HK1005074A1 - Surface acoustic wave device and its manufacturing method - Google Patents

Surface acoustic wave device and its manufacturing method

Info

Publication number
HK1005074A1
HK1005074A1 HK98104160A HK98104160A HK1005074A1 HK 1005074 A1 HK1005074 A1 HK 1005074A1 HK 98104160 A HK98104160 A HK 98104160A HK 98104160 A HK98104160 A HK 98104160A HK 1005074 A1 HK1005074 A1 HK 1005074A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
acoustic wave
surface acoustic
wave device
wave
Prior art date
Application number
HK98104160A
Other languages
English (en)
Inventor
Yatsuda Hiromi
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Publication of HK1005074A1 publication Critical patent/HK1005074A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
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    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
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    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
HK98104160A 1990-07-02 1998-05-14 Surface acoustic wave device and its manufacturing method HK1005074A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2175015A JP2673993B2 (ja) 1990-07-02 1990-07-02 表面弾性波装置

Publications (1)

Publication Number Publication Date
HK1005074A1 true HK1005074A1 (en) 1998-12-18

Family

ID=15988727

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98104160A HK1005074A1 (en) 1990-07-02 1998-05-14 Surface acoustic wave device and its manufacturing method

Country Status (7)

Country Link
US (2) US5252882A (fr)
EP (1) EP0472856B1 (fr)
JP (1) JP2673993B2 (fr)
AU (2) AU644183B2 (fr)
CA (1) CA2045697C (fr)
DE (1) DE69128855T2 (fr)
HK (1) HK1005074A1 (fr)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327394A (ja) * 1992-05-27 1993-12-10 Japan Radio Co Ltd 弾性表面波素子のフェースダウン実装用パッケージ
JP3171043B2 (ja) * 1995-01-11 2001-05-28 株式会社村田製作所 弾性表面波装置
JPH08242026A (ja) * 1995-03-03 1996-09-17 Fujitsu Ltd 圧電振動子及びこれを具備する圧電振動子デバイス並びに該デバイスを具備する回路装置
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
US5760526A (en) * 1995-04-03 1998-06-02 Motorola, Inc. Plastic encapsulated SAW device
JP3308759B2 (ja) * 1995-04-10 2002-07-29 日本電気株式会社 弾性表面波装置
JPH08288790A (ja) * 1995-04-10 1996-11-01 Fujitsu Ltd 素子用基板、圧電振動装置及び弾性表面波装置
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CA2045697C (fr) 1996-03-05
AU7936091A (en) 1992-01-02
DE69128855D1 (de) 1998-03-12
AU650394B2 (en) 1994-06-16
US5471722A (en) 1995-12-05
DE69128855T2 (de) 1998-06-25
CA2045697A1 (fr) 1992-01-03
EP0472856A3 (en) 1992-05-20
EP0472856B1 (fr) 1998-02-04
EP0472856A2 (fr) 1992-03-04
AU4879093A (en) 1993-12-09
US5252882A (en) 1993-10-12
JP2673993B2 (ja) 1997-11-05
JPH0465909A (ja) 1992-03-02
AU644183B2 (en) 1993-12-02

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