GB2297424B - Surface acoustic wave device - Google Patents

Surface acoustic wave device

Info

Publication number
GB2297424B
GB2297424B GB9601285A GB9601285A GB2297424B GB 2297424 B GB2297424 B GB 2297424B GB 9601285 A GB9601285 A GB 9601285A GB 9601285 A GB9601285 A GB 9601285A GB 2297424 B GB2297424 B GB 2297424B
Authority
GB
United Kingdom
Prior art keywords
acoustic wave
surface acoustic
wave device
wave
acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9601285A
Other versions
GB9601285D0 (en
GB2297424A (en
Inventor
Seiichi Arai
Hiroaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB9601285D0 publication Critical patent/GB9601285D0/en
Publication of GB2297424A publication Critical patent/GB2297424A/en
Application granted granted Critical
Publication of GB2297424B publication Critical patent/GB2297424B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
GB9601285A 1995-01-26 1996-01-23 Surface acoustic wave device Expired - Lifetime GB2297424B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1095695A JPH08204497A (en) 1995-01-26 1995-01-26 Surface acoustic wave device

Publications (3)

Publication Number Publication Date
GB9601285D0 GB9601285D0 (en) 1996-03-27
GB2297424A GB2297424A (en) 1996-07-31
GB2297424B true GB2297424B (en) 1998-10-28

Family

ID=11764646

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9601285A Expired - Lifetime GB2297424B (en) 1995-01-26 1996-01-23 Surface acoustic wave device

Country Status (3)

Country Link
JP (1) JPH08204497A (en)
DE (1) DE19602665C2 (en)
GB (1) GB2297424B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3196693B2 (en) * 1997-08-05 2001-08-06 日本電気株式会社 Surface acoustic wave device and method of manufacturing the same
JP2000058593A (en) * 1998-08-03 2000-02-25 Nec Corp Mounting structure of surface elastic wave element and mounting thereof
JP4510982B2 (en) * 2000-02-29 2010-07-28 京セラ株式会社 Surface acoustic wave device
DE10130084A1 (en) * 2001-06-21 2003-01-16 Infineon Technologies Ag Manufacturing housed surface or bulk acoustic wave device e.g. SAW filter, involves connecting chip to bearer with active element opposite bearer, and applying protective cover/retaining intermediate space
JP4166997B2 (en) 2002-03-29 2008-10-15 富士通メディアデバイス株式会社 Surface acoustic wave device mounting method and surface acoustic wave device having resin-sealed surface acoustic wave device
DE10215355B4 (en) * 2002-04-08 2004-08-05 Infineon Technologies Ag Method for flip-chip assembly of semiconductor chips
JP2004201285A (en) 2002-12-06 2004-07-15 Murata Mfg Co Ltd Method of producing piezoelectric component and piezoelectric component
JP4645233B2 (en) 2005-03-03 2011-03-09 パナソニック株式会社 Surface acoustic wave device
KR100863836B1 (en) * 2005-11-02 2008-10-15 마쯔시다덴기산교 가부시키가이샤 Electronic parts package
US7652214B2 (en) 2005-11-02 2010-01-26 Panasonic Corporation Electronic component package
DE102010026843A1 (en) * 2010-07-12 2012-01-12 Epcos Ag Module package and manufacturing process
JP2013225749A (en) * 2012-04-20 2013-10-31 Kyocera Corp Piezoelectric device and module component
JP6508217B2 (en) * 2015-01-16 2019-05-08 株式会社村田製作所 Substrate, method of manufacturing substrate, and elastic wave device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
US4864470A (en) * 1987-08-31 1989-09-05 Pioneer Electronic Corporation Mounting device for an electronic component
JPH0456510A (en) * 1990-06-26 1992-02-24 Clarion Co Ltd Surface acoustic wave device
EP0637871A1 (en) * 1993-08-06 1995-02-08 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3425882A1 (en) * 1984-07-13 1986-01-16 Siemens AG, 1000 Berlin und 8000 München Small connecting strip composite device for making contact with electrical components, preferably piezo-transducers
US4846470A (en) * 1987-10-23 1989-07-11 Peterson Emil A Adjustable height basketball goal and backboard apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
US4864470A (en) * 1987-08-31 1989-09-05 Pioneer Electronic Corporation Mounting device for an electronic component
JPH0456510A (en) * 1990-06-26 1992-02-24 Clarion Co Ltd Surface acoustic wave device
EP0637871A1 (en) * 1993-08-06 1995-02-08 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module

Also Published As

Publication number Publication date
JPH08204497A (en) 1996-08-09
GB9601285D0 (en) 1996-03-27
DE19602665A1 (en) 1996-08-08
GB2297424A (en) 1996-07-31
DE19602665C2 (en) 2000-07-20

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20160122