KR100863836B1 - Electronic parts package - Google Patents

Abstract

Improve the strength against external pressure of the electronic component package. To this end, the present invention provides an electronic component package in which an electronic component mounted on a mounting substrate is covered with a mold resin through an external electrode disposed on the mounting substrate, wherein the electronic component covers an element disposed on the lower surface of the component substrate. The protective body which has a component cover which forms a cavity, and has a elasticity modulus smaller than a mold resin was provided in the part which opposes a cavity except the junction part with the external electrode in the lower surface of a component cover.

Description

Electronic component package {ELECTRONIC PARTS PACKAGE}

The present invention relates to an electronic component package.

A package of a surface acoustic wave (hereinafter referred to as "SAW") device, which is one example of a conventional electronic component package, has a component board 101 and a component board 101 as shown in FIG. An IDT (Interdigital Transducer) electrode 102 as an element formed on the lower surface (the lower side in FIG. 19 is referred to the surface on the side opposite to the mounting substrate 105 described later), and the IDT electrode 102 The component cover 104 which has the recessed part 103 in the part which opposes and the external electrode 106 which join this component cover 104 and the mounting board | substrate 105 are provided. Moreover, as prior art document information related to such a conventional electronic component package, Unexamined-Japanese-Patent No. 2000-261284, Unexamined-Japanese-Patent No. 2001-244785, Unexamined-Japanese-Patent No. 2003-110391, Japan Patent Publication No. 2005-318157 and the like are known.

However, in the conventional electronic component package, there may be a case where it cannot endure the pressure shock at the time of mold resin processing.

That is, the recessed part 103 is formed in the component cover 104 so that this component cover 104 and the some IDT electrode 102 may not contact, and the part with this recessed part 103 is a part cover ( 104 is very thin. For this reason, when this SAW apparatus is mounted on the mounting board 105 and coat | covered with mold resin, it is because the pressure of the mold resin which entered between the component cover 104 and the mounting board 105 is very large, Component cover 104 is damaged.

Therefore, this invention raises the strength with respect to the external pressure of an electronic component package, and prevents damage.

To this end, the present invention provides an electronic component package in which an electronic component mounted on a mounting substrate is covered with a mold resin through an external electrode disposed on the mounting substrate, wherein the electronic component is a lower surface of the component substrate (a side facing the mounting substrate). A part cover which forms a cavity covering the element disposed on the surface of the part), and a part of the part cover opposite to the cavity except for the joint part of the external electrode on the bottom surface (a surface on the side opposite to the mounting substrate), A protective body having a lower elastic modulus than that of the molded resin is provided.

That is, the electronic component package of this invention is a mounting resin, the external electrode arrange | positioned on the mounting substrate, the electronic component mounted on the mounting board via the external electrode, and the mold resin which coat | covered the electronic component on the mounting board | substrate. The electronic component includes a component substrate, an element disposed on a surface of the component substrate that faces the mounting substrate, and a component cover covering a surface side of the component substrate that faces the mounting substrate. There is a cavity in the viewing part, and a protective member having a modulus of elasticity smaller than that of the mold resin is provided on the surface of the component cover opposite to the cavity except for the joint portion of the external electrode.

According to the above structure, even if the recess is formed in the component cover and the thickness is thin, a protective member having a lower elastic modulus than the mold resin is provided on the lower surface of the component cover, so that the protective member receives the pressure applied from the lower side during the filling of the mold resin. It is elastically deformed and this pressure can be disperse | distributed to a horizontal direction. Therefore, the stress given to the electronic component from the outside can be buffered.

As a result of the above, this invention can raise the intensity | strength with respect to the pressure of an electronic component package, and can prevent damage.

1 is a perspective view of an electronic component package according to the first embodiment.

2 is a cross-sectional view of the electronic component package according to the first embodiment.

3 is a bottom view of the component substrate constituting the electronic component package according to the first embodiment.

4 is a circuit diagram of a SAW duplexer constituting the electronic component package according to the first embodiment.

5 is a bottom view of a component cover constituting the electronic component package according to the first embodiment.

6 is a cross-sectional view of the SAW duplexer of the first embodiment.

FIG. 7 is a top view of a mask for forming the component cover according to the first embodiment. FIG.

8 is a bottom view of the component cover according to the first embodiment.

9 is a cross-sectional view of the electronic component package according to the second embodiment.

10 is a bottom view of a component substrate constituting the electronic component package according to the second embodiment.

FIG. 11: A is a 1st figure which shows the manufacturing process of SAW duplexer in Embodiment 2. FIG.

FIG. 11B is a second view showing the manufacturing process of the SAW duplexer in Embodiment 2. FIG.

FIG. 11C is a third diagram showing the manufacturing process of the SAW duplexer in Embodiment 2. FIG.

FIG. 11D is a fourth view showing the manufacturing process of the SAW duplexer in Embodiment 2. FIG.

FIG. 11E is a fifth view showing the manufacturing process of the SAW duplexer in Embodiment 2. FIG.

FIG. 11F is a sixth view showing the manufacturing process of the SAW duplexer in Embodiment 2. FIG.

12A is a seventh diagram showing the manufacturing process of the SAW duplexer in the second embodiment.

FIG. 12B is an eighth view showing the manufacturing process of the SAW duplexer in the second embodiment. FIG.

FIG. 12C is a ninth diagram illustrating a manufacturing step of the SAW duplexer in the second embodiment. FIG.

12D is a tenth diagram showing the manufacturing process of the SAW duplexer in the second embodiment.

12E is an eleventh diagram showing a manufacturing process of the SAW duplexer in the second embodiment.

FIG. 12F is a twelfth diagram showing the manufacturing process of the SAW duplexer in the second embodiment. FIG.

13 is a cross-sectional view of the electronic component package according to the third embodiment.

14 is a bottom view of a component substrate constituting the electronic component package according to the third embodiment.

FIG. 15A is a first diagram showing the manufacturing process of the SAW duplexer in Embodiment 3. FIG.

FIG. 15B is a second diagram illustrating the manufacturing process of the SAW duplexer in Embodiment 3. FIG.

FIG. 15C is a third view showing the manufacturing process of the SAW duplexer in Embodiment 3. FIG.

FIG. 15D is a fourth diagram showing the manufacturing process of the SAW duplexer in Embodiment 3. FIG.

15E is a fifth view showing the manufacturing process of the SAW duplexer in the third embodiment.

15F is a sixth diagram showing the manufacturing process of the SAW duplexer in the third embodiment.

16A is a seventh diagram showing the manufacturing process of the SAW duplexer in the third embodiment.

FIG. 16B is an eighth view showing the manufacturing process of the SAW duplexer in the third embodiment. FIG.

FIG. 16C is a ninth diagram illustrating a manufacturing step of the SAW duplexer in Embodiment 3. FIG.

FIG. 16D is a tenth diagram showing the manufacturing process of the SAW duplexer in the third embodiment. FIG.

16E is an eleventh diagram showing the manufacturing steps of the SAW duplexer in the third embodiment.

FIG. 16F is a twelfth diagram showing the manufacturing process of the SAW duplexer in the third embodiment. FIG.

FIG. 16G is a thirteenth diagram showing a manufacturing process of the SAW duplexer in Embodiment 3. FIG.

FIG. 17 is a bottom view of a component cover in Embodiment 3. FIG.

18 is a cross-sectional view of the SAW duplexer of Embodiment 3. FIG.

19 is a cross-sectional view of a conventional electronic component package.

<Description of the code>

1: SAW duplexer (electronic component) 3: Board

4: mold resin 5: external electrode

6 component board 7 IDT electrode (element)

8: recessed part 9: part cover

10: protector 16: cavity

20: element cover 30: adhesive portion

Best Mode for Carrying Out the Invention

(Embodiment 1)

EMBODIMENT OF THE INVENTION The electronic component package of Embodiment 1 of this invention is demonstrated to an example as an example the acoustic wave device 1 for antenna common apparatuses (henceforth "SAW duplexer 1") as an electronic component.

As shown in FIG. 1, the SAW duplexer 1 constituting the electronic component package is disposed on the mounting substrate 3 together with the other electronic components 2a to 2c, and the mold resin 4 Covered with As shown in FIG. 2, the SAW duplexer 1 is mounted on the mounting substrate 3 via an external electrode 5 disposed on the mounting substrate 3, and is formed of a mold resin 4. It is covered.

In addition, SAW duplexer 1 says the component board | substrate 6 and the surface of the component board | substrate 6 on the lower surface (as a lower side in FIG. 2, facing the mounting board | substrate 3). The part cover 9 which has the recessed part 8 in the part which covers the lower surface side of the IDT electrode 7 as a some element arrange | positioned at the ()), and the component board | substrate 6, and faces the IDT electrode 7; And a protective body 10 made of resin is provided on the lower surface of the component cover 9. In addition, the external electrode 5 is a mounting board bonded to the ground terminal 12, the reception terminal 13, the antenna terminal 14, and the transmission terminal 15 of the SAW duplexer 1 shown in FIG. 8 ( An electrode provided at 3) is shown, which will be described later.

The manufacturing method of this electronic component package is demonstrated below.

First, as shown in FIG. 3, the IDT electrode 7 and the groove | channel 11 are formed in the lower surface of the component board | substrate 6, and the circuit of the SAW duplexer 1 shown in FIG. 4 is formed. In addition, although the reflector which arrange | positioned the short circuit electrode in parallel is common at both ends of IDT electrode 7, it simplifies. In addition, the groove 11 is formed by a dry etching process. As a material of the component substrate 6, a metal material such as aluminum is used as the material of the LiTaO ₃ or LiNbO ₃ and the IDT electrode 7. In addition, in the circuit of the SAW duplexer 1 shown in FIG. 4, the receiving terminal 13, the antenna terminal 14, the transmitting terminal 15, and the ground terminal 12 are each a component board (shown in FIG. It corresponds to the receiving terminal 13, the antenna terminal 14, the transmitting terminal 15, and the ground terminal 12 in the lower surface of 6).

On the other hand, in order to protect the IDT electrode 7 from corrosion by oxidation or moisture, as shown in FIG. 2, the component cover 9 made of silicon is provided on the lower surface side of the component substrate 6. 2 shows the A-A cross section in FIG.

In the component cover 9, as shown in FIG. 5, the recessed part 8 is formed in the part facing the IDT electrode 7 mentioned above by a dry etching process. Accordingly, as shown in FIG. 2, a cavity 16 is formed between the component cover 9 and the IDT electrode 7 to avoid the IDT electrode 7 from contacting the component cover 9. It is possible to secure the vibration space of the IDT electrode 7. In addition, as shown in Figs. 2 and 5, by providing the cavity 16 for each one or two adjacent IDT electrodes 7, the area of the part where the component cover 9 becomes thin can be made small, and as a result, the external pressure Can increase the strength.

Next, the process of adhering the component cover 9 to the component substrate 6 is shown.

First, the photosensitive resin is apply | coated to the lower surface (it is also the surface in which IDT electrode 7 is provided) of the component board | substrate 6 shown in FIG. 3, and then the mask 18 as shown in FIG. 7 is mounted. . The hatched portion of the mask 18 of FIG. 7 corresponds to the IDT electrode 7 of FIG. 3 and the through hole 17 of FIG. 6, and since the hole is drilled in this portion, the mask 18 is disposed on the mask 18. When exposed and washed, the photosensitive resin remains hardened only on the portion hatched on the mask 18, and does not remain on the portion not hatched.

Next, the mask 18 is removed, and SiO ₂ is applied to the entire lower surface of the component substrate 6 shown in FIG. 3, and the photosensitive resin is dissolved and removed to thereby remove the photosensitive resin, that is, the IDT electrode 7. ) and _the SiO ₂ remains only in a portion other than the through-holes 17. Through the remaining SiO ₂ , when the component substrate 6 and the component cover 9 are directly interatomicly bonded at room temperature, the SAW duplexer 1 as shown in FIG. 6 can be formed. In addition, although the process of adhering the component cover 9 in this Embodiment 1 was performed in the vacuum, the component cover 9 and the component board | substrate 6 can also adhere | attach using an adhesive agent, In that case, nitrogen atmosphere or oxygen atmosphere. You can do this at In addition, even when performing in an oxygen atmosphere, since the cavity 16 of FIG. 2 in this Embodiment 1 is a very small space, the amount of oxygen in the cavity 16 is also a very small amount. Only a thin metal oxide film is formed on the surface, but rather difficult to oxidize.

Next, as shown in FIG. 6, a through hole 17 for connecting the external electrode 5 and the component substrate 6 shown in FIG. 2 is formed in the component cover 9. This through hole 17 can be formed by a dry etching process. 6 shows the B-B cross section in FIG. By filling this through hole 17 with a metal material by sputtering, solder paste printing, or the like, electrical connection between the IDT electrode and the external electrode can be made.

Next, the receiving terminal 13, the antenna terminal 14, the transmitting terminal 15, and the ground which are joined to the external electrode 5 provided on the lower surface of the part cover 9, that is, not hatched in FIG. The resin protective body 10 shown in FIG. 2 is provided in the part except the place where the terminal 12 is arrange | positioned. This protector 10 forms the rubber modified flexible resin which added rubber | gum, such as a silicone rubber, to epoxy resin or polyimide resin by printing etc.

After the component substrate 6 and the component cover 9 are adhered together, as shown in FIG. 8, the ground terminal 12, the receiving terminal 13, and the antenna terminal ( As shown in FIG. 2, 14) and the transmission terminal 15 are bonded to the external electrode 5 of the mounting board 3, and the SAW duplexer 1 is mounted on the mounting board 3. As shown in FIG.

Finally, the process of covering the SAW duplexer 1 with the mold resin 4 will be described.

First, the composite electronic component before coating in which the SAW duplexer 1 and the plurality of electronic components 2a to 2c of FIG. 1 are mounted is placed in a mold, and then the mold resin 4 heated to the mold is injected. After that, it is cooled and molded. In this Embodiment 1, the epoxy resin which disperse | distributed the filler to the mold resin 4 was used, and the injection conditions of the mold resin 4 made resin temperature 175 degreeC, and injection pressure 50-100 atm.

When the mold resin 4 is filled between the component cover 9 and the mounting board 3, a very large upward pressure (upward direction in FIG. 2) is applied to the component cover 9. Since the protective member 10 made of resin provided on the lower surface of the component cover 9 shown in FIG. 2 has a modulus of elasticity smaller than that of the mold resin 4, when the pressure is received from the mold resin 4, the resin deforms and crosses the pressure. Disperse in the direction. Therefore, the stress given to the SAW duplexer 1 from the lower part of the component package can be buffered.

In addition, by providing the protector 10, the space between the SAW duplexer 1 and the mounting substrate 3 is reduced, and the amount of the mold resin 4 entering the space can be reduced. Therefore, the stress from the mold resin 4 can be suppressed.

As a result of this, in Embodiment 1, the strength with respect to the pressure of the package of the SAW duplexer 1 can be raised, and damage can be prevented.

In addition, in this Embodiment 1, as above-mentioned, the guard is joined to the part which is not hatched in FIG. 8, ie, the external electrode 5 in the lower surface of the component cover 9 (ground terminal 12). ), The receiving terminal 13, the antenna terminal 14, and the place where the transmitting terminal 15 is disposed) in all parts, but at least in the cavity 16 except for the junction with the external electrode 5 By providing it in the part which opposes, the same effect can be acquired.

In the first embodiment, as illustrated in FIG. 3, a plurality of IDT electrodes 7 are formed on the component substrate 6, and as shown in FIG. 5, one or two IDT electrodes 7 are provided. Each of the recesses 8 is formed, but by forming a plurality of recesses 8 in this manner, the SAW duplexer 1 is damaged in comparison with the case where one recess 8 is formed to cover all of the IDT electrodes 7. Can be suppressed efficiently.

That is, by providing the plurality of recesses 8, the cavity 16 is divided, and the partition wall 19 shown in FIG. 2 is formed between the plurality of cavities 16. And this partition wall 19 becomes a support | pillar, and can distribute external stress. Therefore, cracking of the component board | substrate 6 or the component cover 9 can be suppressed. In addition, this partition wall 19 may be arbitrarily formed in the cavity 16 by resin etc. separately.

The plurality of cavities 16 may be formed by completely dividing the plurality of cavities 16, but may be partially connected between adjacent cavities 16 by a tunnel-shaped communication path (not particularly shown). By forming the communication path in this manner, when an excessive external pressure is applied to a part of the cavity 16, the external pressure can be distributed to the other cavity 16 through the communication path. As a result, the strength with respect to the external pressure of the electronic component package can be improved.

In addition, this communication path may be provided on the component substrate 6 or may be provided on the component cover 9. In addition, when providing the communication path on the component board | substrate 6, you may use the groove 11 of the lower surface of the component board | substrate 6 shown in FIG.

(Embodiment 2)

EMBODIMENT OF THE INVENTION Hereinafter, Embodiment 2 which concerns on this invention is described using drawing.

The main difference between the second embodiment and the first embodiment described above is that in order to form the cavity 16, the lower side of the IDT electrode 7 as an element (as the lower side in FIG. 9, the mounting substrate 3). The element cover 20 which covers the side facing the same, hereinafter same) is used, and other similar configurations will be described with the same reference numerals, and the description thereof will be simplified.

Also in the electronic component package of the second embodiment, as shown in FIG. 1, the SAW duplexer 1 is mounted on the mounting substrate 3 together with the other electronic components 2a to 2c, and the mold resin 4 is used. It is a coated structure.

In addition, the SAW duplexer 1 constituting the electronic component package, as shown in FIG. 9, has a component substrate 6 and IDT as a plurality of elements disposed on the lower surface of the component substrate 6. An element cover 20 covering the lower surface side of the electrode 7, the IDT electrode 7, a component cover 9 covering the entire lower surface of the component substrate 6 including the element cover 20, and the component. It has a structure provided with the protective body 10 made of resin provided in the lower surface of the cover 9. As shown in FIG. In addition, the external electrode 5 is the ground terminal 12, the receiving terminal 13, the antenna terminal 14, and the transmission terminal 15 of the SAW duplexer 1 shown in FIG. 8 similarly to Embodiment 1 mentioned above. ) Refers to an electrode provided on the mounting substrate 3 to be bonded.

Further, by forming the cavity 16 between the IDT electrode 7 and the element cover 20, the vibration space of the elastic waves is secured and the vibration space is kept in an airtight state. In addition, in Embodiment 2, the element cover 20 is provided for every one or two IDT electrodes 7.

In addition, LiTaO ₃ was used as the material of the component substrate 6, aluminum was used as the material of the IDT electrode, and epoxy resin containing filler was used as the material of the component cover 9. Silicon oxide was used as this filler, and the content rate was about 80 wt%. In addition, the photosensitive polyimide was used for the edge part 20a of the element cover 20, and the photosensitive dry film of the three-layered structure which sandwiched the photosensitive layer with polyester and polyethylene was used for the cover part 20b of the element cover 20. As shown in FIG. In addition, as the material of the component substrate 6, a metal other than aluminum may be used as the material of the LiNbO ₃ and the IDT electrode 7.

The manufacturing method of the SAW duplexer 1 of this Embodiment 2 is demonstrated below.

First, as shown in FIG. 10, aluminum is deposited and sputtered on the whole lower surface of the component substrate 6, and then, as shown in FIG. 11A, electrode patterns, such as IDT electrode 7, by dry etching process. To form.

11A to 12F and FIG. 12A to FIG. 12 are views illustrating a manufacturing process of the SAW duplexer 1, and therefore, FIG. 1, FIG. 2 and other drawings showing the mounting state of the SAW duplexer 1 are shown. The SAW duplexer 1 shown in the figure is inverted in the up-down direction. Therefore, only in the description using FIGS. 11A-F and FIG. 12A-F, the description of that other than that and the up-down direction are reversed.

Next, as shown in FIG. 11B, the photosensitive polyimide layer 21 is coated on the component substrate 6 with a spin coat, and a portion corresponding to the edge portion 20a of the element cover 20 is disposed on the upper portion thereof. The mask 22 which let light pass is mounted, it exposes, and develops. Accordingly, the edge portion 20a of the element cover 20 may be formed as shown in FIG. 11C. Thereafter, as shown in FIG. 11D, the photosensitive dry film 23 is placed on the component substrate 6 through the edge portion 20a, and the element cover 20 is placed above the photosensitive dry film 23. The mask 24 which let light pass through the part corresponded to the cover part 20b of this is mounted, and it exposes and develops. Accordingly, as shown in FIG. 11E, the element cover 20 including the edge portion 20a and the cover portion 20b is formed.

Next, as shown in FIG. 11F, on the component substrate 6, a photosensitive resist (negative type) 25 is applied to cover the element cover 20, and the upper portion of the photosensitive resist 25 is described later. The part corresponding to the external terminal connection part 26 (shown in FIG. 12B) is masked with the mask 28 so that it may not expose. And when it exposes and develops, the hole 29 can be formed in the part corresponded to the external terminal connection part 26 of the photosensitive resist 25 like FIG. 12A.

Next, as shown in FIG. 12B, the portion of the hole 29 is filled with Cu by electroless plating to form an external terminal connection portion 26. Then, as shown in FIG. 12C, the photosensitive resist 25 is melt | dissolved and the component board | substrate 6 is put in a metal mold | die. And as shown in FIG. 12D, on the component board | substrate 6, the liquid epoxy resin (it becomes the component cover 9 later) is flown so that the element cover 20 and the external terminal connection part 26 may be covered, and thermosetting Let's do it.

Next, as shown in FIG. 12E, the epoxy resin forming the component cover 9 is polished until the external terminal connecting portion 26 is exposed to form the component cover 9. 12F, electrodes (ground terminal 12, receiving terminal 13, antenna terminal 14, transmitting terminal 15, and ends) that are joined to the external electrode 5 on the external terminal connecting portion 26. When only the ground terminal 12 and the receiving terminal 13 are shown, and the antenna terminal 14 and the transmitting terminal 15 are not shown), the SAW duplexer 1 is completed.

Next, as shown in FIG. 9 (as above, FIGS. 9A, 11A-F, and 12A-F are reversed up and down), they are joined to the external electrode 5 on the bottom surface of the component cover 9. The protective body 10 made of resin is provided on the surface except the place where the electrodes (ground terminal 12, receiving terminal 13, antenna terminal 14, transmitting terminal 15) are placed. It is preferable to provide this protection body 10 so that especially the cavity 16 may oppose. In addition, this protective member 10 forms rubber modified flexible resin which added rubber | gum, such as a silicone rubber, to an epoxy resin or a polyimide resin, by printing etc.

Finally, the process of covering and packaging the SAW duplexer 1 mounted on the mounting board 3 with the mold resin 4 is demonstrated.

First, a mold resin 4 having a SAW duplexer 1 as shown in FIG. 1 and a composite electronic component mounted with other electronic components 2a to 2c mounted in a mold, and then heated and pressed on the mold. Is injected, and then cooled to form. In this Embodiment 2, the epoxy resin which disperse | distributed the filler was used for the mold resin 4, The injection conditions of the mold resin 4 made resin temperature 175 degreeC, and injection pressure 50-100 atm. In addition, silicon oxide was used for the filler of this mold resin 4, and the mixing rate was 80 to 90 wt%.

By setting it as said structure, the strength with respect to the external pressure at the time of processing with the mold resin 4 can improve the electronic component package, and it can prevent damage to an electronic component. The reason is explained below.

As shown in FIG. 9, when the mold resin 4 is filled between the component cover 9 and the mounting substrate 3, a very large upward pressure is applied to the component cover 9. However, since the protective body 10 made of resin has a smaller elastic modulus than that of the mold resin 4, that is, it is soft, it is deformed when the pressure is received from the mold resin 4, and the pressure can be dispersed in multiple directions. Therefore, the protection body 10 can buffer the stress applied to the SAW duplexer 1 below the component cover 9 and the element cover 20.

In addition, when the protective body 10 is provided, the space between the SAW duplexer 1 and the mounting substrate 3 becomes small, and the amount of the mold resin 4 entering the space can be reduced. Therefore, the stress from the mold resin 4 can be suppressed.

In addition, in the second embodiment, as described above, the protective member 10 is not hatched in FIG. 8, that is, a junction portion with the external electrode 5 on the lower surface of the component cover 9 (that is, , Except for the ground terminal 12, the receiving terminal 13, the antenna terminal 14, and the place where the transmitting terminal 15 is disposed, but at least in the cavity except for the junction with the external electrode 5. By providing in a part which opposes (16), the same effect can be acquired.

Moreover, by making the component cover 9 into the epoxy resin containing a filler, the damage of an electronic component can be suppressed and the reliability with respect to external pressure can be improved.

This is because, when an external pressure is applied to the electronic component, the component cover 9, on the one hand, can be elastically deformed to some extent by the resin portion, and the external pressure can be dispersed in multiple directions. On the other hand, it becomes possible to maintain the external shape of the part cover 9 by the part of a filler, and can suppress excessive elastic deformation. As a result, the strength with respect to the external pressure of the electronic component package increases, and damage to the IDT electrode 7 can be reduced.

In addition, by including the filler in the component cover 9, the component cover 9 exhibits hydrophobicity as compared with the case where the component cover 9 is formed only by resin, and the corrosion of the IDT electrode 7 by moisture can be suppressed.

In the second embodiment, a plurality of IDT electrodes 7 are formed on the component substrate 6, and the element cover 20 is formed for each one or two IDT electrodes 7. Thus, by forming a plurality of element covers 20, damage to the SAW duplexer 1 can be effectively suppressed as compared with the case where one element cover 20 is provided to cover all IDT electrodes 7. .

That is, by providing the plurality of element covers 20, the cavity 16 is divided, and the partition wall 19 shown in FIG. 9 is formed between the plurality of cavities 16. And this partition wall 19 becomes a support | pillar, and can distribute external stress. Therefore, the division of the component board | substrate 6 or the component cover 9 and the element cover 20 can be suppressed. In addition, this partition wall 19 may be arbitrarily formed in the cavity 16 by resin etc. separately.

The plurality of cavities 16 may be formed by completely dividing the plurality of cavities 16, but may be partially connected between adjacent cavities 16 by a tunnel-shaped communication path (not particularly shown). By providing a communication path in this way, when excessive external pressure is applied to a part of the cavity 16, the external pressure can be distributed to another cavity 16 through the communication path. As a result, the strength against external pressure of the electronic component package can be improved.

In addition, in the second embodiment, the component cover 9 is thinner than the component substrate 6 in order to reduce the magnification of the electronic component. Therefore, the component cover 9 is particularly easy to crack, and according to the damage of the component cover 9, the element cover 20 also tends to be damaged. Therefore, since the strength of this component cover 9 needs to be improved, the above-described configuration is required.

(Embodiment 3)

EMBODIMENT OF THE INVENTION Hereinafter, Embodiment 3 which concerns on this invention is described using drawing.

In addition, the main difference between the third embodiment and the first embodiment described above is that, as shown in FIG. 13, in order to form the cavity 16, the bonding portion 30 is provided on the outer circumference of the IDT electrode 7 as an element. The component substrate 6 and the component cover 9 are bonded to each other through the adhesive portion 30, and the portion surrounded by the adhesive portion 30 is used as the cavity 16. Other similar configurations will be described with the same reference numerals and the description will be simplified.

Also in the electronic component package of this Embodiment 3, as shown in FIG. 1, SAW duplexer 1 is provided on the mounting board 3 simultaneously with other electronic components 2a-2c, and these are molded resin 4 It has a structure covered with.

As shown in FIG. 13, the SAW duplexer 1 constituting the electronic component package has a component substrate 6 and a lower surface of the component substrate 6 (FIGS. 13, 15A to 15F). 16T to IDT electrode 7 as a some element arrange | positioned below and same as the description of Embodiment 3, and the component cover 9 which covers the lower surface side of the component board | substrate 6 shown to FIG. 16A-G. And a protective member 10 made of resin is provided on the lower surface of the component cover 9. In addition, the external electrode 5 is the ground terminal 12, the receiving terminal 13, the antenna terminal 14, and the transmission of the SAW duplexer 1 shown in FIG. 17 similar to FIG. 8 of Embodiment 1 mentioned above. The electrode provided in the mounting board 3 to which the terminal 15 is bonded is pointed.

In addition, an adhesive portion 30 is provided between the component cover 9 and the IDT electrode 7, and when the component cover 9 and the component substrate 6 are bonded together, the cavity 30 is formed by the thickness of the adhesive portion 30. 16 is formed. On the lower surface of the component cover 9, a protective member 10 having a smaller modulus of elasticity than the mold resin 4, that is, a softness is provided. Moreover, the adhesion part 30 is the 1st adhesion part 30a (shown in FIGS. 15D-F) provided in the component board | substrate 6 side, and the 2nd adhesion part 30b provided in the component cover 9 side. ) (Shown in FIGS. 16C to F) is bonded.

Hereinafter, the manufacturing method of the electronic component package in Embodiment 3 is demonstrated using FIGS. 15A-F and 16A-G. 15A to 15F and FIGS. 16A to 15G illustrate the manufacturing process of the SAW duplexer 1, and in contrast to FIGS. 11A to 12F and 12A to 12F, the mounting state of the SAW duplexer 1 is shown. The same vertical direction as FIG. 1, FIG. 2 is shown.

At first, as shown in FIG. 15A, aluminum is deposited and sputtered on the entire lower surface of the component substrate 6, and thereafter, by dry etching, electrodes such as the IDT electrode 7 and the like are shown in FIG. Form a pattern.

Next, as shown in FIG. 15B, the resist 31 is applied to the entire lower surface of the component substrate 6. And as shown in FIG. 15C, the electrode part to which the receiving terminal 13, the antenna terminal 14, the transmission terminal 15, and the ground terminal 12 of FIG. 17 are connected, and all the IDTs in FIG. The outer peripheral region of the component substrate 6 surrounding the electrode 7 is patterned so as to be exposed. This is to prevent aluminum from being deposited to the edge of the IDT electrode 7 in the next step, and to sufficiently secure the vibration space of the IDT electrode 7.

Then, aluminum is deposited on the entire surface of the patterned resist 31 as shown in Fig. 15D, and a first adhesive portion 30a is provided on the exposed portion. Thereafter, as shown in Fig. 15E, polishing is performed from the bottom to adjust the height of the first bonding portion 30a. At this time, since the surface after vapor deposition is large, it is preferable to grind a little also the lower surface of the 1st adhesion part 30a, and to make the surface smooth. This is for enhancing the adhesiveness with the component cover 9 mentioned later.

Next, when the component substrate 6 is immersed in the release liquid of the resist 31 or the like, and the resist 31 is dissolved, the first adhesive portion 30a is slightly higher than the IDT electrode 7 as shown in FIG. 15F. Can be formed.

On the other hand, as shown in Fig. 13, in order to protect the IDT electrode 7 from corrosion due to oxidation or moisture, a component cover 9 made of silicon is provided on the lower surface side of the component substrate 6. The manufacturing method of this component cover 9 is demonstrated below using FIGS. 16A-G.

First, as shown in Fig. 16A, the resist 31 is applied to the entire upper surface of the component cover 9, and patterned so that the resist 31 remains in addition to the portion to be joined to the first bonding portion 30a as shown in Fig. 16B. Thereafter, as shown in FIG. 16C, aluminum to be the second bonding portion 30b is deposited on the entire surface of the component cover 9.

Next, as shown in FIG. 16D, the surface of the component cover 9 is polished and adjusted to the height of the second bonding portion 30b. At this time, similarly to the first bonding portion 30a, it is preferable that the upper surface of the second bonding portion 30b is also slightly polished to smooth the surface. Thereafter, when the component cover 9 is immersed in the release liquid of the resist 31 or the like and the resist 31 is dissolved, the component cover 9 as shown in Fig. 16E is completed.

Next, the method of joining the component cover 9 and the component board | substrate 6 is demonstrated below.

First, as shown in FIG. 16F, positioning is performed such that the first bonding portion 30a provided on the lower surface of the component substrate 6 and the second bonding portion 30b provided on the upper surface of the component cover 9 are joined. . Next, each joining surface of this 1st adhesion part 30a and the 2nd adhesion part 30b is plasma-processed, and it wash | cleans. Then, it pressurizes lightly, heating at 200 degreeC, and the 1st adhesion part 30a and the 2nd adhesion part 30b are directly bonded between atoms as FIG. 16G, and the adhesion part 30 is formed.

Next, as shown in FIG. 18, the electrode (ground terminal 12, receiving terminal 13, antenna terminal 14, transmission terminal of FIG. 17 and FIG. 18) provided in the lower surface of the component cover 9 is shown. (15) However, in FIG. 18, only the ground terminal 12 and the antenna terminal 14 are shown, and the through-hole 17 for connecting each electrode provided in the component board | substrate 6 is formed by dry etching process. do. 18 shows the B-B cross section in FIG. Thereafter, Ti, Ni, and Au are sequentially deposited inside the through hole 17, and solder is printed and filled into the inside of the vapor deposition film to form an external terminal connection portion 32.

Next, as shown in FIG. 13, the protective body 10 made of resin is provided in all the surfaces except the place where the electrode which joins with the external electrode 5 is arrange | positioned as the lower surface of the component cover 9 is provided. . This protector 10 forms rubber modified soluble resin which added rubber | gum, such as a silicone rubber, to epoxy resin or polyimide resin by printing etc. Then, as shown in FIG. 17, the electrode which joins the external electrode 5 to the position which hatched in the lower surface of the component cover 9, ie, the ground terminal 12 of FIGS. 7 and 18, reception is received. When the terminal 13, the antenna terminal 14, and the transmission terminal 15 are arranged, the SAW duplexer 1 is completed.

And finally, as shown in FIG. 1, the process of covering and packaging the SAW duplexer 1 mounted in the mounting board 3 with the mold resin 4 is demonstrated.

First, a composite electronic component in which the SAW duplexer 1 and the other electronic components 2a to 2c are mounted is placed in a mold, and then the mold resin 4 heated therein is injected, and then cooled and molded. do. In this Embodiment 3, the epoxy resin which disperse | distributed the filler was used for the mold resin 4, and the injection conditions of the mold resin 4 made resin temperature 175 degreeC, and injection pressure 50-100 atm. In addition, silicon oxide was used for the filler of this mold resin 4, and the mixing rate was 80 to 90 wt%.

By setting it as the said structure, the strength of the electronic component package with respect to the external pressure at the time of processing with the mold resin 4 can be improved, and damage to an electronic component can be prevented. The reason is explained below.

As shown in FIG. 13, when the mold resin 4 is filled between the component cover 9 and the mounting substrate 3, a very large upward pressure is applied to the component cover 9. Since the protective member 10 has a smaller elastic modulus than the mold resin 4, that is, it is soft, it is deformed when the pressure is received from the mold resin 4, and the pressure can be dispersed in the horizontal direction. Therefore, the protector 10 can buffer the stress applied to the SAW duplexer 1 under the component cover 9.

In addition, when the protective body 10 is provided, the space between the SAW duplexer 1 and the mounting substrate 3 becomes small, and the amount of the mold resin 4 entering the space can be reduced. Therefore, the stress from the mold resin 4 can be suppressed.

In addition, the lower part of the component cover 9 has the whole part except the place where the receiving terminal 13, the antenna terminal 14, the transmitting terminal 15, and the ground terminal 12 which are joined to the external electrode 5 are arrange | positioned. Although the protection body was provided in this, the same effect can be acquired by providing in the some part which opposes the cavity 16 except the junction part of the external electrode 5 at least.

In addition, in Embodiment 3, there exists an adhesion part 30 between some IDT electrode 7, and this adhesion part 30 functions as the partition wall which partitions the cavity 16 small. When the external pressure in the mold resin 4 or the like is applied from the top and the bottom of the SAW duplexer 1, the partition wall becomes a support, and the stress can be dispersed, and the strength against the external pressure of the package of the SAW duplexer 1 is increased. Can be improved.

In addition, in the third embodiment, the component cover 9 is made thinner than the component substrate 6 in order to reduce the magnification of the electronic component. Therefore, the part cover 9 is particularly easy to crack, and it is necessary to improve the strength of this part cover 9. For this reason, the structure and means as mentioned above are calculated | required.

Since the electronic component package which concerns on this invention can improve the intensity | strength with respect to the external pressure of an electronic component package, and can prevent the damage of an electronic component, it can be used for a transfer mold process process etc. under high pressure conditions. Therefore, the industrial applicability of the present invention is very large.

Claims (5)

A mounting substrate, an external electrode disposed on the mounting substrate, an electronic component mounted on the mounting substrate via the external electrode, and a mold resin covering the electronic component on the mounting substrate, The said electronic component has a component board | substrate, the element arrange | positioned in the surface which opposes the said mounting board | substrate of the said component board | substrate, and the component cover which covers the surface side facing the said mounting board | substrate of the said component board | substrate, The electronic component package which provided the cavity between the said element cover and the said component cover, and provided the protection body whose elastic modulus is smaller than the said mold resin in the surface which opposes the said mounting board of the said component cover except the junction part of the said external electrode. . The method according to claim 1, The said protective body is an electronic component package formed from resin or rubber. The method according to claim 1, An electronic component package in which a recess is formed in a portion of the component cover facing the element, and the cavity is formed by the recess. The method according to claim 1, An electronic component package formed by covering the device with an element cover to form the cavity. The method of claim 1, The electronic component package which provided the adhesive part in the outer periphery of the said element, bonds the said component board | substrate and said component cover via the said adhesive part, and forms the said cavity in the part enclosed by the said adhesive part.

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