JP2002324864A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an elastic surface wave device having good sealing structure. SOLUTION: Interdigital electrodes 11a, 12a and an elastic surface wave element 300 forming a plurality of electrode terminals 11b, 12b connected on the interdigital electrodes on a piezoelectric substrate 10 are prepared. Element connection terminals 411, 421 are arranged at each position of prescribed faces Sf1 opposed to the plurality of the electrode terminals on a circuit board 400 opposed and attached to the comb teeth-like electrodes of the element 300. The electrode terminals 11b, 12b and the element connection terminals 411, 421 opposed thereto are connected and fixed through metal bumps 21, 31. The elastic surface wave element 300 is covered with a cap 600. The cap 600 is fixed with an adhesive 500 on a part S400 having no element connection terminals 411, 421 and the other wiring pattern on the prescribed face Sf1 of the periphery of the circuit board 400.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a surface acoustic wave device having a comb-like electrode formed on a piezoelectric substrate. In addition, the present invention relates to an electronic component device including a functional element sealed with a cap, a resin, or the like. further,
The present invention relates to an improvement in a sealing structure in an electronic component device having a connection structure between an electric element connection terminal and an upper base terminal.

[0002]

2. Description of the Related Art A surface acoustic wave device (surface acoustic wave device) used as a component such as a resonator, a resonator type filter and an oscillator.
stic wave device: also called SAW filter)
An interdigital transducer (IDT) is formed by combining comb-like electrodes on a piezoelectric substrate.

[0003] This surface acoustic wave device is used, for example, mainly as an intermediate frequency filter in electronic equipment. Examples of the electronic device include a television receiver, a communication device, and a mobile phone (such as a CDMA system). The surface acoustic wave device has a feature of being small and lightweight, and can be used in a mobile phone to take advantage of the feature. Further, in a surface acoustic wave device, a piezoelectric substrate using a material such as quartz that has little fluctuation in vibration characteristics due to a temperature change is used in order to satisfy a requirement of a frequency characteristic having a narrow band and a steep cutoff.

[0004] When this type of surface acoustic wave device is mounted on a circuit board, a device configured as an insertion type such as a single in-line package (SIP) using a lead frame is mainly used. However, in recent years, introduction of a double-sided circuit board has been studied in accordance with miniaturization and cost reduction of equipment using the surface acoustic wave device. For this reason, the surface acoustic wave device itself is desired to be a surface mount type.

In order to make the surface acoustic wave device thinner, for example, a surface acoustic wave element is face-down bonded to a flat substrate and then a cap is placed over the flat substrate to make the entire surface acoustic wave device thinner. Becomes Alternatively, by employing a structure in which the surface acoustic wave element is face-down bonded to a flat substrate and then sealed with a resin, the entire surface acoustic wave device can be further reduced in thickness.

[0006]

However, at a certain position of the wiring on the circuit board, a step is formed on the substrate surface by the thickness of the wiring. When the cap is put on, if an adhesive is applied to such a stepped portion and the edge of the cap is pressed and fixed there, there is a problem that the sealing property between the cap and the circuit board becomes insufficient and defects are likely to occur. Alternatively, when encapsulating and sealing with a sealing resin, there is a problem that the bonding strength between the sealing resin (polymer material) and the substrate cannot be sufficiently obtained at a position where the wiring is provided as described above.

If the sealing property is insufficient, the aluminum pattern on the device chip may be corroded in an environment such as high temperature and high humidity.
There is a problem that the filter characteristics and the like are deteriorated. Further, there is a problem that durability is deteriorated.

Further, if the bonding strength between the sealing resin and the substrate is insufficient, for example, when individual device chips are diced into individual pieces by dicing from a wafer which is manufactured in parallel with a large number of device chips. Peeling (gap) may occur at the joint between the sealing resin and the substrate. Alternatively, when some strong mechanical shock is given to the surface acoustic wave device after manufacturing, the bonding portion between the sealing resin and the substrate is peeled off (gap).
May occur. In that case, the above-mentioned problem of insufficient sealing occurs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide an electronic component device or a surface acoustic wave device having a structure having a good sealing property (or a high joining reliability of a cap or a sealing resin). It is to provide.

[0010]

A surface acoustic wave device according to an embodiment of the present invention comprises a comb-like electrode (11a, 12a).
And a plurality of electrode terminals (1
1b, 12b, etc.) on a piezoelectric substrate (10); and the surface acoustic wave element (30).
0) is a substrate (400) attached to face the comb-toothed electrodes (11a, 12a), and is located at each position on a predetermined surface (Sf1) facing the plurality of electrode terminals (11b, 12b). A circuit board (400) on which element connection terminals (411, 421) and other wiring patterns are provided;
Conductive bumps (21, 31) for bonding and fixing the plurality of electrode terminals (11b, 12b) and the element connection terminals (411, 421) opposed thereto; and the circuit board (40).
0) on the predetermined surface (Sf1) around the adhesive (50).
And a sealing member (cap 600) attached to the circuit board (400) so as to cover the surface acoustic wave element (300). Here, the arrangement positions of the element connection terminals (411, 421) and other wiring patterns are such that the sealing member (cap 600) is provided on the predetermined surface (Sf1) around the circuit board (400). Adhesive (500)
It is configured to be located inside the portion (S400) fixed by.

An electronic component device according to an embodiment of the present invention provides a device chip (300) having a predetermined functional element (8) and an electrode pad (12) electrically connected to the functional element (8). The device chip (300) disposed opposite to the functional element (8), and connected to each position on a predetermined surface (Sf1) opposite to the functional element (8). A substrate (400) provided with terminals (14);
A) a conductive bump (36) for electrically and mechanically connecting the electrode pad (12) formed in (0) and the element connection terminal (14) opposed to the electrode pad (12);
A sealing resin (7) covering the entire surface acoustic wave element (300) from the predetermined surface (Sf1) side of the substrate (400).
00). Here, the circuit board (40
On the predetermined surface (Sf1) around (0), a part of the sealing resin (700) is bonded to an exposed portion (S400) of the substrate (400).

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component device according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a transversal type surface acoustic wave device 300 according to an embodiment of the present invention.
The piezoelectric substrate 10 constituting the element 300 is made of a piezoelectric material such as lithium niobate (LiNbO ₂ ) and lithium tantalate (LiTaO ₂ ). On the piezoelectric substrate 10, an input transducer 101, a shield electrode 102, and an output transducer 103
Has been built.

Here, the input transducer 101 is configured as follows. The first comb-shaped electrode includes a first common electrode 11a and a plurality of electrode fingers 1a, 1b, 1c,... Extended in a direction perpendicular to the first common electrode 11a.
Having. The second comb-shaped electrode 12 is a second common electrode 1.
2a, and a plurality of electrode fingers 2a, 2b, 2c,... Extended in a direction perpendicular to the second common electrode 12a.

The shield electrode 102 has a function of electromagnetically blocking (shielding) the transducer 101 on the input side and the transducer 103 on the output side, and is formed of a conductive material pattern having a constant width.

The output transducer 103 is configured as follows. The first comb-shaped electrode has a first common electrode 13a and a plurality of electrode fingers 3a, 3b,... Extended in a direction perpendicular to the first common electrode 13a. The second comb-shaped electrode is composed of the second common electrode 14a and the second common electrode 14a.
Have a plurality of electrode fingers 4a, 4b,... Extended in a direction perpendicular to the common electrode 14a. The above electrodes (11a-1)
4a, 1a ..., 2a ..., 3a ..., 4a ...,), for example, aluminum (Al) or an aluminum alloy is used.

Further, the input transducer 101
On the first and second common electrodes 11a and 12a, electrode terminals 11b, 11c, 11d, 12b, 12c and 12d for connection to an external circuit or a ground pattern (not shown) are formed to protrude outward and are continuously formed. Have been. The first and second common electrodes 13 of the output transducer 103
The electrode terminals 13b,..., 14b,... for connection to an external circuit or an earth pattern (not shown) are also formed continuously at the terminals a and 14a.

Here, the electrode terminals 11b, 11c, 11
d, one end of the shield electrode 102 and the electrode terminal 1
Looking at the row 3b (the longitudinal direction in the drawing of the piezoelectric substrate 10),
These elements are arranged at equal intervals, for example. Similarly, the electrode terminals 12b, 12c, 12d, the shield electrode 1
When looking at the other end of 02 and the row of the electrode terminals 14b, these elements are also arranged at equal intervals, for example.

Further, a sound absorbing material 1 is provided on one end of the piezoelectric substrate 10 on the left end side of the input transducer 101 in the figure.
11 are provided. Output transducer 1
03 on the other end of the piezoelectric substrate 10 on the right end side in the drawing.
A sound absorbing material 112 is provided.

Here, in the surface acoustic wave device 300 according to the embodiment of FIG. 1, the electrode terminals 11b, 11c, 11
d, one end of the shield electrode 102 and the electrode terminal 13
b, metal bumps 21 to 25 are attached, and the electrode terminals 12b, 12c, 12d, the other end of the shield electrode 102 and the electrode terminal 14b are mounted on the metal bumps 31 to 35.
Is attached.

The above-mentioned metal bumps 21 to 25 and 31 to 31
Reference numeral 35 denotes a face-down flip-chip connection to the circuit board 10. Gold or an alloy containing gold as a main component can be used for these metal bumps (conductive bumps).

FIGS. 2A to 2H show, for example, FIG.
The surface acoustic wave element 300 having the structure shown in FIG.
The process of assembling at 00 is shown in principle. In FIG. 2, the illustration of the surface acoustic wave element 300 is simplified and the input transducer 101
Are mainly shown.

First, electrode terminals 11b, 11c, 11d and electrode terminals 12b, 12c, 12d are formed on the piezoelectric substrate 10 of the surface acoustic wave element 300 (FIG. 2A).
(B)). The sound absorbing members 111 and 112 are provided on the piezoelectric substrate 10 by screen printing or the like.
(C)). Next, metal bumps 21 to 23 and 31 to 33 are provided by screen printing or bonding (FIG. 2D).

FIG. 2E shows the piezoelectric substrate 10 of the surface acoustic wave device 300 provided with the metal bumps 21 to 23 and 31 to 33 when viewed from the side in the longitudinal direction. The piezoelectric substrate 10 has a flat circuit board 400 on the functional element (IDT) 8 side for flip-chip connection.
It is positioned at a predetermined position toward the side (face down) (FIG. 2 (f)).

On the upper surface Sf1 of the circuit board 400, element connection terminals 411, 421 and the like are pattern-formed at positions corresponding to the metal bumps 21 to 23, 31 to 33, respectively. The element connection terminals 411 and 421 are connected to the circuit board 4
Through holes (or via holes) 181 and 18 are formed in predetermined circuit patterns (or external connection terminals) 431 and 441 formed on the back side (lower surface Sf2 side) of the second pin.
2 and the like (FIG. 2 (f)).

After the piezoelectric substrate 10 is mounted face down on the circuit board 400 and positioned at a predetermined position, that is, the metal bumps 21 to 23 and 31 to 33 contact the corresponding element connection terminals 411 and 421, respectively. In this state, ultrasonic waves are applied at a predetermined temperature and under a predetermined pressure for a predetermined time (flip chip bonding). This allows
The functional element (IDT) 8 on the piezoelectric substrate 10 is
The piezoelectric substrate 10 of the surface acoustic wave element 300 is electrically connected to a signal input circuit, a matching circuit, a signal output circuit, a ground circuit, and the like (not shown) on the 00 side. Will be joined.

In the bonding process of the "piezoelectric substrate 10 of the surface acoustic wave element 300 and the circuit board 400", metal bonding technology such as thermocompression bonding other than ultrasonic thermocompression (flip chip bonding) is employed. Can also.

FIG. 2G shows the circuit board 400
This figure shows a state where the piezoelectric substrate 10 of the surface acoustic wave element 300 is connected (electrically and mechanically) via metal bumps. A gap (hollow portion 7) is provided between the functional element (IDT) 8 on the piezoelectric substrate 10 and the circuit board 400.
This is because the surface acoustic wave element 300 propagates a surface acoustic wave (mechanical vibration) from the input transducer 101 to the output transducer 103 to realize its function. This is because if a structure (the surface of the circuit board 400 or the like) is in contact, its function is impaired.

Finally, as shown in FIGS. 2 (g) and 2 (h),
The upper surface of the circuit board 400, wherein the surface acoustic wave element 300
A sealing adhesive 500 is provided at a position S400 corresponding to the periphery of the
Is mounted (pressed and fixed). By completely curing the adhesive 500 and mechanically fixing the cap 600 to the circuit board 400 without any gap, the functional element (IDT) 8 of the surface acoustic wave element 300 is cut off (shielded or sealed) from the external environment. ) Is done.

Although the circuit board 400 is exemplified by a single-layer resin circuit board, a ceramic single-layer board or a laminated board made of resin or ceramic may have the same effect (the function element 8 may be shielded from the external environment, Sealing) is obtained. Furthermore, although the sound absorbing materials 111 and 112 are used in the embodiment of FIGS. 1 and 2, an embodiment in which such a sound absorbing material is not particularly provided is also possible.

FIG. 3 is a view exemplifying a feature of an electronic component device (surface acoustic wave device) according to another embodiment of the present invention.

FIG. 3A is a view of the circuit board 400 as viewed from above, and a range of a region 310 surrounded by a dotted line is a range in which the surface acoustic wave element 300 is flip-chip connected.
On the circuit board 400, element connection terminals 411 to 415 and 421 to 425 are formed by pattern printing. These element connection terminals 411 to 415 and 421
425 are designed so as not to go outside the region 310. Element connection terminals 411 to 415 and 421 to 425
Correspond to corresponding patterns 431 to 431 formed on the back surface of the circuit board 400 via through holes (or via holes) 18 individually provided in the circuit board 400.
435 and 441 to 445.

FIG. 3B is a cross-sectional view illustrating a state where the surface acoustic wave element 300 is mounted on the circuit board 400. As illustrated in FIG. 3A, an adhesive 500 is screen-printed, for example, on a portion of the cap 600 to which the opening edge is bonded so as to surround the area 310. Then, as shown in FIG.
00 is attached so as to cover the surface acoustic wave element 300, and seals the surface acoustic wave element 300 from an external environment. FIG. 3C illustrates a state where the circuit board 400 is viewed from the back surface. FIG. 3D shows a cross section viewed from the longitudinal direction.

In each of the above embodiments, the circuit board 400
The conductor pattern (wiring pattern) and the electrode terminals formed on one surface Sf1 of the above are all configured to be located inside the joint (the portion where the adhesive 500 is provided) between the cap 600 and the circuit board 400. .

As a result, when the cap 600 is attached, the surface of the circuit board 400 has no irregularities due to the wiring pattern and / or the electrode terminals.
And the adhesion between them is improved. As a result, the sealing effect is improved, and the corrosion of the aluminum pattern or the like constituting the functional element (IDT) 8 inside the device under a bad environment such as high temperature and high humidity is reduced.

In addition, since the adhesiveness between the cap 600 and the substrate 400 is good, not only the sealing performance is improved, but also the mechanical adhesive strength of the cap is increased. Even when a shock is applied, the possibility that a gap (peeling) occurs in the bonded portion is eliminated. Therefore, there is no possibility that foreign matter adheres to the functional element (IDT) 8 inside the device for some reason after manufacturing, and the resonance characteristics and the filter characteristics of the surface acoustic wave element are deteriorated (or the characteristics change beyond the allowable range). Problem), and the durability is improved.

As the above-mentioned circuit board 400, a single-layer glass base material with a laminated or through-hole filled with resin is used.
An epoxy resin-based printed wiring board, or a single-layer BT (bismale tria) resin printed wiring board in which a laminated or through hole is filled with a resin can be used.
Further, a laminated ceramics substrate may be used as the circuit board 400. As the cap 600, a resin molded product can be used.

The size of the surface acoustic wave element 300 is, for example, about 1.5 mm to 2.1 mm on a long side, about 8 mm to 12 mm on a long side, and about 0.5 mm in thickness.
On the other hand, for example, the circuit board 400 has a longitudinal direction of 12 mm to 20 mm, a short side of 3 mm to 7 mm, and a thickness of about 0.1 mm to 0.4 mm.
The cap 600 has a thickness of 0.1 mm to 1 mm. However, with the downsizing of devices (such as mobile phones) using surface acoustic wave devices, the dimensions exemplified above tend to become smaller in the future.

In the embodiments shown in FIGS. 1 and 2, the cap 600 and the adhesive 500 are used as means for sealing the surface acoustic wave element 300. However, the present invention is not limited to this. Techniques such as potting and coating with materials can be used for the element sealing means.

Although a surface acoustic wave device has been described as an example of an electronic component device having an element 300 sealed by a cap 600 or the like, the present invention relates to a base substrate (40).
The present invention can be similarly applied to other electronic component devices using (0).

FIG. 4 is a view for explaining the configuration of an electronic component device (surface acoustic wave device) according to still another embodiment of the present invention. Here, unlike the embodiment of FIGS. 1 to 3, the sealing resin (polymer material) 700 is replaced with a surface acoustic wave element (device chip) 300 instead of the cap 600.
Used for packaging.

In this embodiment, as illustrated in FIG. 4A, a patterned copper foil 14 is provided at a predetermined position on an upper surface Sf1 of a substrate (base) 400 made of resin or ceramics. Then, for example, gold plating 15 is applied thereon. Gold-plated copper foil pattern 1
Reference numeral 4 is formed near the center of the upper surface Sf1 of the substrate, and the outer peripheral side of the upper surface Sf1 of the substrate is exposed from the background of the material of the substrate 400 (such as ceramics). The exposed portion of the background (the portion where there is no metal portion to which the resin or the adhesive hardly adheres) serves as an adhesive surface S400 of the sealing resin 700 described later.

A section taken along line A1-A2 in FIG. 4A is, for example, as shown in FIG. 4B. That is, the copper foil pattern 14 formed on the left side of the upper surface Sf1 of the substrate is electrically connected to the external connection terminal 16 formed on the left side of the lower surface Sf2 of the substrate via the via hole 18. Similarly, the copper foil pattern 14 formed on the right side of the substrate upper surface Sf1 in the figure is
External connection terminal 1 formed on the right side in the figure of substrate lower surface Sf2
6 are electrically connected.

On the substrate upper surface Sf1, for example, FIG.
Device chip 300 having metal bumps 36 mounted on electrode pads 12 in the manner described with reference to FIG.
Are positioned (face-down mount) (FIG. 4)
(C)). Then, the device chip 300 is electrically and mechanically bonded to the gold-plated copper foil pattern 14 of the substrate 400 via the metal bumps 36 by the flip chip bonding method. As a result, the mounting surface of the functional element (IDT) 8 of the device chip 300 and the substrate 400
The hollow portion 7 is secured between the upper surface Sf1.

A dam 20 made of resin or the like is attached to the outer periphery of the device chip 300 mounted face-down as necessary. This dam 20 has a substrate 40
Device chip 30 face-down mounted to 0
It is provided in order to prevent the resin before curing having fluidity from entering the hollow portion 7 when the resin is sealed with the resin. (If there is no risk that the sealing resin before curing enters the hollow portion 7 and adheres to the functional element 8, the dam 20 can be omitted.) Face-down mounted on the substrate 400 (flip-chip bonded) Device chip 300
Means a given viscosity and / or thixotropy
And sealed.
At this time, as illustrated in FIG.
Numeral 0 is in close contact with an exposed portion (adhesion surface) S400 having a predetermined width on the outer peripheral side of the upper surface Sf1 of the substrate to be cured.

The adhesive surface S400 where the sealing resin 700 adheres and hardens does not have a step element such as the gold-plated copper foil pattern 14, and the adhesive surface S400 exposes the surface of the substrate 400 which has a good affinity for the sealing resin 700. Part. Therefore, the adhesive strength between the sealing resin 700 and the substrate 400 is high. In addition, since there is no gap between the sealing resin 700 and the substrate 400, high sealing performance can be obtained.

Further, in the configuration of FIG. 4C, since the sealing resin 700 itself has a sealing function and an adhesive function, the cap 600 and the adhesive 500 used in the embodiment of FIGS. Becomes unnecessary.

The present invention is not limited to the above embodiments, and various modifications and changes can be made at the stage of implementation without departing from the scope of the invention. Also,
The embodiments may be implemented in combination as appropriate as much as possible. In such a case, the effect of the combination is obtained.

For example, in the configuration shown in FIG. 4C, the element connection terminals 14 and the external connection terminals 16 are connected via via holes (or through holes) 18, but the terminal 1
The method of electrically connecting the terminal 4 and the terminal 16 is not limited to this. Instead of using via holes (or through holes) 18, utilizing capacitive coupling and / or magnetic coupling,
The terminal 14 and the terminal 16 may be configured to be connected in an AC manner. When capacitive coupling is used, a parallel plate capacitor may be formed by using the substrate 400 as a dielectric and the terminals 14 and 16. When magnetic coupling is used, a spiral pattern (coil pattern) is provided on the terminals 14 and 16.
May be formed by etching so that these spiral patterns are closely arranged coaxially.

Furthermore, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of constituent elements disclosed in this application. For example, even if one or a plurality of constituent elements are deleted from all the constituent elements described in the embodiment, if at least one of the effects of the present invention or the effects of implementing the present invention is obtained, the constituent elements may be deleted. The deleted configuration can be extracted as an invention.

[0051]

According to the present invention, it is possible to obtain an electronic component device or a surface acoustic wave device having a structure having a good sealing property.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration of a surface acoustic wave device according to an embodiment of the present invention.

FIG. 2 is a view for explaining an example of a manufacturing process of the electronic component device (surface acoustic wave device) according to one embodiment of the present invention.

FIG. 3 is a plan view of a circuit board to which a cap is attached, a side view thereof, and a back surface of the circuit board, for explaining main parts of an electronic component device (surface acoustic wave device) according to another embodiment of the present invention. FIG.

FIG. 4 is a diagram illustrating a configuration of an electronic component device (surface acoustic wave device) according to still another embodiment of the present invention.

[Explanation of symbols]

10 piezoelectric substrate; 101 input transducer; 1
02: shield electrode; 103: output transducer;
Reference numerals 111 to 112: sound absorbing material, 21 to 25, 31 to 36: metal bumps (conductive bumps); 300, surface acoustic wave elements (device chips); 400, flat circuit boards (base); 500 adhesive, 600 cap (sealing member), 700 sealing resin (sealing member), 7 hollow portion (space portion), 8 functional element (comb-shaped electrode / interdigital) Converter IDT); 12
... electrode pads; 14 ... copper foil patterns (element connection terminals);
16: external connection terminal; 18: via hole (through hole); 20: dam.

Claims (6)

[Claims] A surface acoustic wave element having a comb-shaped electrode and a plurality of electrode terminals connected to the comb-shaped electrode formed on a piezoelectric substrate; facing the comb-shaped electrode of the surface acoustic wave element; A circuit board on which element connection terminals and other wiring patterns are provided at respective positions on a predetermined surface facing the plurality of electrode terminals; and Conductive bumps for joining and fixing the element connection terminals to be fixed to the circuit board so as to cover the surface of the circuit board so as to cover the surface acoustic wave element. A sealing member to be attached, wherein an arrangement position of the element connection terminals and other wiring patterns is higher than a portion where the sealing member is fixed by the adhesive on the predetermined surface around the circuit board. Inside A surface acoustic wave device characterized by being configured to be located on the side. 2. The apparatus according to claim 1, wherein the circuit board is made of a single-layer glass substrate / epoxy resin-based printed wiring board in which a resin is filled in through layers or through holes. 3. The apparatus according to claim 1, wherein the circuit board is formed of a single-layered glass substrate / bismale / tria-resin printed wiring board in which the through holes are filled with a resin. 4. The device according to claim 1, wherein the circuit board is formed of a multilayer ceramic substrate. 5. The apparatus according to claim 1, wherein the cap is made of a resin molded product. 6. A device chip having a predetermined functional element and an electrode pad electrically connected to the functional element;
A substrate which is arranged to face the functional element of the device chip, and on which a device connection terminal is arranged at each position on a predetermined surface facing the functional element; and the electrode formed on the device chip A conductive bump for electrically and mechanically connecting the pad and the element connection terminal facing the electrode pad; and a sealing resin for covering the entire surface acoustic wave element from the predetermined surface side of the substrate. An electronic component device comprising: a part of the sealing resin adhered to the exposed surface of the substrate on the predetermined surface around the circuit board.