FR2831327B1 - Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie - Google Patents

Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie

Info

Publication number
FR2831327B1
FR2831327B1 FR0113569A FR0113569A FR2831327B1 FR 2831327 B1 FR2831327 B1 FR 2831327B1 FR 0113569 A FR0113569 A FR 0113569A FR 0113569 A FR0113569 A FR 0113569A FR 2831327 B1 FR2831327 B1 FR 2831327B1
Authority
FR
France
Prior art keywords
energy source
nano
protecting
micro
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0113569A
Other languages
English (en)
Other versions
FR2831327A1 (fr
Inventor
Jean Brun
Raphael Salot
Helene Rouhaut
Gilles Poupon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0113569A priority Critical patent/FR2831327B1/fr
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to US10/492,048 priority patent/US20050001214A1/en
Priority to AU2002360134A priority patent/AU2002360134A1/en
Priority to JP2003539104A priority patent/JP2005506714A/ja
Priority to PCT/FR2002/003589 priority patent/WO2003036719A2/fr
Priority to CNB028209656A priority patent/CN1300847C/zh
Priority to KR10-2004-7006007A priority patent/KR20040071130A/ko
Priority to EP02795333A priority patent/EP1438748A2/fr
Publication of FR2831327A1 publication Critical patent/FR2831327A1/fr
Application granted granted Critical
Publication of FR2831327B1 publication Critical patent/FR2831327B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
FR0113569A 2001-10-22 2001-10-22 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie Expired - Fee Related FR2831327B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0113569A FR2831327B1 (fr) 2001-10-22 2001-10-22 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie
AU2002360134A AU2002360134A1 (en) 2001-10-22 2002-10-21 Micro- or nano-electronic component comprising a power source and means for protecting the power source
JP2003539104A JP2005506714A (ja) 2001-10-22 2002-10-21 電源と電源保護手段とを備えたマイクロまたはナノ電子部品
PCT/FR2002/003589 WO2003036719A2 (fr) 2001-10-22 2002-10-21 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie
US10/492,048 US20050001214A1 (en) 2001-10-22 2002-10-21 Micro- or nano-electronic component comprising a power source and means for protecting the power source
CNB028209656A CN1300847C (zh) 2001-10-22 2002-10-21 包括电源及电源保护装置的微型或纳米电子器件
KR10-2004-7006007A KR20040071130A (ko) 2001-10-22 2002-10-21 전원과 전원을 보호하는 수단을 포함하는 마이크로 또는나노 전자 부품
EP02795333A EP1438748A2 (fr) 2001-10-22 2002-10-21 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0113569A FR2831327B1 (fr) 2001-10-22 2001-10-22 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie

Publications (2)

Publication Number Publication Date
FR2831327A1 FR2831327A1 (fr) 2003-04-25
FR2831327B1 true FR2831327B1 (fr) 2004-06-25

Family

ID=8868532

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0113569A Expired - Fee Related FR2831327B1 (fr) 2001-10-22 2001-10-22 Composant micro ou nano-electronique comportant une source d'energie et des moyens de protection de la source d'energie

Country Status (8)

Country Link
US (1) US20050001214A1 (fr)
EP (1) EP1438748A2 (fr)
JP (1) JP2005506714A (fr)
KR (1) KR20040071130A (fr)
CN (1) CN1300847C (fr)
AU (1) AU2002360134A1 (fr)
FR (1) FR2831327B1 (fr)
WO (1) WO2003036719A2 (fr)

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* Cited by examiner, † Cited by third party
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DE102004021346A1 (de) * 2004-04-30 2005-12-01 Micronas Gmbh Chip mit Versorgungseinrichtung
US20060124046A1 (en) * 2004-12-09 2006-06-15 Honeywell International, Inc. Using thin film, thermal batteries to provide security protection for electronic systems
FR2880198B1 (fr) * 2004-12-23 2007-07-06 Commissariat Energie Atomique Electrode nanostructuree pour microbatterie
KR101387855B1 (ko) * 2005-07-15 2014-04-22 사임베트 코퍼레이션 연질 및 경질 전해질층을 가진 박막 배터리 및 그 제조방법
US7776478B2 (en) 2005-07-15 2010-08-17 Cymbet Corporation Thin-film batteries with polymer and LiPON electrolyte layers and method
FR2901639B1 (fr) * 2006-05-24 2008-08-22 Commissariat Energie Atomique Micro-composant integre associant les fonctions de recuperation et de stockage de l'energie
FR2910991B1 (fr) * 2007-01-02 2009-07-31 Ingenico Sa Module de securite materiel,procede de mise en service et terminal de paiement electronique utilisant ce module
CN101669235B (zh) * 2007-03-30 2013-12-11 密执安州立大学董事会 沉积的微体系结构电池和制造方法
CN101779528A (zh) * 2007-08-09 2010-07-14 松下电器产业株式会社 电路模块和使用该模块的电子装置
FR2925227B1 (fr) * 2007-12-12 2009-11-27 Commissariat Energie Atomique Dispositif electrochimique au lithium encaspule.
FR2946461B1 (fr) * 2009-06-09 2011-07-22 Commissariat Energie Atomique Dispositif d'encapsulation flexible d'une micro-batterie
FR2952477B1 (fr) * 2009-11-06 2011-12-09 St Microelectronics Tours Sas Procede de formation d'une batterie de type lithium-ion en couches minces
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
GB201116253D0 (en) * 2011-09-20 2011-11-02 Eight19 Ltd Photovoltaic device
FR2994338A1 (fr) * 2012-08-03 2014-02-07 St Microelectronics Tours Sas Procede de formation d'une batterie de type lithium-ion
JP5632031B2 (ja) * 2013-03-06 2014-11-26 セイコーインスツル株式会社 電子部品パッケージの製造方法
DE102014222899B4 (de) 2014-11-10 2018-03-22 Robert Bosch Gmbh Sensorgehäuse
US10446331B2 (en) * 2015-09-22 2019-10-15 Analog Devices, Inc. Wafer-capped rechargeable power source
DE102016109960A1 (de) * 2016-05-31 2017-11-30 Infineon Technologies Ag Halbleitergehäuse, Chipkarte und Verfahren zum Herstellen eines Halbleitergehäuses
EP3762989A4 (fr) 2018-03-07 2021-12-15 Space Charge, LLC Dispositifs d'accumulation d'énergie à électrolyte solide à film mince

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0431261A1 (fr) * 1989-12-07 1991-06-12 International Business Machines Corporation Boîtier pour circuit intégré ayant un couvercle et dispositif formé dans le même matériau
US5389738A (en) * 1992-05-04 1995-02-14 Motorola, Inc. Tamperproof arrangement for an integrated circuit device
US5323150A (en) * 1992-06-11 1994-06-21 Micron Technology, Inc. Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices
US5338625A (en) * 1992-07-29 1994-08-16 Martin Marietta Energy Systems, Inc. Thin film battery and method for making same
DE4342767A1 (de) * 1993-12-15 1995-06-22 Ant Nachrichtentech Verfahren zur Herstellung einer quaderförmigen Vertiefung zur Aufnahme eines Bauelementes in einer Trägerplatte
US5561004A (en) * 1994-02-25 1996-10-01 Bates; John B. Packaging material for thin film lithium batteries
WO1997004378A1 (fr) * 1995-07-20 1997-02-06 Dallas Semiconductor Corporation Microcircuit avec une memoire protegee aussi bien par un moyen materiel que par un logiciel
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
KR100305903B1 (ko) * 1998-08-21 2001-12-17 박호군 수직으로통합연결된박막형전지를구비하는전기및전자소자와그제작방법

Also Published As

Publication number Publication date
CN1575523A (zh) 2005-02-02
CN1300847C (zh) 2007-02-14
WO2003036719A3 (fr) 2004-03-04
FR2831327A1 (fr) 2003-04-25
WO2003036719A2 (fr) 2003-05-01
US20050001214A1 (en) 2005-01-06
JP2005506714A (ja) 2005-03-03
KR20040071130A (ko) 2004-08-11
EP1438748A2 (fr) 2004-07-21
AU2002360134A1 (en) 2003-05-06

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Legal Events

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Effective date: 20100630