas Instruments Incorporated Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
JP4171218B2 (ja) * 2002-01-23 2008-10-22 三菱電機株式会社 表面実装モジュール
US7723162B2 (en) * 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
JP4357817B2 (ja) 2002-09-12 2009-11-04 パナソニック株式会社 回路部品内蔵モジュール
EP1568799A4 (en) * 2002-12-03 2008-12-17 Furukawa Electric Co Ltd METALWORK F R ELECTRICAL ELECTRONIC COMPONENT
WO2004060034A1 (ja) 2002-12-24 2004-07-15 Matsushita Electric Industrial Co., Ltd. 電子部品内蔵モジュール
DE10300958A1 (de) * 2003-01-13 2004-07-22 Epcos Ag Modul mit Verkapselung
US7215204B2 (en) * 2004-12-29 2007-05-08 Agere Systems Inc. Intelligent high-power amplifier module
US7433192B2 (en) * 2004-12-29 2008-10-07 Agere Systems Inc. Packaging for electronic modules
WO2007026439A1 (ja) * 2005-08-30 2007-03-08 Matsushita Electric Industrial Co., Ltd. 基板構造
US7432601B2 (en) * 2006-10-10 2008-10-07 Powertech Technology Inc. Semiconductor package and fabrication process thereof
US7696016B2 (en) * 2006-11-17 2010-04-13 Freescale Semiconductor, Inc. Method of packaging a device having a tangible element and device thereof
US7476563B2 (en) * 2006-11-17 2009-01-13 Freescale Semiconductor, Inc. Method of packaging a device using a dielectric layer
US7588951B2 (en) * 2006-11-17 2009-09-15 Freescale Semiconductor, Inc. Method of packaging a semiconductor device and a prefabricated connector
US7807511B2 (en) * 2006-11-17 2010-10-05 Freescale Semiconductor, Inc. Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
US20080176359A1 (en) * 2007-01-18 2008-07-24 Nokia Corporation Method For Manufacturing Of Electronics Package
JP2008300686A (ja) * 2007-05-31 2008-12-11 Toshiba Corp 集積回路
ATE547926T1 (de) * 2007-08-09 2012-03-15 Panasonic Corp Schaltungsmodul und das modul verwendende elektronische einrichtung
JP2009117450A (ja) * 2007-11-02 2009-05-28 Rohm Co Ltd モジュールおよびその製造方法
JP2009129930A (ja) * 2007-11-19 2009-06-11 Mitsumi Electric Co Ltd 回路モジュール及び回路モジュールの製造方法
JP2008288610A (ja) * 2008-07-17 2008-11-27 Taiyo Yuden Co Ltd 回路モジュールの製造方法
FR2934082B1 (fr) * 2008-07-21 2011-05-27 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice
CN101986540A (zh) * 2009-06-15 2011-03-16 Tdk兰达美国股份有限公司 电源装置及其制造方法
JP5510461B2 (ja) * 2010-04-13 2014-06-04 株式会社村田製作所 モジュール基板、及びモジュール基板の製造方法
JP5088396B2 (ja) * 2010-05-20 2012-12-05 株式会社村田製作所 Ｅｓｄ保護デバイス及びその製造方法
JP5673123B2 (ja) * 2011-01-19 2015-02-18 株式会社村田製作所 モジュール基板及びモジュール基板の製造方法
JP5516536B2 (ja) * 2011-09-14 2014-06-11 株式会社村田製作所 電子部品モジュールの製造方法
JP2013187251A (ja) * 2012-03-06 2013-09-19 Sohki:Kk 電子装置の冷却システムおよび方法
JP2013247243A (ja) * 2012-05-25 2013-12-09 Toshiba Corp 半導体発光装置
EP2742821B1 (fr) * 2012-12-17 2015-09-09 The Swatch Group Research and Development Ltd. Procédé de fabrication d'un dispositif électronique portable flexible
JP5526250B2 (ja) * 2013-03-19 2014-06-18 オリンパス株式会社 実装構造体の製造方法
CN104797124B (zh) * 2014-01-20 2018-07-03 联想(北京)有限公司 一种屏蔽方法及电子设备
SG10201400390YA (en) 2014-03-05 2015-10-29 Delta Electronics Int L Singapore Pte Ltd Package structure
SG10201400396WA (en) 2014-03-05 2015-10-29 Delta Electronics Int’L Singapore Pte Ltd Package structure and stacked package module with the same
JPWO2015141802A1 (ja) 2014-03-20 2017-04-13 オリンパス株式会社 実装構造体の製造方法、実装用治具、実装構造体の製造装置、撮像装置および内視鏡装置
JP6661890B2 (ja) * 2014-05-21 2020-03-11 日亜化学工業株式会社 発光装置
US20160105984A1 (en) * 2014-10-09 2016-04-14 International Rectifier Corporation Power Unit with Conductive Slats
JP6668358B2 (ja) * 2015-01-08 2020-03-18 セコ・エッセ・ピ・アＳｅｋｏ Ｓ．Ｐ．Ａ． ペリスタルティック・ポンプ
JP6468036B2 (ja) * 2015-04-06 2019-02-13 株式会社デンソー 電子制御装置
JP2017195318A (ja) * 2016-04-22 2017-10-26 株式会社明電舎 集合基板
SG10201604384YA (en) 2016-05-31 2017-12-28 Delta Electronics Int'l (Singapore) Pte Ltd Embedded package structure
CN111465312A (zh) * 2020-04-14 2020-07-28 杭州洛微科技有限公司 基于周期性阵列排布的光电产品封装生产方法
CN114340265B (zh) * 2021-12-30 2024-04-16 Oppo广东移动通信有限公司 壳体组件及其制备方法和电子设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0791446B2 (ja) * 1987-03-31 1995-10-04 株式会社東芝 樹脂封止半導体装置
WO1989001873A1 (en) * 1987-08-26 1989-03-09 Matsushita Electric Industrial Co., Ltd. Integrated circuit device and method of producing the same
US5346743A (en) * 1992-03-13 1994-09-13 Kabushiki Kaisha Toshiba Resin encapsulation type semiconductor device
US5403729A (en) * 1992-05-27 1995-04-04 Micro Technology Partners Fabricating a semiconductor with an insulative coating
US5635669A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
JPH0763115B2 (ja) * 1993-03-25 1995-07-05 日本電気株式会社 高周波モジュール装置及びその製造方法
JPH0786460A (ja) * 1993-09-17 1995-03-31 Toshiba Corp 半導体装置
WO1995026885A1 (fr) * 1994-03-31 1995-10-12 Ibiden Co., Ltd. Dispositif de montage d'un composant electronique
JP3665375B2 (ja) * 1994-12-05 2005-06-29 株式会社ガスター 燃焼装置の制御基板及びそのモールド方法
JP3825475B2 (ja) * 1995-06-30 2006-09-27 株式会社 東芝 電子部品の製造方法
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US5847930A (en) * 1995-10-13 1998-12-08 Hei, Inc. Edge terminals for electronic circuit modules
JP3516789B2 (ja) * 1995-11-15 2004-04-05 三菱電機株式会社 半導体パワーモジュール
US5700981A (en) * 1996-02-08 1997-12-23 Micron Communications, Inc. Encapsulated electronic component and method for encapsulating an electronic component
US5694300A (en) * 1996-04-01 1997-12-02 Northrop Grumman Corporation Electromagnetically channelized microwave integrated circuit
JP2867985B2 (ja) * 1996-12-20 1999-03-10 日本電気株式会社 プリント回路基板
KR19980058485A (ko) * 1996-12-30 1998-10-07 김영환 칩 스케일 패키지의 제조방법
JPH11102985A (ja) * 1997-09-26 1999-04-13 Mitsubishi Electric Corp 半導体集積回路装置
US6365979B1 (en) * 1998-03-06 2002-04-02 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
JP3799921B2 (ja) * 1999-12-24 2006-07-19 株式会社豊田自動織機 容量可変型圧縮機の制御装置

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US6628526B1 (en) 2003-09-30
KR100771754B1 (ko) 2007-10-30
CN1209802C (zh) 2005-07-06
KR20070015484A (ko) 2007-02-05
TW529323B (en) 2003-04-21
JP2001024312A (ja) 2001-01-26
KR100691076B1 (ko) 2007-03-09
KR20010015261A (ko) 2001-02-26
US20030184985A1 (en) 2003-10-02
CN1280455A (zh) 2001-01-17

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