ES2186800T3 - Procedimiento de secado de sustratos. - Google Patents
Procedimiento de secado de sustratos.Info
- Publication number
- ES2186800T3 ES2186800T3 ES96929234T ES96929234T ES2186800T3 ES 2186800 T3 ES2186800 T3 ES 2186800T3 ES 96929234 T ES96929234 T ES 96929234T ES 96929234 T ES96929234 T ES 96929234T ES 2186800 T3 ES2186800 T3 ES 2186800T3
- Authority
- ES
- Spain
- Prior art keywords
- sub
- liquid
- silicone
- substrate drying
- drying procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001035 drying Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 abstract 4
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000008246 gaseous mixture Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
LA INVENCION ESTA RELACIONADA CON UN PROCEDIMIENTO APLICABLE AL SECADO DE SUPERFICIES DE SUSTRATOS DE UN GRAN NUMERO DE MATERIALES, COMO SEMICONDUCTORES, METALES, PLASTICOS, Y, EN PARTICULAR, SILICONA. SE DOSIFICA LA SILICONA (1) EN UN BAÑO DE LIQUIDO (2) Y LA MISMA SE SEPARA DEL LIQUIDO (3); EL LIQUIDO DEL BAÑO (2) SE COMPONE DE UNA SOLUCION ACUOSA DE HF (3) CON UNA CONCENTRACION DEL 0,001 AL 50 %. AÑADIENDO UNA MEZCLA GASEOSA QUE CONTIENE O SUB,2}/O SUB,3} INMEDIATAMENTE DESPUES DE HABER FINALIZADO EL PROCESO DE SECADO, SE HIDROFILIZA LA SUPERFICIE DE SILICONA. AÑADIENDO UNA MEZCLA GASEOSA DE O SUB,2}/O SUB,3} DURANTE EL PROCESO DE SECADO, TIENE LUGAR LA LIMPIEZA CUANDO EL OZONO ENTRA EN LA SOLUCION A TRAVES DE LA SUPERFICIE DEL LIQUIDO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19531031A DE19531031C2 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Trocknen von Silizium |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2186800T3 true ES2186800T3 (es) | 2003-05-16 |
Family
ID=7770207
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES01130669T Expired - Lifetime ES2250292T3 (es) | 1995-08-23 | 1996-08-09 | Procedimiento de secado de sustratos de silicona. |
ES96929234T Expired - Lifetime ES2186800T3 (es) | 1995-08-23 | 1996-08-09 | Procedimiento de secado de sustratos. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES01130669T Expired - Lifetime ES2250292T3 (es) | 1995-08-23 | 1996-08-09 | Procedimiento de secado de sustratos de silicona. |
Country Status (24)
Country | Link |
---|---|
EP (2) | EP0846334B1 (es) |
JP (1) | JP3857314B2 (es) |
KR (1) | KR19990037642A (es) |
CN (1) | CN1091542C (es) |
AT (2) | ATE227885T1 (es) |
AU (1) | AU697397B2 (es) |
CA (1) | CA2228168A1 (es) |
CZ (1) | CZ291335B6 (es) |
DE (3) | DE19531031C2 (es) |
DK (2) | DK1199740T3 (es) |
ES (2) | ES2250292T3 (es) |
HK (2) | HK1010280A1 (es) |
HU (1) | HUP9802482A3 (es) |
IL (1) | IL123042A (es) |
MX (1) | MX9801464A (es) |
NO (1) | NO980734D0 (es) |
PL (1) | PL183355B1 (es) |
PT (1) | PT846334E (es) |
RU (1) | RU2141700C1 (es) |
SI (1) | SI1199740T1 (es) |
SK (1) | SK284835B6 (es) |
TW (1) | TW427952B (es) |
UA (1) | UA51663C2 (es) |
WO (1) | WO1997008742A1 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19800584C2 (de) * | 1998-01-09 | 2002-06-20 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19613620C2 (de) | 1996-04-04 | 1998-04-16 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19833257C1 (de) * | 1998-07-23 | 1999-09-30 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
DE19927457C2 (de) * | 1999-06-16 | 2002-06-13 | Wacker Siltronic Halbleitermat | Verwendung eines bekannten Verfahrens als Vorbehandlung zur Bestimmung der Diffusionslängen von Minoritätsträgern in einer Halbleiterscheibe |
DE10036691A1 (de) * | 2000-07-27 | 2002-02-14 | Wacker Siltronic Halbleitermat | Verfahren zur chemischen Behandlung von Halbleiterscheiben |
DE10064081C2 (de) * | 2000-12-21 | 2002-06-06 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
DE10360269A1 (de) * | 2003-12-17 | 2005-07-28 | Friedrich-Schiller-Universität Jena | Verfahren zur schnellen Mischung von kleinvolumigen Flüssigkeiten und Kit zu dessen Anwendung |
US20060174421A1 (en) | 2004-12-17 | 2006-08-10 | Carter Daniel L | Process for extracting liquid from a fabric |
KR100897581B1 (ko) | 2007-11-14 | 2009-05-14 | 주식회사 실트론 | 웨이퍼 건조 방법 |
RU2486287C2 (ru) * | 2011-04-29 | 2013-06-27 | Антон Викторович Мантузов | Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов |
CN114993028B (zh) * | 2022-06-17 | 2023-05-30 | 高景太阳能股份有限公司 | 一种硅片烘干处理方法及系统 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2722783A1 (de) * | 1977-05-20 | 1978-11-30 | Wacker Chemitronic | Verfahren zum reinigen von silicium |
US4169807A (en) * | 1978-03-20 | 1979-10-02 | Rca Corporation | Novel solvent drying agent |
DE3317286A1 (de) * | 1983-05-11 | 1984-11-22 | Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen | Verfahren zur reinigung von silicium durch saeureeinwirkung |
FR2591324B1 (fr) * | 1985-12-10 | 1989-02-17 | Recif Sa | Appareil pour le sechage unitaire des plaquettes de silicium par centrifugation |
JPS62198127A (ja) * | 1986-02-25 | 1987-09-01 | Sanyo Electric Co Ltd | 半導体ウエハの洗浄方法 |
US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
US4902350A (en) * | 1987-09-09 | 1990-02-20 | Robert F. Orr | Method for rinsing, cleaning and drying silicon wafers |
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
JPH0366126A (ja) * | 1989-08-04 | 1991-03-20 | Sharp Corp | 絶縁膜の製造方法及びその製造装置 |
JPH0466175A (ja) * | 1990-07-03 | 1992-03-02 | Seiko Epson Corp | 水切り乾燥方法 |
JPH04346431A (ja) * | 1991-05-24 | 1992-12-02 | Mitsubishi Electric Corp | 半導体シリコンウェハの洗浄装置 |
EP0739252B2 (en) * | 1993-09-22 | 2004-10-06 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
-
1995
- 1995-08-23 DE DE19531031A patent/DE19531031C2/de not_active Expired - Fee Related
-
1996
- 1996-08-09 PT PT96929234T patent/PT846334E/pt unknown
- 1996-08-09 CZ CZ1998517A patent/CZ291335B6/cs not_active IP Right Cessation
- 1996-08-09 IL IL12304296A patent/IL123042A/en not_active IP Right Cessation
- 1996-08-09 RU RU98104458A patent/RU2141700C1/ru not_active IP Right Cessation
- 1996-08-09 DE DE69624830T patent/DE69624830T2/de not_active Expired - Lifetime
- 1996-08-09 EP EP96929234A patent/EP0846334B1/en not_active Expired - Lifetime
- 1996-08-09 HU HU9802482A patent/HUP9802482A3/hu unknown
- 1996-08-09 ES ES01130669T patent/ES2250292T3/es not_active Expired - Lifetime
- 1996-08-09 WO PCT/EP1996/003541 patent/WO1997008742A1/en active IP Right Grant
- 1996-08-09 DK DK01130669T patent/DK1199740T3/da active
- 1996-08-09 ES ES96929234T patent/ES2186800T3/es not_active Expired - Lifetime
- 1996-08-09 PL PL96325121A patent/PL183355B1/pl not_active IP Right Cessation
- 1996-08-09 SI SI9630728T patent/SI1199740T1/sl unknown
- 1996-08-09 CA CA002228168A patent/CA2228168A1/en not_active Abandoned
- 1996-08-09 KR KR1019980701119A patent/KR19990037642A/ko active Search and Examination
- 1996-08-09 CN CN96196222A patent/CN1091542C/zh not_active Expired - Fee Related
- 1996-08-09 EP EP01130669A patent/EP1199740B1/en not_active Expired - Lifetime
- 1996-08-09 AU AU68720/96A patent/AU697397B2/en not_active Ceased
- 1996-08-09 AT AT96929234T patent/ATE227885T1/de active
- 1996-08-09 SK SK212-98A patent/SK284835B6/sk unknown
- 1996-08-09 JP JP50977197A patent/JP3857314B2/ja not_active Expired - Fee Related
- 1996-08-09 DK DK96929234T patent/DK0846334T3/da active
- 1996-08-09 DE DE69635427T patent/DE69635427T2/de not_active Expired - Lifetime
- 1996-08-09 AT AT01130669T patent/ATE309613T1/de active
- 1996-08-20 TW TW085110167A patent/TW427952B/zh not_active IP Right Cessation
- 1996-09-08 UA UA98020935A patent/UA51663C2/uk unknown
-
1998
- 1998-02-20 NO NO980734A patent/NO980734D0/no unknown
- 1998-02-23 MX MX9801464A patent/MX9801464A/es not_active IP Right Cessation
- 1998-10-14 HK HK98111262A patent/HK1010280A1/xx not_active IP Right Cessation
- 1998-10-14 HK HK02104685.0A patent/HK1043661B/zh not_active IP Right Cessation
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