ATE547926T1 - Schaltungsmodul und das modul verwendende elektronische einrichtung - Google Patents

Schaltungsmodul und das modul verwendende elektronische einrichtung

Info

Publication number
ATE547926T1
ATE547926T1 AT07792301T AT07792301T ATE547926T1 AT E547926 T1 ATE547926 T1 AT E547926T1 AT 07792301 T AT07792301 T AT 07792301T AT 07792301 T AT07792301 T AT 07792301T AT E547926 T1 ATE547926 T1 AT E547926T1
Authority
AT
Austria
Prior art keywords
resin
turned
back portion
tubular body
electronic parts
Prior art date
Application number
AT07792301T
Other languages
English (en)
Inventor
Katsuhiro Inoue
Satoshi Sasaki
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE547926T1 publication Critical patent/ATE547926T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
AT07792301T 2007-08-09 2007-08-09 Schaltungsmodul und das modul verwendende elektronische einrichtung ATE547926T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065651 WO2009019792A1 (ja) 2007-08-09 2007-08-09 回路モジュールおよびこれを用いた電子機器

Publications (1)

Publication Number Publication Date
ATE547926T1 true ATE547926T1 (de) 2012-03-15

Family

ID=40341040

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07792301T ATE547926T1 (de) 2007-08-09 2007-08-09 Schaltungsmodul und das modul verwendende elektronische einrichtung

Country Status (7)

Country Link
US (1) US20100271788A1 (de)
EP (1) EP2178353B1 (de)
JP (1) JPWO2009019792A1 (de)
KR (1) KR20100040915A (de)
CN (1) CN101779528A (de)
AT (1) ATE547926T1 (de)
WO (1) WO2009019792A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4267677B1 (ja) * 2008-01-15 2009-05-27 パナソニック株式会社 電子機器
SG10201504275VA (en) * 2015-05-29 2016-12-29 Delta Electronics Int’L Singapore Pte Ltd Package assembly

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885304A (en) * 1972-03-23 1975-05-27 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
JPS60250699A (ja) * 1984-05-25 1985-12-11 富士通株式会社 高周波モジュ−ルの接続構造
US4774634A (en) * 1986-01-21 1988-09-27 Key Tronic Corporation Printed circuit board assembly
JP2925935B2 (ja) * 1994-07-29 1999-07-28 三洋電機株式会社 混成集積回路装置
JPH08167677A (ja) 1994-12-14 1996-06-25 Hitachi Ltd 半導体モジュール
JP3432982B2 (ja) * 1995-12-13 2003-08-04 沖電気工業株式会社 表面実装型半導体装置の製造方法
US6104619A (en) * 1997-12-16 2000-08-15 Kabushiki Kaisha Toshiba Tape carrier package and its fabrication method therefor
JPH11345916A (ja) * 1998-05-29 1999-12-14 Kyocera Corp 回路モジュール
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
JP3241669B2 (ja) 1998-11-09 2001-12-25 埼玉日本電気株式会社 Ｉｃパッケージの補強構造
JP2001024312A (ja) * 1999-07-13 2001-01-26 Taiyo Yuden Co Ltd 電子装置の製造方法及び電子装置並びに樹脂充填方法
US6452113B2 (en) * 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
JP2002026655A (ja) * 2000-07-11 2002-01-25 Hitachi Ltd 発振装置および送受信装置ならびにその製造方法
US6954124B2 (en) * 2001-01-19 2005-10-11 Matsushita Electric Industrial Co., Ltd. High-frequency circuit device and high-frequency circuit module
JP2002260597A (ja) * 2001-02-28 2002-09-13 Harison Toshiba Lighting Corp 光源装置及び実装回路装置
CN1243460C (zh) * 2001-10-12 2006-02-22 松下电器产业株式会社 电路形成基板的制造方法
FR2831327B1 (fr) * 2001-10-22 2004-06-25 Commissariat Energie Atomique Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie
EP1591370B1 (de) * 2002-12-06 2007-04-11 Yachiyo Industry Co., Ltd. Montagestruktur für abdeckung eines harzbehälters
JP4053912B2 (ja) * 2003-03-19 2008-02-27 ミツミ電機株式会社 コントロールアダプタ装置
JP4198527B2 (ja) * 2003-05-26 2008-12-17 富士通コンポーネント株式会社 タッチパネル及び表示装置
JP4133615B2 (ja) * 2003-06-19 2008-08-13 ポリマテック株式会社 小型音響素子のホルダ及びホルダの取付構造
US6874901B1 (en) * 2003-10-02 2005-04-05 Joinscan Electronics Co., Ltd. Light emitting diode display device
JP4584600B2 (ja) * 2004-02-06 2010-11-24 株式会社オートネットワーク技術研究所 回路構成体
WO2006132312A1 (ja) * 2005-06-09 2006-12-14 Matsushita Electric Industrial Co., Ltd. 通信モジュールとその製造方法
EP1983409A1 (de) * 2006-02-08 2008-10-22 Tohoku Pioneer Corporation Verfahren zur herstellung eines display mit saw-berührungssensor
US7843302B2 (en) * 2006-05-08 2010-11-30 Ibiden Co., Ltd. Inductor and electric power supply using it

Also Published As

Publication number Publication date
KR20100040915A (ko) 2010-04-21
EP2178353B1 (de) 2012-02-29
JPWO2009019792A1 (ja) 2010-10-28
EP2178353A4 (de) 2011-02-23
EP2178353A1 (de) 2010-04-21
WO2009019792A1 (ja) 2009-02-12
US20100271788A1 (en) 2010-10-28
CN101779528A (zh) 2010-07-14

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