CN101091313B - Electronic component package - Google Patents

Electronic component package Download PDF

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Publication number
CN101091313B
CN101091313B CN2006800016323A CN200680001632A CN101091313B CN 101091313 B CN101091313 B CN 101091313B CN 2006800016323 A CN2006800016323 A CN 2006800016323A CN 200680001632 A CN200680001632 A CN 200680001632A CN 101091313 B CN101091313 B CN 101091313B
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CN
China
Prior art keywords
piece cover
base plate
execution mode
installation base
electronic unit
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Active
Application number
CN2006800016323A
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Chinese (zh)
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CN101091313A (en
Inventor
鹰野敦
古川光弘
高山了一
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Japan Industrial Co Ltd
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Matsushita Electric Industrial Co Ltd
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Publication of CN101091313A publication Critical patent/CN101091313A/en
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Publication of CN101091313B publication Critical patent/CN101091313B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

The invention provides an electronic component package including: a mounting substrate; an external electrode placed on the mounting substrate; an electronic component mounted on the mounting substrate through the external electrode; and a mold resin covering the electronic component on the mounting substrate. The electronic component includes: a component substrate; elements which are placed on the surface of the component substrate opposed to the mounting substrate; and a component cover which covers the side of the surface of the component substrate opposed to the mounting substrate, the component cover having the cavities in the portions which are opposed to the elements, and a protective member which is lower in elastic modulus than the mold resin being disposed in a surface of the component cover opposed to the mounting substrate, the surface excluding portions joined with the external electrodes, and being opposed to the cavities. Thus the strength of the electronic component package against an external pressure is enhanced.

Description

Electronic components packaging structure
Technical field
The present invention relates to electronic components packaging structure.
Background technology
As an example of existing electronic unit encapsulation, the encapsulation of surface acoustic wave (below be called " SAW ") device, its profile is shown in figure 19, has: parts substrate 101; The IDT as element (Interdigital Transducer) electrode 102 that (below of Figure 19, with then state the surface of installation base plate 105 side in opposite directions) forms below this parts substrate 101; In IDT electrode 102 part in opposite directions therewith the piece cover 104 of recess 103 is arranged; And, the outer electrode 106 that this piece cover 104 is engaged with installation base plate 105.About the prior art documentation & info of so existing electronic unit encapsulation, for example be known that the spy opens 2000-261284 communique, spy and opens that 2001-244785 communique, spy are opened the 2003-110391 communique, the spy opens 2005-318157 communique etc.
Yet, in the existing electronic unit encapsulation, the compression shock in the time of can not bearing the resin mould processing sometimes.
In other words, be provided with recess 103 in the piece cover 104,, have the part of this recess 103 to make that piece cover 104 is extremely thin so that this piece cover 104 does not contact with a plurality of IDT electrodes 102.Therefore, this SAW device is installed on the installation base plate 105, under the situation with the resin mould covering, the pressure that gets into the resin mould between piece cover 104 and the installation base plate 105 is very big again, therefore, and piece cover 104 damaged.
Summary of the invention
The objective of the invention is to improve the intensity of the reply external pressure of electronic components packaging structure, prevent damage.
Therefore; The present invention is through being configured in the outer electrode on the installation base plate; With the electronic components packaging structure that the electronic component-use resin mould of installing on the installation base plate covers, electronic unit has the piece cover that forms the hole, and this piece cover covers the element of lower surface (with the surface of an installation base plate side in opposite directions) configuration of parts substrate; In the lower surface of piece cover (with the surface of an installation base plate side in opposite directions); Except with the outer electrode engaging portion, on the part in opposite directions of hole, be provided with and the little protective of resin mould resilience in comparison modulus.
In other words, electronic unit of the present invention comprises the encapsulation installation base plate; Be configured in the outer electrode on the installation base plate; Electronic unit, it is installed on the installation base plate through outer electrode; And on installation base plate the resin mould of overlay electronic parts, electronic unit comprises: the parts substrate; Element, it is configured in the surface towards installation base plate of parts substrate; And; Piece cover; The face side towards installation base plate of its coating member substrate, piece cover is having the hole with element part in opposite directions, with the little protective of resin mould resilience in comparison modulus; Be arranged on, except with the outer electrode engaging portion, with the surface towards installation base plate of hole piece cover in opposite directions.
Utilize aforementioned structure; Be provided with recess in piece cover; Make the thickness attenuation, the lower surface of piece cover is provided with and the little protective of resin mould resilience in comparison modulus, so; This protective when resin mould is filled, receive from below applied pressure and strain can be distributed to horizontal direction with this pressure.So, can cushion the stress that the outside is applied to electronic unit.
Therefore, the present invention can improve the intensity of the answering pressure of electronic components packaging structure, prevents damage.
Description of drawings
Fig. 1 is the stereogram of the electronic unit encapsulation of first execution mode.
The profile of the electronic unit encapsulation of first execution mode of Fig. 2.
Fig. 3 is the lower surface figure of parts substrate that constitutes the electronic unit encapsulation of first execution mode.
Fig. 4 is the circuit diagram of SAW duplexer that constitutes the electronic unit encapsulation of first execution mode.
Fig. 5 is the lower surface figure of piece cover that constitutes the electronic unit encapsulation of first execution mode.
Fig. 6 is the profile of the SAW duplexer of first execution mode.
Fig. 7 is the upper surface figure that forms the mask of the first execution mode piece cover.
Fig. 8 is the lower surface figure of the first execution mode piece cover.
Fig. 9 is the profile of second execution mode electronic unit encapsulation.
Figure 10 is the lower surface figure of parts substrate that constitutes the electronic unit encapsulation of second execution mode.
Figure 11 A be the expression second execution mode the SAW duplexer manufacturing process first figure.
Figure 11 B be the expression second execution mode the SAW duplexer manufacturing process second figure.
Figure 11 C is the 3rd figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 11 D is the 4th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 11 E is the 5th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 11 F is the 6th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 A is the 7th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 B is the 8th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 C is the 9th figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 D is the tenth figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 E is the 11 figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 12 F is the 12 figure of manufacturing process of the SAW duplexer of expression second execution mode.
Figure 13 is the profile of the electronic unit encapsulation of the 3rd execution mode.
Figure 14 is the lower surface figure of parts substrate that constitutes the electronic unit encapsulation of the 4th execution mode.
Figure 15 A be the expression the 3rd execution mode the SAW duplexer manufacturing process first figure.
Figure 15 B be the expression the 3rd execution mode the SAW duplexer manufacturing process second figure.
Figure 15 C is the 3rd figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 15 D is the 4th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 15 E is the 5th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 15 F is the 6th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 A is the 7th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 B is the 8th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 C is the 9th figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 D is the tenth figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 E is the 11 figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 F is the 12 figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 16 G is the 13 figure of manufacturing process of the SAW duplexer of expression the 3rd execution mode.
Figure 17 is the lower surface figure of the piece cover of the 3rd execution mode.
Figure 18 is the profile of the SAW duplexer of the 3rd execution mode.
Figure 19 is the profile of existing electronic unit encapsulation.
Description of reference numerals
1 SAW duplexer (electronic unit)
3 installation base plates
4 resin moulds
5 outer electrodes
6 parts substrates
7 IDT electrodes (element)
8 recesses
9 piece cover
10 protectives
16 holes
20 elements lid
30 junction surfaces
Embodiment
(first execution mode)
Is the electronic unit encapsulation of example explanation first embodiment of the invention with antenna multicoupler as electronic unit with acoustic wave device 1 (below be called " SAW duplexer 1 ").
Constitute the SAW duplexer 1 of this electronic unit encapsulation, its stereogram is as shown in Figure 1, and 2a～2c is configured on the installation base plate 3 with other electronic unit, and is covered by resin mould 4.SAW duplexer 1, its profile is as shown in Figure 2, is installed on the installation base plate 3 through the outer electrode 5 that is configured on the installation base plate 3, and is covered by resin mould 4.
And SAW duplexer 1 has: parts substrate 6; Be configured in this parts substrate 6 lower surface (be meant: below Fig. 2, towards the surface of a side of installation base plate 3, below identical) a plurality of IDT electrodes 7 as element; Sides and have the piece cover 9 of recess 8 with IDT electrode 7 part in opposite directions below the coating member substrate 6 are provided with resinous protective 10 below this piece cover 9.In addition, outer electrode 5 is meant with the earth terminal 12 of SAW duplexer 1 shown in Figure 8, receive terminal 13, antenna terminal 14, send the electrode that terminal is 15 that be connected, be located at installation base plate 3, and the back will be detailed.
The manufacturing approach of this electronic unit encapsulation is described below.
At first, as shown in Figure 3, at the lower surface formation IDT of parts substrate 6 electrode 7 and groove 11, form the circuit of SAW duplexer 1 shown in Figure 4.In addition, the reflector that disposes parallel short-circuiting electrode is configured in the both ends of IDT electrode 7 usually, omits explanation at this.And groove 11 is formed by dry etch process.The material of parts substrate 6 is LiTaO 3Perhaps LiNbO 3, the material of IDT electrode 7 uses is metal material such as aluminium.And the reception terminal 13 in the circuit of SAW duplexer 1 shown in Figure 4, antenna terminal 14, transmission terminal 15, earth terminal 12 correspond respectively to reception terminal 13, antenna terminal 14, transmission terminal 15 and the earth terminal 12 of parts substrate 6 lower surfaces shown in Figure 3.
On the other hand, corrode owing to oxidation and moisture in order to prevent IDT electrode 7, as shown in Figure 2, be provided with the piece cover 9 that makes with silicon in the lower face side of parts substrate 6.Fig. 2 is the figure of the A-A section of presentation graphs 3.
In piece cover 9, as shown in Figure 5, forming recess 8 with aforementioned IDT electrode 7 part in opposite directions with dry etch process.Thus, as shown in Figure 2, between piece cover 9 and IDT electrode 7, contact with piece cover 9 for fear of IDT electrode 7, hole 16 can be formed, thereby the oscillation space of IDT electrode 7 can be guaranteed.In addition, like Fig. 2 and shown in Figure 5,, can reduce the area of the part of piece cover 9 attenuation, thereby can improve the intensity of opposing external pressure through hole 16 being set in each or every two adjacent IDT electrode 7 places.
Then, the operation that piece cover 9 is joined to parts substrate 6 is described.
At first, photosensitive resin coating on lower surface (being exactly that face that the is provided with IDT electrode 7) side of parts substrate 6 as shown in Figure 3 is placed mask 18 as shown in Figure 7 then.The part of shade in the mask 18 of Fig. 7; Be the part suitable with the through hole of the IDT electrode of Fig. 37 and Fig. 6 17; Because perforate in this section, so when from mask 18 exposures with when clean, just on the part of the shade on the mask 18; Photoresist solidifies and is residual, does not just have residual in shadeless part.
Then, remove mask 18, all be coated with SiO at the lower surface of parts substrate 6 shown in Figure 3 2, the dissolving photoresist, and remove, like this, only there be not the part of photoresist, i.e. IDT electrode 7 and through hole 17 part in addition, residual Si O 2Through this residual SiO 2, directly take place at normal temperatures between parts substrate 6 and the piece cover 9 to combine between atom, can form SAW duplexer 1 as shown in Figure 6.In this first execution mode, the operation of attachment lid 9 is carried out in vacuum, still, also can engage with cement between piece cover 9 and the parts substrate 6, like this, can under blanket of nitrogen or oxygen atmosphere, carry out.In addition, when under oxygen atmosphere, carrying out, the hole 16 of Fig. 2 of this first execution mode is very little spaces; So the amount of oxygen in the hole 16 also is micro-, under such amount of oxygen; IDT electrode 7 surfaces only form very thin metal oxide film, are difficult to oxidation on the contrary.
Then, as shown in Figure 6, form through hole 17 on this piece cover 9, be used to connect outer electrode as shown in Figure 25 and parts substrate 6.This through hole 17 can form with dry etch process.Fig. 6 is the figure of B-B section in the presentation graphs 3.Utilize methods such as sputter, printing with paste in this through hole 17, to imbed metal material, can obtain the electrical connection between IDT electrode and the outer electrode like this.
Then; Shadeless part in Fig. 8; That is, disposed the reception terminal 13 lower surface setting, that engage with outer electrode 5 in piece cover 9, antenna terminal 14, sent the part outside the position of terminal 15, earth terminal 12, resinous protective 10 as shown in Figure 2 has been set.This warranty? Retaining body 10 is an epoxy resin or a polyimide resin, silicone rubber, etc. added to the rubber modified rubber flexible resin (Gomu Change of flexible resin), formed by printing and other methods.
So; After parts substrate 6 and piece cover 9 engage; As shown in Figure 8, the earth terminal 12 that the lower surface of piece cover 9 is provided with, reception terminal 13, antenna terminal 14 and transmission terminal 15, as shown in Figure 2; Engage with the outer electrode 5 of installation base plate 3, SAW duplexer 1 is installed on the installation base plate 3.
At last, the operation that covers SAW duplexer 1 with resin mould 4 is described.
At first,, put into mould, then inject heated mold resin 4, cooling forming then to this mould with the compound electronic unit before the covering of the SAW duplexer that Fig. 1 has been installed 1 and a plurality of electronic unit 2a～2c.In this first execution mode, resin mould 4 is for being dispersed with the epoxy resin of filler, and the injection condition of resin mould 4 is that resin temperature is 175 ℃, and injection pressure is 50～100atm.
When being filled into this resin mould 4 between piece cover 9 and the installation base plate 3; Be applied in the very large upwards pressure of (direction that makes progress among Fig. 2) on the piece cover 9; But; Because the protective 10 that the resin that the lower surface of piece cover 9 as shown in Figure 2 is provided with makes is littler than the modulus of elasticity of resin mould 4, so deform when receiving the pressure of resin mould 4 since then, its pressure is dispersed to horizontal direction.So, can cushion stress to SAW duplexer 1 from the component packages below.
And because be provided with protective 10, the space between SAW duplexer 1 and the installation base plate 3 diminishes, and can reduce the amount of the resin mould 4 that gets into this space.Like this, can suppress stress from resin mould 4.
Therefore, in this first execution mode, can improve the intensity of the encapsulation answering pressure of SAW duplexer 1, prevent damage.
In addition, in this first execution mode, as aforementioned; Protective is arranged on the shadeless part of Fig. 8; That is, the lower surface of piece cover 9 except with all parts of outer electrode 5 engaging portion (disposed earth terminal 12, receive terminal 13, antenna terminal 14, the position of sending terminal 15), still; Also can be arranged at least except with the bonding part of outer electrode 5, the part of a part relative with hole 16, can obtain same effect and effect.
And, in this first execution mode, as shown in Figure 3; On parts substrate 6, form a plurality of IDT electrodes 7; As shown in Figure 5, each or per two IDT electrodes 7 form recess, have formed a plurality of recesses 8 by this way; Compare with the situation of a recess 8 that is provided with the mode that covers whole IDT electrodes 7, can effectively suppress the damage of SAW duplexer 1.
That is,, hole 16 is cut apart, between a plurality of holes 16, formed partition wall 19 as shown in Figure 2 through a plurality of recesses 8 are set.So this partition wall 19 becomes pillar, can disperse external stress.So, can suppress the perhaps cracking of piece cover 9 of parts substrate 6.In addition, this partition wall 19 also can be in hole 16 forms with any-mode with resin etc. in addition.
And these a plurality of holes 16 also can form fully independently, also can the part connection with tubulose access path (showing especially among the figure) between the hole 16 of adjacency.Through access path is set like this, when the part in hole 16 applied excessive external pressure, this external pressure can be dispersed to other hole 16 through access path.Therefore, can improve the intensity of the reply external pressure of electronic unit encapsulation.
This access path also can be arranged on the parts substrate 6, also can be located on the piece cover 9.And if access path is located on the parts substrate 6, the groove 11 of the lower surface of parts substrate 6 as shown in Figure 4 can be used as access path.
(second execution mode)
Below, use the description of drawings second embodiment of the invention.
The main difference point of this second execution mode and aforementioned first execution mode is; In order to form hole 16; Used the below that covers as the IDT electrode 7 of element (be exactly the below among Fig. 9, towards a side of installation base plate 3, below identical) element lid 20; Other similar structures uses same tag to explain, and omits its explanation.
The electronic unit of this second execution mode encapsulates such structure that has also as shown in Figure 1: other electronic unit 2a～2c and SAW duplexer 1 have been installed on installation base plate 3, and have been covered with resin mould 4.
And, constituting the SAW duplexer 1 that electronic unit encapsulates, its profile is as shown in Figure 9, comprising: parts substrate 6; Be configured in a plurality of IDT electrodes 7 below this parts substrate 6 as element; Cover the element lid 20 of IDT electrode 7 following sides; Covering comprises the piece cover 9 of following integral body of the parts substrate 6 of element lid 20; And be arranged on the protective 10 that the resins below this piece cover 9 make.Outer electrode 5 is identical with above-mentioned first execution mode, is meant: with the earth terminal 12 of SAW duplexer 1 as shown in Figure 8, receive terminal 13, antenna terminal 14, send the electrode that terminal 15 engaged and be located at installation base plate 3.
In addition, through between IDT electrode 7 and element lid 20, forming hole 16, in the oscillation space that guarantees sound wave, also this oscillation space is remained on the state of hermetic seal.And in this second execution mode, each or per two IDT electrodes 7 are provided with element lid 20.
Use LiTaO 3As the material of parts substrate 6, use the material of aluminium as the IDT electrode, use and contain the material of the epoxy resin of filler as piece cover 9.As this filler, its containing ratio is about 80wt% with silica.The cradle portion 20a of element lid 20 uses light-sensitive polyimide, and the cap 20b of element lid 20 uses polyester fiber and polyethylene to clip the photosensitive dry film of the three-decker of photosensitive layer.In addition, also can use LiNbO 3As the material of parts substrate 6, with the material of the metal except that aluminium as IDT electrode 7.
Below, the originally manufacturing approach of the SAW duplexer 1 of second execution mode is described.
At first, shown in figure 10, in the whole lower surface vapor deposition sputtered aluminum of parts substrate 6, afterwards, shown in Figure 11 A, form electrode pattern such as IDT electrode 7 grades with dry etch process.
Because this Figure 11 A～Figure 11 F and follow-up Figure 12 A～Figure 12 F are the figure of the manufacture process of expression SAW duplexer 1; So, its expression be the state that turns upside down of the SAW duplexer 1 shown in Fig. 1, Fig. 2 and other figure of the installment state of expression SAW duplexer 1.Just in Figure 11 A～Figure 11 F and explanation that Figure 12 A～Figure 12 F carries out, the above-below direction of its direction and explanation in addition is opposite.
Then, shown in Figure 11 B, on parts substrate 6 with method of spin coating coating light-sensitive polyimide layer 21, and place above it make can printing opacity corresponding to the part of the cradle portion 20a of element lid 20 mask 22, make public again, develop.Thus, shown in Figure 11 C, can form the cradle portion 20a of element lid 20.Afterwards, shown in Figure 11 D,, above parts substrate 6, place photosensitive dry film 23 through cradle portion 20a, and above this photosensitive dry film 23, place make can printing opacity corresponding to the part of the cap 20b of element lid 20 mask 24, make public again, develop.Like this, shown in Figure 11 E, form the element lid 20 that constitutes by cradle portion 20a and cap 20b.
Then; Shown in Figure 11 F, on parts substrate 6, be coated with photoresist (negativity) 25 with the mode of cladding element lid 20; Above this photoresist 25 so that corresponding to after state the form that the part of outside terminal connecting portion 26 (shown in Figure 12 B) do not make public and carry out mask with mask 28.Then, if make public, develop, shown in Figure 12 A, just hole 29 can be set in the part corresponding to outside terminal connecting portion 26 of photoresist 25.
Then, shown in Figure 12 B, with the part that Cu is filled into hole 29, form outside terminal connecting portion 26 with electroless plating.Afterwards, shown in Figure 12 C, dissolving photoresist 25 is put into mould with parts substrate 6.Then, shown in Figure 12 D, on parts substrate 6, flow into liquid-state epoxy resin (can become piece cover 9 later on), be heating and curing again with cladding element lid 20 and outside terminal connecting portion 26.
Then, shown in Figure 12 E, the epoxy resin that polishing forms this piece cover 9 exposes up to outside terminal connecting portion 26, thereby forms piece cover 9.Then; Shown in Figure 12 F; (earth terminal 12, reception terminal 13, antenna terminal 14, transmission terminal 15 still, have only shown earth terminal 12 and have received terminal 13 electrode that externally configuration engages with outer electrode 5 on the terminal connecting portion 26 in the drawings; Omitted antenna terminal 14 and sent terminal 15 demonstration in the drawings), accomplish SAW duplexer 1.
Then; As shown in Figure 9 (as above-mentioned; Fig. 9 compares and turns upside down with Figure 11 A～Figure 11 F and Figure 12 A～Figure 12 F); Surface except the position that disposes electrode below piece cover 9, that engage with outer electrode 5 (earth terminal 12, reception terminal 13, antenna terminal 14, transmission terminal 15) is provided with the protective 10 that resin makes.This protective 10 preferentially is set to relative with hole 16.And, this protective 10 be by, in epoxy resin or polyimide resin, add modified rubber pliability resin, through the formation of methods such as printing such as the rubber of silicon rubber etc.
At last, the packaging process that covers the SAW duplexer 1 that is installed in installation base plate 3 with resin mould 4 is described.
At first, the compound electronic unit that SAW duplexer 1 as shown in Figure 1 and other electronic unit 2a～2c have been installed is put into mould, then, the resin mould 4 after this mould injects heating, pressurization, cooling forms then.In this second execution mode, use the epoxy resin that has disperseed filler in the resin mould 4, the injection condition of resin mould 4 is that resin temperature is 175 ℃, injection pressure is 50～100atm.And, use silica in the filler of this resin mould 4, its composite rate is 80wt%～90wt%.
Utilize said structure, the electronic unit encapsulation has improved the intensity of the external pressure when reply is handled with resin mould 4, can prevent the damage of electronic unit.Its reason is described below.
As shown in Figure 9, when resin mould 4 is filled between piece cover 9 and the installation base plate 3, applied very large upwarding pressure on the piece cover 9.But, because the protective that resin makes 10 is littler, promptly softer with resin mould 4 resilience in comparison modulus, so, receive the pressure of resin mould 4 since then and be out of shape, thereby can this pressure be distributed to a plurality of directions.So, utilize protective 10, can cushion the stress that is applied to SAW duplexer 1 from the below of piece cover 9 and element lid 20.
And owing to be provided with protective 10, the space between SAW duplexer 1 and the installation base plate 3 diminishes, and can reduce the amount of the resin mould 4 that gets into this space.Thus, can suppress stress from resin mould 4.
In addition; In this second execution mode, as aforementioned, in the shadeless part of Fig. 8; Promptly; Except all parts with outside outer electrode 5 engaging portion (that is, disposed earth terminal 12, receive terminal 13, antenna terminal 14, the position of sending terminal 15) below the piece cover 9 are provided with protective 10, still; At least except with outer electrode 5 engaging portion, the part of a part relative with hole 16 is provided with protective 10, so also can obtain same effect and effect.
And, because piece cover 9 is to be obtained by the epoxy resin that contains filler, can suppress the damage of electronic unit, improve the reliability of reply external pressure.
Therefore, when electronic unit applied external pressure, piece cover 9 was utilized its resin part that strain to a certain degree can be arranged on the one hand, thereby external pressure is distributed to a plurality of directions.On the other hand, utilize the filler part to cover 9 profile by holding member, suppress excessive strain.Therefore, the intensity of the reply external pressure of electronic unit encapsulation can increase, and reduces the damage of IDT electrode 7.
And, containing filler through making in the piece cover 9, can demonstrate than only forming also big hydrophobe under the situation of piece cover 9 with resin, corrode because of moisture thereby can suppress IDT electrode 7.
Yet, in this second execution mode, forming a plurality of IDT electrodes 7 on the parts substrate 6, each or per two IDT electrodes 7 form element lid 20.Form a plurality of element lids 20 like this, compare, can effectively suppress the damage of SAW duplexer 1 with the situation that an element lid 20 that covers whole IDT electrodes 7 is set.
That is, through a plurality of element lids 20 are set, hole 16 is cut apart, and between a plurality of holes 16, forms partition wall 19 as shown in Figure 9.So this partition wall 19 becomes pillar, can disperse external stress.The cracking that therefore, can suppress parts substrate 6 or piece cover 9 and element lid 20.In addition, this partition wall 19 can be in hole 16 forms with any-mode with resin etc. in addition.
And these a plurality of holes 16 also can form fully independently, also can the part connection with tubulose access path (showing especially among the figure) between the hole 16 of adjacency.Through access path is set like this, when the part in hole 16 applied excessive external pressure, this external pressure can be dispersed to other hole 16 through access path.Therefore, can improve the intensity of the reply external pressure of electronic unit encapsulation.
And in this second execution mode, in order to realize thinner electronic unit, piece cover 9 is thinner than parts substrate 6.Therefore, piece cover 9 ruptures especially easily, is accompanied by the damage of this piece cover 9, and element lid 20 is damage easily also.So, because must improve the intensity of this piece cover 9, so need said structure.
(the 3rd execution mode)
Use the description of drawings third embodiment of the invention below.
The main difference point of this 3rd execution mode and aforementioned first execution mode is: shown in figure 13; In order to form hole 16; Periphery as the IDT electrode 7 of element is provided with junction surface 30; Attachment substrate 6 and piece cover 9 through this junction surface 30, the part that this junction surface 30 surrounds is as hole 16.Other similar structure uses identical mark to describe, and omits its explanation.
The electronic unit encapsulation of this 3rd execution mode also has such structure: as shown in Figure 1, other electronic unit 2a～2c and SAW duplexer 1 have been installed on installation base plate 3, and covered by resin mould 4.
So, constituting the SAW duplexer 1 that electronic unit encapsulates, its section is shown in figure 13, comprising: parts substrate 6; Be configured in these parts substrate 6 lower surfaces a plurality of IDT electrodes 7 of (referring to the below shown in Figure 13, Figure 15 A～Figure 15 F, Figure 16 A～Figure 16 G, identical in the explanation of the 3rd execution mode) as element; And the piece cover 9 of coating member substrate 6 following sides, the lower surface of this piece cover 9 is provided with the protective 10 that resin makes.Outer electrode 5 is meant, and is identical with Fig. 8 of aforementioned first execution mode, with the earth terminal 12 of SAW duplexer 1 shown in Figure 17, receive terminal 13, antenna terminal 14, send terminal 15 and engage, and is arranged on the electrode of installation base plate 3.
And, be provided with junction surface 30 between this piece cover 9 and the IDT electrode 7, form hole 16 at piece cover 9 thickness owing to junction surface 30 in parts substrate 6 engages.The lower surface of piece cover 9 is provided with, the modulus of elasticity also littler than resin mould 4, i.e. softer protective 10.Junction surface 30 is, the first junction surface 30a (shown in Figure 15 D～Figure 15 F) that is located at parts substrate 6 sides engages with the second junction surface 30b that is located at piece cover 9 sides (shown in Figure 16 C～Figure 16 F) and obtains.
Below, with Figure 15 A～Figure 15 F and Figure 16 A～Figure 166 the manufacturing approach that the electronic unit of this 3rd execution mode encapsulates is described.Figure 15 A～Figure 15 F and Figure 16 A～Figure 16 G are the figure of the manufacture process of expression SAW duplexer 1, and be opposite with Figure 12 A～Figure 12 F with earlier figures 11A～Figure 11 F, representes the identical above-below direction of Fig. 1, Fig. 2 with the installment state of representing SAW duplexer 1.
At first, shown in Figure 15 A, the whole lower surface vapor deposition sputtered aluminum of parts substrate 6 afterwards, is used dry etch process, forms the electrode pattern of IDT electrode 7 grades shown in Figure 14.
Then, shown in Figure 15 B, the whole lower surface coating resistance agent 31 of parts substrate 6.And, shown in Figure 15 C, form pattern, the feasible electrode part that is connected with reception terminal 13, antenna terminal 14, transmission terminal 15, the earth terminal 12 of Figure 17, and the outer regions of the parts substrate 6 of all IDT electrodes 7 of encirclement is exposed among Figure 14.Like this, in subsequent processing, can prevent that aluminium from being arrived between the IDT electrode 7 by vapor deposition, can guarantee the oscillation space of this IDT electrode 7 fully.
Then, shown in Figure 15 D, AM aluminum metallization is provided with the first junction surface 30a in aforementioned exposed portions serve to the whole surface of the resistance agent 31 of patterning., as Figure 15 E shown in from below polish thereafter, concordant with the height of the first junction surface 30a.At this moment, bigger concavo-convex because the surface behind the vapor deposition has, so preferably, the also polishing a little of lower surface to the first junction surface 30a makes smooth surface.This be for improve with after state the zygosity of piece cover 9.
Next, parts substrate 6 is impregnated in the stripper etc. of resistance agent 31, makes resistance agent 31 dissolvings, shown in Figure 15 F, can form, the first junction surface 30a is higher slightly than IDT electrode 7.
On the other hand, shown in figure 13, corrode the piece cover 9 that the side setting is made by silicon below parts substrate 6 in order to prevent IDT electrode 7 because of oxidation or moisture.Below, with the manufacturing approach of Figure 16 A～this piece cover 9 of Figure 16 G explanation.
At first, shown in Figure 16 A, the entire upper surface of piece cover 9 coating resistance agent 31 forms such pattern: shown in Figure 16 B, resistance agent 31 remain in except with position the first junction surface 30a engaging portion.Thereafter, shown in Figure 16 C, on the whole surface of piece cover 9, vapor deposition is the aluminium of the second junction surface 30b.
Then, shown in Figure 16 D, the surface of piece cover 9 is polished, concordant with the height of the second junction surface 30b.At this moment, identical with the first junction surface 30a, preferably, the also polishing a little of upper surface to the second junction surface 30b makes smooth surface.Afterwards, piece cover 9 is impregnated in the stripper etc. of resistance agent 31, makes resistance agent 31 dissolvings, thereby accomplish the such piece cover 9 of Figure 16 E.
Then, the method that this piece cover 9 engages with parts substrate 6 is described below.
At first, shown in Figure 16 F, position, the feasible first junction surface 30a that is located at the lower surface of parts substrate 6 engages with the second junction surface 30b of the upper surface that is located at piece cover 9.Then, it is clean that Cement Composite Treated by Plasma is carried out on this first junction surface 30a and the second junction surface 30b composition surface separately.Afterwards, in 200 ℃ of heating, pressurization lightly shown in Figure 16 G, makes formation junction surface 30 takes place between win junction surface 30a and the second junction surface 30b to combine between direct atom.
Next; Shown in figure 18; For electrode (earth terminal 12 of Figure 17 and Figure 18, reception terminal 13, antenna terminal 14, the transmission terminal 15 that makes the lower surface that is located at piece cover 9; But, only shown earth terminal 12 and antenna terminal 14 among Figure 18) be connected with each electrode that is located at parts substrate 6, form through hole 17 with dry etch process.In addition, Figure 18 is the figure of B-B section among expression Figure 17.Thereafter, vapor deposition Ti, Ni, Au successively in the inboard of this through hole 17 are filled into solder printing the inside of this vapor-deposited film again, form outside terminal connecting portion 32.
Then, shown in figure 13, at the lower surface of piece cover 9, on all surfaces except the position that disposes the electrode that engages with outer electrode 5, the protective 10 that resin makes is set.This protective 10 be by, in epoxy resin or polyimide resin, add modified rubber pliability resin, through the formation of methods such as printing such as the rubber of silicon rubber etc.Thereafter, shown in figure 17, on the lower surface of piece cover 9; On the hypographous position, the electrode that configuration engages with outer electrode 5, promptly; The earth terminal 12 of Fig. 7 and Figure 18, reception terminal 13, antenna terminal 14, transmission terminal 15, thus SAW duplexer 1 accomplished.
Explanation is as shown in Figure 1 at last, covers the packaging process of the SAW duplexer 1 that is installed in installation base plate 3 with resin mould 4.
At first, the compound electronic unit that SAW duplexer 1 and other electronic unit 2a～2c have been installed is put into mould, then, inject heated mold resin 4, cooling forming then to this mould.In this 3rd execution mode, use the epoxy resin that has disperseed filler in the resin mould 4, the injection condition of resin mould 4 is that resin temperature is 175 ℃, injection pressure is 50～100atm.And, use silica in the filler of this resin mould 4, its composite rate is 80wt%～90wt%.
Utilize aforementioned structure, the intensity of the reply external pressure when the electronic unit encapsulation has improved with resin mould 4 processing can prevent the damage of electronic unit.Its reason is described below.
Shown in Figure 13, when resin mould 4 is filled between piece cover 9 and the installation base plate 3, applied very large upwarding pressure on the piece cover 9.But, because the protective that resin makes 10 is littler, promptly softer with resin mould 4 resilience in comparison modulus, so, receive the pressure of resin mould 4 since then and be out of shape, thereby can this pressure be distributed to horizontal direction.So, utilize protective 10, can cushion the stress that is applied to SAW duplexer 1 from piece cover 9 belows.
And owing to be provided with protective 10, the space between SAW duplexer 1 and the installation base plate 3 diminishes, and can reduce the amount of the resin mould 4 that gets into this space.Thus, can suppress stress from resin mould 4.
Part the position of the reception terminal 13 that in the lower surface of piece cover 9, engages with outer electrode 5 except configuration, antenna terminal 14, transmission terminal 15, earth terminal 12 all is provided with protective; But; At least except with outer electrode 5 engaging portion, the part of a part relative with hole 16 is provided with protective 10, so also can obtain same effect and effect.
And, in this 3rd execution mode, between a plurality of IDT electrodes 7 junction surface 30 being arranged, the partition wall in segmentation hole 16 is played at this junction surface 30.So when the upper and lower of SAW duplexer 1 applied the external pressure from resin mould 4 grades, this partition wall became pillar, can disperse this stress, therefore can improve the intensity of reply external pressure of the encapsulation of SAW duplexer 1.
And in this 3rd execution mode, in order to realize thinner electronic unit, piece cover 9 is thinner than parts substrate 6.Therefore, piece cover 9 ruptures especially easily, must improve the intensity of this piece cover 9.Therefore, so need said structure and parts.
Industrial applicibility
Because the intensity of the reply external pressure of electronic unit of the present invention encapsulation can raising electronic unit encapsulation can prevent the damage of electronic unit, so, utilization greatly in the transfer modling treatment process that can be under condition of high voltage etc.So the possibility that the present invention is able to utilize in industry is very big.

Claims (5)

1. electronic components packaging structure, it comprises:
Installation base plate;
Be configured in the outer electrode on the said installation base plate;
Electronic unit, it is installed on the said installation base plate through said outer electrode; And
On said installation base plate, cover the resin mould of said electronic unit,
Said electronic unit comprises:
The parts substrate;
Element, it is configured in the surface towards said installation base plate of said parts substrate; And,
Piece cover, it covers the face side towards said installation base plate of said parts substrate,
Said piece cover is having the hole with said element part in opposite directions,
With the little protective of said resin mould resilience in comparison modulus, be arranged on, said piece cover on the surface of said installation base plate except with said outer electrode engaging portion, with said hole part in opposite directions.
2. electronic components packaging structure according to claim 1, wherein,
Said protective is formed by resin or rubber.
3. electronic components packaging structure according to claim 1, wherein,
Said piece cover with said element part in opposite directions, be provided with recess, said hole utilizes said recess to form.
4. electronic components packaging structure according to claim 1, wherein,
Also comprise the element lid, said hole covers said element with said element lid and forms.
5. electronic components packaging structure according to claim 1, wherein,
The periphery of said element is provided with the junction surface, through said junction surface said parts substrate is engaged with said piece cover, and said hole is formed on the part of being surrounded by said junction surface.
CN2006800016323A 2005-11-02 2006-10-30 Electronic component package Active CN101091313B (en)

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JP5176603B2 (en) * 2008-03-04 2013-04-03 パナソニック株式会社 Surface acoustic wave device and manufacturing method thereof
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