JP7457417B2 - Module containing elastic wave device - Google Patents

Description

The present invention relates to a module including an acoustic wave device that requires a hollow structure.

In communication equipment terminals such as mobile phones and personal digital assistants, RF devices such as filters and duplexers tend to be configured as multi-chip modules by integrating them with front-end modules and power amplifiers to reduce size. In these multi-chip modules, multiple chip components are mounted on a common substrate and sealed with molded resin.

For acoustic wave devices that require a hollow structure, such as those that constitute SAW filters and BAW filters, where the chip components mounted on this substrate are made, conventionally, a hollow portion was formed for each individual acoustic wave device chip. (For example, see Patent Document 1). That is, as shown in FIG. 5A, a conventional acoustic wave device 50 includes a substrate 51 dedicated to the acoustic wave device, a bare chip 52, and a hollow portion 56. A dam 54 for forming a hollow portion 56 is provided between the dedicated substrate 51 and the bare chip 52 of the acoustic wave device, and a connecting portion 53 connects the dedicated substrate 51 and the bare chip 52 electrically. Mechanically connected. This dam 54 prevents the sealing resin 55 provided for each acoustic wave device 50 from entering the hollow portion 56 and entering the electrode arrangement portion of the bare chip 52 (around where the electrodes 52a are arranged). When these acoustic wave devices 50 are connected to the common substrate 57 via the connecting portion 58 and mounted together with other acoustic wave devices 50 or other active elements or passive elements that do not require a hollow structure, an unillustrated seal is used. Covered with a stopper resin.

The structure of this conventional acoustic wave device, that is, if each acoustic wave device 50 is configured with a chip having a hollow part 56 and is mounted together with other components on a common substrate 57 to form a module, the following advantages can be obtained. be. First, due to the manufacturing process, if a component such as an acoustic wave device is manufactured as a chip first, then a manufacturing device or a manufacturing line is used to mount the chip on the common substrate 57. This makes it easy to manufacture even in an environment where there is no multi-type, multi-functional mounting equipment. Second, since it is easy to understand and guarantee the characteristics of the acoustic wave device 50 as a single component, it is easy to design the module. Third, when a defect occurs in a module, it is easy to analyze where the defect is occurring, and it is relatively easy to analyze which manufacturer or manufacturing department caused the defect in the process. It is clear.

Special Publication No. 2002-510929

On the other hand, the conventional acoustic wave device 50 described above has the following problems. First, since the board 51 dedicated to the acoustic wave device is interposed between the bare chip 52 of the acoustic wave device 50 and the common board 57, the conduction path from the bare chip 52 to the common board 57 becomes long, and the parasitic Resistance, capacitance, and inductance, or parasitic impedance, increase, leading to performance degradation. Second, when looking at the multi-chip module as a whole, the board has two layers: a board 51 dedicated to acoustic wave devices and a common board 57, and the sealing resin is also a sealing resin 55 for acoustic wave devices (not shown). Since it is duplicated with the one for the module, it increases the process cost and material cost. Thirdly, since the acoustic wave device 50 has a structure that combines a dedicated substrate 51 and a bare chip 52, the height H1 and width W1 are large, which becomes an obstacle to making the module smaller and thinner, and requires high-density mounting. easy to inhibit.

In view of the above problems, the present invention makes it possible to simplify the structure, achieve high-density packaging, reduce costs, and reduce parasitic impedance when configuring a module that includes an acoustic wave device that requires a hollow structure. The purpose of the present invention is to provide a module including an acoustic wave device.

One aspect of a module including an acoustic wave device according to the present invention is a module including an acoustic wave device requiring a hollow structure, the module comprising: a substrate having a plurality of conductive pads formed on a component mounting surface; at least one acoustic wave device having an electrode arrangement portion on a surface facing the component mounting surface of the substrate and having a conductive pad electrically connected to the conductive pad; at least one flip-chip mounted device other than an acoustic wave device, the flip-chip mounted device having a conductive pad electrically connected to the conductive pad on the component mounting surface of the substrate; and a dam provided between the component mounting surface of the substrate and a periphery of the acoustic wave device, forming a hollow portion between each acoustic wave device and the substrate that surrounds the electrode arrangement portion and preventing the infiltration of sealing resin from the outside into the hollow portion, the hollow portion being formed between the substrate and the substrate. The formed acoustic wave device and a flip-chip mounted device other than the acoustic wave device are arranged adjacent to each other, and an underfill material is filled between the flip-chip mounted device and the substrate, the dam has an uneven planar shape on the edge of the flip-chip mounted device side adjacent to the acoustic wave device, and at least a portion of the uneven edge of the dam has a recess located outside the chip end of the adjacent flip-chip mounted device to ensure an air passage when the underfill is filled, and at least a portion of the substrate-facing surface side of the acoustic wave device of the dam is bonded to the surface of the substrate-facing surface of the acoustic wave device, and a sealing resin is in contact with the portion of the dam other than the substrate side and the hollow portion side that is not bonded to the acoustic wave device.

According to this aspect, an acoustic wave device in which a hollow portion is formed between the substrate and a flip-chip mounting device other than the acoustic wave device are arranged adjacent to each other, and the flip-chip mounting device and the substrate are arranged adjacent to each other. An underfill material is filled in between, and the underfill material comes into contact with the dam of the acoustic wave device, so that the dam prevents the underfill material from entering the hollow part. Mounted devices can be placed close together. In addition, since the dam does not block the space between the flip-chip mounting device and the substrate due to the uneven shape of the edge of the dam, the underfill material can penetrate between the flip-chip mounting device and the substrate by penetration phenomenon. At the same time, voids are prevented from forming on the acoustic wave device side. Therefore, a good filling state of the underfill material can be obtained between the flip-chip mounting device and the substrate.

The present invention makes it possible to miniaturize packages, reduce their height, and achieve high-density mounting in modules that include acoustic wave devices, improve performance by reducing parasitic impedance, and reduce process and material costs.

1 is a cross-sectional view showing an embodiment of a module including an acoustic wave device according to the present invention. FIG. 2 is a plan view showing the module including the acoustic wave device of FIG. 1 in a state before sealing resin is applied. 2 is a plan view showing a pattern of dams in a module including the acoustic wave device of FIG. 1 . 2 is a partially enlarged sectional view of a module including the acoustic wave device of FIG. 1. FIG. (a) is an example of a module including a conventional acoustic wave device, and (b) is a cross-sectional view of the module including the acoustic wave device of FIG. 1. FIG. 7 is a plan view showing another example of a dam pattern in a module including an acoustic wave device of the present invention. FIG. 3 is a cross-sectional view showing another embodiment of a module including an acoustic wave device according to the present invention. 8 is a plan view showing the module including the acoustic wave device of FIG. 7 in a state before sealing resin is applied. FIG. 8 is a partially enlarged sectional view of a module including the acoustic wave device of FIG. 7. FIG. 8 is a plan view showing another example of a dam pattern in the module including the acoustic wave device of FIG. 7 before a sealing resin is applied. FIG. 11 is a cross-sectional view illustrating the operation of a dam having the pattern of FIG. 10. 8 is a sectional view showing a modification of a module including the acoustic wave device of FIG. 7. FIG. 8 is a sectional view showing another modification of the module including the acoustic wave device of FIG. 7. FIG.

1 and 2 show one embodiment of a module including an acoustic wave device according to the present invention. A module 1 including acoustic wave devices of this embodiment shows an example in which two acoustic wave devices 3 are mounted on a substrate 2. The acoustic wave device 3 of this embodiment is a surface acoustic wave device (SAW device), in which an IDT electrode 6 is formed on one side of a piezoelectric body 5 made of a piezoelectric material. The piezoelectric body 5 is made of, for example, lithium tantalate (LT) or lithium niobate (LN), and the IDT electrode 6 is made of, for example, Al, Cu, Ni, Au, W, Mo, or the like. Although the IDT electrode 6 is shown in a simplified manner in the drawing, it actually includes a large number of comb-shaped input side electrodes, output side electrodes, and reflective electrodes.

The substrate 2 is composed of a ceramic substrate or a laminated substrate, and in this example, a laminated substrate having a planar conductor 8 therein is shown. Passive elements such as capacitors and inductors may be formed inside the substrate 2. As shown in FIG. 4, the component mounting surface 2a of the board 2 has a plurality of conductive pads 9. The surface opposite to the component mounting surface 2a of the board 2 is a mounting surface 2b to be attached to a motherboard (not shown), and a conductive pad 10 electrically and mechanically connected to the motherboard is mounted on this mounting surface 2b. has. Corresponding conductive pads 9 on the component mounting surface 2a and conductive pads 10 on the mounting surface 2b are connected via internal conductors 8 and via hole conductors (not shown).

The acoustic wave device 3 and the substrate 2 are electrically and mechanically connected via a plurality of connection parts 12. As shown in FIG. 4, these connection parts 12 are formed by conductive pads 13 provided on the connection electrodes 6a of the acoustic wave device 3 and bumps 14 that connect the conductive pads 9 on the substrate 2. configured. For example, Au or solder can be used for the bumps 14.

A sealing resin 16 is formed on the substrate 2 to cover the acoustic wave device 3 to be mounted and the substrate 2 . The sealing resin 16 fixes the acoustic wave device 3 to the substrate 2 by covering the surfaces of the acoustic wave device 3 and the substrate 2, and also prevents the acoustic wave device 3 from being affected by dust or moisture. It serves to increase the reliability of the module. This sealing resin 16 is made of thermosetting resin such as epoxy resin.

A dam 18 is formed on the substrate 2 before the acoustic wave device 3 is connected and mounted by the connecting portion 12. The dam 18 prevents the sealing resin 16 from entering the electrode arrangement portion 3a of the acoustic wave device 3. The electrode arrangement portion 3a includes an electrode on the surface of the acoustic wave device and a surface around which the elastic wave propagates. Further, in the case of a surface acoustic wave device including an IDT electrode 6 as in this embodiment, the electrode arrangement portion 3a includes a surface on the surface of the acoustic wave device around which an acoustic wave propagates around the IDT electrode 6. In the case of a surface acoustic wave device having a reflector on the electrode, the electrode arrangement portion 3a includes the area around the reflector. Therefore, as shown in FIGS. 3 and 4, the dam 18 is placed in a region corresponding to the electrode arrangement portion 3a of the acoustic wave device 3 in a plan view so that only the peripheral portion 3b of the acoustic wave device 3 faces. The dam 18 is formed in a planar shape with cutout parts 18a and 18b formed so as to surround the IDT electrode 6 and the connection part 12. As shown in FIGS. 1 and 2, the acoustic wave device 3, the substrate 2, and the dam 18 form a hollow portion 19 surrounding the electrode placement portion 3a.

As the dam 18, photosensitive resin is preferably used to facilitate patterning. The dam 18 is formed by coating a photosensitive resin on, for example, a sheet (not shown) as the raw material for the substrate 2, and applying the resin so that the cutout parts 18a and 18b of the dam 18 shown in FIG. 3 are formed. On the photosensitive resin layer thus prepared, the portions other than the regions to be the cutout portions 18a and 18b are covered with a mask, and exposure is performed. By performing development and heat treatment on the photosensitive resin layer, a dam 18 having cutout portions 18a and 18b is formed on the raw material (sheet) of the substrate 2. As the photosensitive resin that becomes the dam 18, from the viewpoint of improving the dam function of preventing the sealing resin from entering the hollow portion 19, it is preferable to use a photosensitive resin that has adhesive properties after patterning. As the photosensitive resin that has adhesive properties after patterning, epoxy acrylate resin or polyimide resin can be used.

After forming the dam 18, by attaching the elastic wave device 3 onto the raw material (sheet) of the substrate 2, as shown in FIG. 1 and FIG. The electrode arrangement portion 3 a of the device 3 forms a hollow portion 19 surrounded by a dam 18 . To form the hollow portion 19, the acoustic wave device 3 is mounted using a flip-chip bonder (not shown) so that the peripheral portion 3b of the acoustic wave device faces the edges of the cutout portions 18a, 18b. This mounting is performed by bonding bumps 14 provided in advance on the acoustic wave device 3 to conductive pads 9 provided in advance on a wafer serving as the substrate 2.

At the same time as bonding the conductive pads 9 and the bumps 14, the peripheral portion 3b of the acoustic wave device 3 is bonded to the photosensitive resin that becomes the dam 18. In other words, by using a photosensitive resin that has adhesive properties after patterning as the dam 18, the acoustic wave device 3 can be bonded to the dam 18 at the same time as attaching the acoustic wave device 3 to the substrate 2.

As shown in FIG. 5(b), the module 1 described above can be made smaller and thinner than the conventional module shown in FIG. 5(a). That is, in the conventional acoustic wave device 50, since a dedicated board 51 is required for each acoustic wave device 50, the width of the acoustic wave device 50 itself is wide, and the bare chips 52 and 52 of the acoustic wave device 50 are It is necessary to provide a large space S1 between the two. On the other hand, in the present embodiment, since the acoustic wave devices 3 are mounted as bare chips on the common substrate 2, the width of the acoustic wave devices 3 themselves is reduced, and the distance between the acoustic wave devices 3 is reduced. The space S2 can be small. Therefore, in the case of the module of this embodiment, the width W2 is smaller than the width W1 of the conventional module, making it possible to downsize and implement high-density packaging.

Further, as in the present embodiment, the shared portion 18c of the dam 18 between the adjacent elastic wave devices 3 is shared by the adjacent elastic wave devices 3, thereby further narrowing the space S2. It becomes possible to do so.

In addition, in the conventional example, a dedicated substrate 51 is required for each acoustic wave device 50, but in the present embodiment, a dedicated substrate 51 is not required, so the height H2 of the entire module can be made thinner compared to the height H1 of the conventional example.

In addition, in the conventional example, the conductor path from the connection part 53 in the acoustic wave device 50 to the substrate 57 requires a conductor path arranged on the dedicated substrate 51 and a conductor path of the connection part 58 from the dedicated substrate 51 to the common substrate 57, but in the present embodiment, these conductor paths are not required. This reduces the parasitic resistance, inductance, and capacitance, i.e., the parasitic impedance, making it possible to improve the characteristics of the module.

Furthermore, in the case of the conventional example, a dedicated board 51 and a connection part 58 for connecting the dedicated board 51 to the common board 57 are required, but in the case of the present invention, these are not necessary, so process costs and It is possible to reduce material costs.

Furthermore, in the case of the module 1 of this embodiment, module design is facilitated. This is because even if the number of chips included in the module 1 increases or the number of combinations of chip types increases, bare chips can be directly mounted on the substrate 2. This is because the stopping conditions do not change much, reducing the number of development steps required to determine process conditions. Furthermore, by making module design easier, it is possible to shorten the lead time for product deployment.

In this embodiment, the dam 18 is bonded to the acoustic wave device 3 only to the non-metallic areas on the surface of the piezoelectric body 5 of the acoustic wave device 3, as shown in Figures 1 and 4, and is not bonded to metal layers such as the connection electrode 6a, which is preferable for strong bonding between the dam 18 and the acoustic wave device 3.

Further, as described above, the dam 18 is preferably formed of a photosensitive resin, and the photosensitive resin preferably has adhesive properties after patterning. By using photosensitive resin for the dam 18 in this way, patterning of the cutout parts 18a and 18b of the dam 18 for forming the hollow part 19 becomes easy. In addition, since the photosensitive resin has adhesive properties, it is possible to attach the acoustic wave device 3 to the dam 18 at the same time as mounting the acoustic wave device 3 on the substrate, making it easy to attach the acoustic wave device 3 to the substrate 2. Become.

As shown in FIGS. 2 and 3, in this embodiment, the hollow portions 19 formed corresponding to the plurality of acoustic wave devices 3, 3 have the same planar shape. Unlike the above example, FIG. 6 is an example in which hollow portions 19X and 19Y with mutually different planar shapes are employed depending on the shapes of the acoustic wave devices 3X and 3Y. In this way, the planar shapes of the hollow portions are formed into the same shape or different shapes depending on the planar shapes of the acoustic wave devices 3, 3A, and 3B.

When a plurality of acoustic wave devices 3 are mounted adjacent to each other as in this embodiment, the space S2 between adjacent acoustic wave devices 3 (see FIG. 5(b)) is 100 μm or less. It becomes possible to set. That is, the dam 18 is formed as a common part 18c between the adjacent acoustic wave devices 3, so that the width W3 of the common part 18c is used as an individual area for the acoustic wave devices 3 and 3. It can be formed easily compared to the case where it is formed. Therefore, it is possible to mount the acoustic wave devices 3 and 3 in close proximity to the space S2, which is close to the close mounting limit of the flip chip mounter.

In addition, in this embodiment, the width t of the region of the peripheral part 3b of the acoustic wave device 3 in contact with the dam 18 (see FIGS. 2 and 4), that is, from the chip end 3c of the acoustic wave device to the inner end 18d of the dam. It is preferable that the distance to 20 μm or more is set to 20 μm or more. The upper limit of this width t is the distance from the chip end 3c to the formation region of the metal layer such as the connection electrode 6a. As shown in FIG. 4, the plurality of acoustic wave devices 3 and 3 are adjacent to each other and have opposite end portions 3c and 3c, and the substrate facing surface side 3d of the end portion 3c (of the substrate facing surface of the acoustic wave device 3). , a region near the opposing ends 3c and 3c) is in contact with the common portion 18c.

In addition, unevenness may occur on the surface of the dam 18 facing the acoustic wave device 3, but even if a gap is formed between the dam 18 and the acoustic wave device 3 in this case, it is preferable that the gap be less than one-tenth the radius of the filler particles in the sealing resin 16. By setting the dimensional relationship between the gap and the filler particles in this way, the dam 18 can more effectively prevent the sealing resin 16 from penetrating into the hollow portion 19.

7 is a sectional view showing another embodiment of the module of the present invention, FIG. 8 is a plan view thereof, and FIG. 9 is a partially enlarged sectional view of FIG. 7. This module shows a structure in which an acoustic wave device 3 and a flip-chip mounting device 22 other than the acoustic wave device are formed on the same substrate 2. In this example, the flip-chip mounting device 22 is an amplifier as an active device constituting a duplexer in a mobile communication device.

The flip-chip mounting device 22 is electrically and mechanically connected to the substrate 2 via a connecting portion 23 . As shown in FIG. 9, the connection portion 23 is provided between a conductive pad 24 provided on the component mounting surface 2a of the substrate 2 and a connection electrode 25 provided on the substrate facing surface of the flip chip mounting device 22. The conductive pad 26 is bonded to the conductive pad 26 by a bump 27. The bumps 27 are made of Au or solder.

The dam 18 is formed by patterning a photosensitive resin, and has adhesive properties after patterning. As shown in FIG. 7, a hollow portion 19 is formed between the acoustic wave device 3 and the substrate 2 by the dam 18 so as to surround the electrode arrangement portion 3a of the acoustic wave device 3. As shown in FIG. 8, in this example, two elastic wave devices 3 are provided adjacent to each other, and a common portion 18c of the dam 18 is formed between the two adjacent elastic wave devices 3. Here is an example.

In this module, first, in a state where the substrate 2 is a wafer, in order to form the hollow part 19, regions 18e and 18f, which will be the cutout parts of the dam 18, are exposed to light, corresponding to the acoustic wave devices 3 and 3, respectively. It is formed by patterning a synthetic resin. The photosensitive resin used is a material that has adhesive properties after patterning. Next, the acoustic wave device 3 is fixed to the substrate 2 by bonding it to the substrate 2 through the connecting portion 12 using a flip chip bonder. At this time, the elastic wave device 3 is also bonded to the dam 18. At this time, as shown in FIG. 8, the edge 18g of the dam 18 provided between the acoustic wave device 3 and the flip-chip mounting device 22 extends from the elastic wave device 3 to the flip-chip mounting device 22 side g1. It will be in a state where it protrudes by the width shown.

In this manner, with the acoustic wave device 3 mounted on the substrate 2, the flip-chip mounting device 22 is fixed by being bonded to the substrate 2 via the connecting portion 23. At this time, as shown in FIG. 8, the flip chip mounting device 22 is attached so that a gap g2 is formed between the edge 18g of the dam 18 and the flip chip mounting device 22. This gap g2 is provided to prevent voids from forming between the flip-chip mounting device 22 and the substrate 2. That is, after connecting the flip-chip mounting device 22 to the substrate 2 via the connecting portion 23, the fluid underfill material 21 is used to connect the flip-chip mounting device 22 and the substrate 2 using its surface tension. When the gap is infiltrated and filled, the gap g2 creates an escape route for air on the acoustic wave device 3 side, and as a result, the formation of voids is prevented.

After the acoustic wave device 3 and the flip-chip mounting device 22 are attached to the substrate 2 in this manner, a sealing resin 16 made of a thermosetting resin such as an epoxy resin is applied and molded with the sealing resin 16.

In this way, in the mounted state in which the acoustic wave device 3 and the flip-chip mounting device 22 are arranged adjacent to each other and the underfill material 21 is filled between the flip-chip mounting device 22 and the substrate 2, the acoustic wave device 3 The underfill material 21 contacts the edge 18g of the dam 18. Since the dam 18 prevents the underfill material 21 from penetrating into the hollow portion 19, the flip chip mounting device 22 can be placed close to the acoustic wave device 3.

FIG. 10 shows a preferred planar shape of the edge 18h of the dam 18 provided between the acoustic wave device 3 and the substrate 2 in the embodiment shown in FIG. This edge 18h has an uneven shape having a concave portion 30 concave toward the acoustic wave device 3 side and a convex portion 31 protruding toward the flip chip mounting device 22 side.

In this way, by forming the planar shape of the edge 18h of the dam 18 into an uneven shape, when filling the gap between the substrate 2 and the flip-chip mounted device 22 with the liquid underfill material 21 by the penetration phenomenon, as shown in FIG. 11, an air passage as indicated by the arrow 32 is easily secured between the recess 30 of the edge 18h and the flip-chip mounted device 22, and the formation of voids is reliably prevented. That is, even if there is some deviation in the gap between the acoustic wave device 3 and the flip-chip mounted device 22 and the flip-chip mounted device 22 is attached close to the acoustic wave device 3, the presence of the recess 30 reliably forms an air passage when filling the underfill material 21. Note that the corrugated shape of the edge 18h does not have to be formed in a smooth curved shape as shown in the figure, but may be formed with angular unevenness.

FIG. 12 is a sectional view showing still another embodiment of the module of the present invention. In this embodiment, a heat sink structure is formed in which a heat sink 33 as a heat dissipation means is provided on the surface of the flip chip mounting device 22 opposite to the substrate facing surface. The heat sink 33 is made of a metal with good thermal conductivity, such as Al, Cu, Ag, etc., and preferably a metal plate with a plurality of fins. By providing such a heat sink structure, a heat dissipation effect of heat generated in the flip-chip mounting device 22 can be obtained, and temperature rise can be suppressed.

In FIG. 13, instead of using the underfill material 21, a sealing resin 16a is filled between the substrate 2 and the flip-chip mounting device 22. In this case, the edge of the dam 18 used in the acoustic wave device 3 The tip of the portion 18g on the flip-chip mounting device 22 side contacts the sealing resin 16a on the flip-chip mounting device 22 side.

When carrying out the present invention, one module may include a plurality of flip-chip mounting devices 22, or one acoustic wave device may be provided for a plurality of flip-chip mounting devices 22. It's okay. Further, the flip-chip mounting device 22 may include not only an amplifier but also other active circuits (elements) or passive circuits (elements), such as a switch circuit.
In addition, when carrying out the present invention, various changes and additions can be made without departing from the gist of the present invention.

1 Module 2 Substrate 3, 3X, 3Y Acoustic wave device 3a Electrode placement portion 3b Peripheral portion 5 Piezoelectric body 6 IDT electrode 6a Connection electrode 9 Conductive pad 12 Connection portion 13 Conductive pad 14 Bump 16 Sealing resin 18 Dam 18a, 18b, 18e, 18f Dam deletion part 18c Common part 18g, 18h Edge part 19, 19X, 19Y Hollow part 21 Underfill material 22 Flip chip mounting device 23 Connection part 24, 26 Conductive pad 27 Bump 30 Concave part 31 Convex part 33 Heat sink

Claims (1)

In a module including an acoustic wave device that requires a hollow structure,
A board with multiple conductive pads formed on the component mounting surface,
at least one acoustic wave device having an electrode arrangement portion on a surface facing the component mounting surface of the substrate and having a conductive pad electrically connected to the conductive pad;
at least one flip-chip mounting device other than an acoustic wave device, the flip-chip mounting device having a conductive pad electrically connected to the conductive pad on the component mounting surface of the substrate;
A hollow portion is provided between the component mounting surface of the substrate and a peripheral portion of the acoustic wave device, and a hollow portion surrounding the electrode arrangement portion is formed between each acoustic wave device and the substrate; Equipped with a dam that prevents sealing resin from entering from the outside,
An acoustic wave device in which a hollow part is formed between the substrate and a flip-chip mounting device other than the acoustic wave device are arranged adjacent to each other,
An underfill material is filled between the flip-chip mounting device and the substrate,
The dam has an uneven planar shape at an edge on the side of the flip-chip mounting device adjacent to the acoustic wave device,
At least a portion of the uneven edge of the dam is located outside a chip end of the adjacent flip-chip mounting device to ensure an air passage during the underfill filling. Equipped with a recess to
At least a portion of the dam on the substrate-facing surface side of the acoustic wave device is adhered to a surface of the substrate-facing surface of the acoustic wave device,
A module including an acoustic wave device, wherein a sealing resin is in contact with a portion of the dam other than the substrate side and the hollow portion side, which is not bonded to the acoustic wave device.

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