HK1010280A1 - Procedure for drying substrates - Google Patents

Procedure for drying substrates

Info

Publication number
HK1010280A1
HK1010280A1 HK98111262A HK98111262A HK1010280A1 HK 1010280 A1 HK1010280 A1 HK 1010280A1 HK 98111262 A HK98111262 A HK 98111262A HK 98111262 A HK98111262 A HK 98111262A HK 1010280 A1 HK1010280 A1 HK 1010280A1
Authority
HK
Hong Kong
Prior art keywords
substrate
bath
liquid
liquid bath
procedure
Prior art date
Application number
HK98111262A
Other languages
English (en)
Inventor
Wilhelm Schellenberger
Dieter Herrmannsdorfer
Original Assignee
Ictop Entwicklungs Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ictop Entwicklungs Gmbh filed Critical Ictop Entwicklungs Gmbh
Priority to HK02104685.0A priority Critical patent/HK1043661B/zh
Publication of HK1010280A1 publication Critical patent/HK1010280A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Inorganic Insulating Materials (AREA)
  • Detergent Compositions (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
HK98111262A 1995-08-23 1998-10-14 Procedure for drying substrates HK1010280A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
HK02104685.0A HK1043661B (zh) 1995-08-23 1998-10-14 乾燥矽之方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19531031A DE19531031C2 (de) 1995-08-23 1995-08-23 Verfahren zum Trocknen von Silizium
PCT/EP1996/003541 WO1997008742A1 (fr) 1995-08-23 1996-08-09 Procedure de sechage

Publications (1)

Publication Number Publication Date
HK1010280A1 true HK1010280A1 (en) 1999-06-17

Family

ID=7770207

Family Applications (2)

Application Number Title Priority Date Filing Date
HK98111262A HK1010280A1 (en) 1995-08-23 1998-10-14 Procedure for drying substrates
HK02104685.0A HK1043661B (zh) 1995-08-23 1998-10-14 乾燥矽之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK02104685.0A HK1043661B (zh) 1995-08-23 1998-10-14 乾燥矽之方法

Country Status (24)

Country Link
EP (2) EP1199740B1 (fr)
JP (1) JP3857314B2 (fr)
KR (1) KR19990037642A (fr)
CN (1) CN1091542C (fr)
AT (2) ATE309613T1 (fr)
AU (1) AU697397B2 (fr)
CA (1) CA2228168A1 (fr)
CZ (1) CZ291335B6 (fr)
DE (3) DE19531031C2 (fr)
DK (2) DK1199740T3 (fr)
ES (2) ES2186800T3 (fr)
HK (2) HK1010280A1 (fr)
HU (1) HUP9802482A3 (fr)
IL (1) IL123042A (fr)
MX (1) MX9801464A (fr)
NO (1) NO980734D0 (fr)
PL (1) PL183355B1 (fr)
PT (1) PT846334E (fr)
RU (1) RU2141700C1 (fr)
SI (1) SI1199740T1 (fr)
SK (1) SK284835B6 (fr)
TW (1) TW427952B (fr)
UA (1) UA51663C2 (fr)
WO (1) WO1997008742A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19613620C2 (de) 1996-04-04 1998-04-16 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Trocknen von Substraten
DE19800584C2 (de) * 1998-01-09 2002-06-20 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Trocknen von Substraten
DE19833257C1 (de) * 1998-07-23 1999-09-30 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe
DE19927457C2 (de) * 1999-06-16 2002-06-13 Wacker Siltronic Halbleitermat Verwendung eines bekannten Verfahrens als Vorbehandlung zur Bestimmung der Diffusionslängen von Minoritätsträgern in einer Halbleiterscheibe
DE10036691A1 (de) * 2000-07-27 2002-02-14 Wacker Siltronic Halbleitermat Verfahren zur chemischen Behandlung von Halbleiterscheiben
DE10064081C2 (de) * 2000-12-21 2002-06-06 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe
DE10360269A1 (de) * 2003-12-17 2005-07-28 Friedrich-Schiller-Universität Jena Verfahren zur schnellen Mischung von kleinvolumigen Flüssigkeiten und Kit zu dessen Anwendung
US20060174421A1 (en) 2004-12-17 2006-08-10 Carter Daniel L Process for extracting liquid from a fabric
KR100897581B1 (ko) 2007-11-14 2009-05-14 주식회사 실트론 웨이퍼 건조 방법
RU2486287C2 (ru) * 2011-04-29 2013-06-27 Антон Викторович Мантузов Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов
CN114993028B (zh) * 2022-06-17 2023-05-30 高景太阳能股份有限公司 一种硅片烘干处理方法及系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2722783A1 (de) * 1977-05-20 1978-11-30 Wacker Chemitronic Verfahren zum reinigen von silicium
US4169807A (en) * 1978-03-20 1979-10-02 Rca Corporation Novel solvent drying agent
DE3317286A1 (de) * 1983-05-11 1984-11-22 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zur reinigung von silicium durch saeureeinwirkung
FR2591324B1 (fr) * 1985-12-10 1989-02-17 Recif Sa Appareil pour le sechage unitaire des plaquettes de silicium par centrifugation
JPS62198127A (ja) * 1986-02-25 1987-09-01 Sanyo Electric Co Ltd 半導体ウエハの洗浄方法
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
US4902350A (en) * 1987-09-09 1990-02-20 Robert F. Orr Method for rinsing, cleaning and drying silicon wafers
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
JPH0366126A (ja) * 1989-08-04 1991-03-20 Sharp Corp 絶縁膜の製造方法及びその製造装置
JPH0466175A (ja) * 1990-07-03 1992-03-02 Seiko Epson Corp 水切り乾燥方法
JPH04346431A (ja) * 1991-05-24 1992-12-02 Mitsubishi Electric Corp 半導体シリコンウェハの洗浄装置
AU7923894A (en) * 1993-09-22 1995-04-10 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid

Also Published As

Publication number Publication date
EP1199740A2 (fr) 2002-04-24
NO980734L (no) 1998-02-20
UA51663C2 (uk) 2002-12-16
ATE227885T1 (de) 2002-11-15
PT846334E (pt) 2003-02-28
EP1199740A3 (fr) 2003-09-03
RU2141700C1 (ru) 1999-11-20
DE19531031A1 (de) 1997-02-27
ES2250292T3 (es) 2006-04-16
CN1192824A (zh) 1998-09-09
DE19531031C2 (de) 1997-08-21
HK1043661B (zh) 2006-03-03
TW427952B (en) 2001-04-01
EP0846334B1 (fr) 2002-11-13
CA2228168A1 (fr) 1997-03-06
AU697397B2 (en) 1998-10-08
HK1043661A1 (en) 2002-09-20
CN1091542C (zh) 2002-09-25
KR19990037642A (ko) 1999-05-25
SK21298A3 (en) 1998-10-07
DE69635427D1 (de) 2005-12-15
CZ291335B6 (cs) 2003-02-12
PL325121A1 (en) 1998-07-06
JP3857314B2 (ja) 2006-12-13
HUP9802482A2 (hu) 1999-02-01
AU6872096A (en) 1997-03-19
IL123042A0 (en) 1998-09-24
DK1199740T3 (da) 2006-03-27
DE69635427T2 (de) 2006-07-27
MX9801464A (es) 1998-11-30
NO980734D0 (no) 1998-02-20
SK284835B6 (sk) 2005-12-01
DE69624830D1 (de) 2002-12-19
DE69624830T2 (de) 2003-03-27
ES2186800T3 (es) 2003-05-16
HUP9802482A3 (en) 2002-11-28
SI1199740T1 (sl) 2006-06-30
DK0846334T3 (da) 2003-02-10
WO1997008742A1 (fr) 1997-03-06
JPH11514496A (ja) 1999-12-07
IL123042A (en) 2001-04-30
ATE309613T1 (de) 2005-11-15
EP1199740B1 (fr) 2005-11-09
PL183355B1 (pl) 2002-06-28
CZ51798A3 (cs) 1998-07-15
EP0846334A1 (fr) 1998-06-10

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070809