GB2164954A - Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein - Google Patents

Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein Download PDF

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Publication number
GB2164954A
GB2164954A GB08424618A GB8424618A GB2164954A GB 2164954 A GB2164954 A GB 2164954A GB 08424618 A GB08424618 A GB 08424618A GB 8424618 A GB8424618 A GB 8424618A GB 2164954 A GB2164954 A GB 2164954A
Authority
GB
United Kingdom
Prior art keywords
polymer
active agent
metal
monolayer
positively charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08424618A
Other languages
English (en)
Other versions
GB8424618D0 (en
Inventor
James Watson Neely
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Co
Original Assignee
Rohm and Haas Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to PH31238A priority Critical patent/PH23907A/en
Priority to AU33542/84A priority patent/AU572564B2/en
Priority to CA000464009A priority patent/CA1233158A/en
Priority to BR8404858A priority patent/BR8404858A/pt
Priority to KR1019840006021A priority patent/KR910009982B1/ko
Priority to DE8484306615T priority patent/DE3481067D1/de
Priority to EP84306615A priority patent/EP0141528B1/en
Priority to AT84306615T priority patent/ATE49611T1/de
Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Priority to GB08424618A priority patent/GB2164954A/en
Priority to ZA847657A priority patent/ZA847657B/xx
Priority to JP59202140A priority patent/JPS60175549A/ja
Priority to IL73170A priority patent/IL73170A/xx
Publication of GB8424618D0 publication Critical patent/GB8424618D0/en
Priority to US06/833,423 priority patent/US4719145A/en
Publication of GB2164954A publication Critical patent/GB2164954A/en
Priority to US07/109,643 priority patent/US4888209A/en
Priority to SG790/90A priority patent/SG79090G/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB08424618A 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein Withdrawn GB2164954A (en)

Priority Applications (15)

Application Number Priority Date Filing Date Title
PH31238A PH23907A (en) 1983-09-28 1984-09-19 Catalytic process and systems
AU33542/84A AU572564B2 (en) 1983-09-28 1984-09-26 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein
CA000464009A CA1233158A (en) 1983-09-28 1984-09-26 Catalytic process and system
BR8404858A BR8404858A (pt) 1983-09-28 1984-09-27 Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso
JP59202140A JPS60175549A (ja) 1983-09-28 1984-09-28 触媒方法および触媒系
EP84306615A EP0141528B1 (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reation on a surface especially electroless metal deposition and catalyst systems used therein
AT84306615T ATE49611T1 (de) 1983-09-28 1984-09-28 Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme.
KR1019840006021A KR910009982B1 (ko) 1983-09-28 1984-09-28 촉매화 방법 및 촉매계
GB08424618A GB2164954A (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein
ZA847657A ZA847657B (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein
DE8484306615T DE3481067D1 (de) 1983-09-28 1984-09-28 Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme.
IL73170A IL73170A (en) 1983-09-28 1984-10-04 Process and catalyst system for conducting or catalysing a chemical reaction on a surface,especially electroless metal deposition
US06/833,423 US4719145A (en) 1983-09-28 1986-02-21 Catalytic process and systems
US07/109,643 US4888209A (en) 1983-09-28 1987-12-02 Catalytic process and systems
SG790/90A SG79090G (en) 1983-09-28 1990-09-27 Conducting or catalysing a chemical reation on a surface especially electroless metal deposition and catalyst system used therein

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53692583A 1983-09-28 1983-09-28
GB08424618A GB2164954A (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein

Publications (2)

Publication Number Publication Date
GB8424618D0 GB8424618D0 (en) 1984-11-07
GB2164954A true GB2164954A (en) 1986-04-03

Family

ID=26288277

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08424618A Withdrawn GB2164954A (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein

Country Status (12)

Country Link
EP (1) EP0141528B1 (enExample)
JP (1) JPS60175549A (enExample)
KR (1) KR910009982B1 (enExample)
AU (1) AU572564B2 (enExample)
BR (1) BR8404858A (enExample)
CA (1) CA1233158A (enExample)
DE (1) DE3481067D1 (enExample)
GB (1) GB2164954A (enExample)
IL (1) IL73170A (enExample)
PH (1) PH23907A (enExample)
SG (1) SG79090G (enExample)
ZA (1) ZA847657B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250867A1 (en) * 1986-06-16 1988-01-07 International Business Machines Corporation Seeding process for electroless metal deposition
EP0381873A3 (en) * 1989-02-03 1990-10-17 Kemifar S.P.A. Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition
RU2126459C1 (ru) * 1994-12-08 1999-02-20 Дайсин Кемикал Ко., Лтд. Способ катализирования поверхности при нанесении покрытия методом химического восстановления

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4652311A (en) * 1984-05-07 1987-03-24 Shipley Company Inc. Catalytic metal of reduced particle size
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
JPH06279602A (ja) * 1993-03-26 1994-10-04 Idemitsu Petrochem Co Ltd 無電解めっき可能なポリオレフィン樹脂成形体
BE1007610A3 (nl) * 1993-10-11 1995-08-22 Philips Electronics Nv Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat.
JP5117656B2 (ja) * 2001-09-28 2013-01-16 セーレン株式会社 無電解メッキの前処理方法及びそれを用いてなる導電性材料
EP1464394B1 (en) * 2003-03-31 2007-09-05 Council of Scientific and Industrial Research Supported nanopalladium catalyst for C-C coupling reactions of haloarenes
JP5095909B2 (ja) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 触媒組成物および析出方法
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
EP1676937B1 (en) * 2004-11-26 2016-06-01 Rohm and Haas Electronic Materials, L.L.C. UV curable catalyst compositions
EP2610365B1 (en) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
EP2610366A3 (en) * 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
JP7573322B1 (ja) * 2023-10-30 2024-10-25 奥野製薬工業株式会社 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1318247A (en) * 1969-09-01 1973-05-23 Dynamit Nobel Ag Metallisation of shaped plastics articles
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
GB1573241A (en) * 1977-03-08 1980-08-20 Western Electric Co Method of depositing a metal on a surface
GB1597759A (en) * 1977-03-11 1981-09-09 Western Electric Co Method of depositing a metal on a surface
EP0035626A1 (en) * 1980-03-06 1981-09-16 Ses, Incorporated Improved electroless plating process for glass or ceramic bodies
WO1982001382A1 (en) * 1980-10-10 1982-04-29 Sorensen Gunnar A powder for use in dry sensitization for electroless plating
EP0087135A1 (en) * 1982-02-18 1983-08-31 Lk Power Systems A/S A powder for use for dry activation of a substrate for electroless metallization

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1543792A (fr) * 1966-12-29 1900-01-01 Ibm Métallisation de matières plastiques
DE2111136A1 (de) * 1971-03-09 1972-09-28 Kalle Ag Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
NL7413977A (nl) * 1974-10-25 1976-04-27 Philips Nv Aanbrengen van een geleiderlaagpatroon met op een geringe onderlinge afstand gelegen delen, in het bijzonder bij de vervaardiging van half- geleiderinrichtingen.
DE2531769C3 (de) * 1975-07-16 1978-07-06 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Verwendung von hochstabilen Metalloxid-Dispersionen zur Erzeugung haftfester Metalloxid-Überzüge auf einem festen chemisch ineiten porösen Katalysatorträger
JPS5586533A (en) * 1978-12-26 1980-06-30 Toa Nenryo Kogyo Kk Manufacturing method of granular catalyst coated with polymer
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1318247A (en) * 1969-09-01 1973-05-23 Dynamit Nobel Ag Metallisation of shaped plastics articles
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
GB1573241A (en) * 1977-03-08 1980-08-20 Western Electric Co Method of depositing a metal on a surface
GB1597759A (en) * 1977-03-11 1981-09-09 Western Electric Co Method of depositing a metal on a surface
EP0035626A1 (en) * 1980-03-06 1981-09-16 Ses, Incorporated Improved electroless plating process for glass or ceramic bodies
WO1982001382A1 (en) * 1980-10-10 1982-04-29 Sorensen Gunnar A powder for use in dry sensitization for electroless plating
EP0087135A1 (en) * 1982-02-18 1983-08-31 Lk Power Systems A/S A powder for use for dry activation of a substrate for electroless metallization

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250867A1 (en) * 1986-06-16 1988-01-07 International Business Machines Corporation Seeding process for electroless metal deposition
EP0381873A3 (en) * 1989-02-03 1990-10-17 Kemifar S.P.A. Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition
RU2126459C1 (ru) * 1994-12-08 1999-02-20 Дайсин Кемикал Ко., Лтд. Способ катализирования поверхности при нанесении покрытия методом химического восстановления

Also Published As

Publication number Publication date
KR910009982B1 (ko) 1991-12-09
IL73170A0 (en) 1985-01-31
SG79090G (en) 1990-11-23
KR850002846A (ko) 1985-05-20
JPH0585219B2 (enExample) 1993-12-06
GB8424618D0 (en) 1984-11-07
IL73170A (en) 1988-07-31
CA1233158A (en) 1988-02-23
JPS60175549A (ja) 1985-09-09
AU572564B2 (en) 1988-05-12
ZA847657B (en) 1985-11-27
BR8404858A (pt) 1985-08-13
PH23907A (en) 1989-12-18
EP0141528A2 (en) 1985-05-15
AU3354284A (en) 1985-04-04
EP0141528B1 (en) 1990-01-17
DE3481067D1 (de) 1990-02-22
EP0141528A3 (en) 1987-06-03

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)