DE3481067D1 - Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme. - Google Patents

Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme.

Info

Publication number
DE3481067D1
DE3481067D1 DE8484306615T DE3481067T DE3481067D1 DE 3481067 D1 DE3481067 D1 DE 3481067D1 DE 8484306615 T DE8484306615 T DE 8484306615T DE 3481067 T DE3481067 T DE 3481067T DE 3481067 D1 DE3481067 D1 DE 3481067D1
Authority
DE
Germany
Prior art keywords
catalyzing
carrying
chemical reaction
metal deposition
catalyst systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484306615T
Other languages
German (de)
English (en)
Inventor
James Watson Neely
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Co
Original Assignee
Rohm and Haas Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Application granted granted Critical
Publication of DE3481067D1 publication Critical patent/DE3481067D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8484306615T 1983-09-28 1984-09-28 Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme. Expired - Fee Related DE3481067D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53692583A 1983-09-28 1983-09-28
GB08424618A GB2164954A (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein

Publications (1)

Publication Number Publication Date
DE3481067D1 true DE3481067D1 (de) 1990-02-22

Family

ID=26288277

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484306615T Expired - Fee Related DE3481067D1 (de) 1983-09-28 1984-09-28 Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme.

Country Status (12)

Country Link
EP (1) EP0141528B1 (enExample)
JP (1) JPS60175549A (enExample)
KR (1) KR910009982B1 (enExample)
AU (1) AU572564B2 (enExample)
BR (1) BR8404858A (enExample)
CA (1) CA1233158A (enExample)
DE (1) DE3481067D1 (enExample)
GB (1) GB2164954A (enExample)
IL (1) IL73170A (enExample)
PH (1) PH23907A (enExample)
SG (1) SG79090G (enExample)
ZA (1) ZA847657B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4652311A (en) * 1984-05-07 1987-03-24 Shipley Company Inc. Catalytic metal of reduced particle size
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
US4701351A (en) * 1986-06-16 1987-10-20 International Business Machines Corporation Seeding process for electroless metal deposition
IT1232841B (it) * 1989-02-03 1992-03-05 Kemifar Spa Composizione attivante per la metallizzazione di substrati isolanti e procedimento di metalizzazione di tali substrati impiegante la stessa
JPH06279602A (ja) * 1993-03-26 1994-10-04 Idemitsu Petrochem Co Ltd 無電解めっき可能なポリオレフィン樹脂成形体
BE1007610A3 (nl) * 1993-10-11 1995-08-22 Philips Electronics Nv Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat.
JP3022226B2 (ja) * 1994-12-08 2000-03-15 大伸化学株式会社 無電解めっき法における触媒化方法
JP5117656B2 (ja) * 2001-09-28 2013-01-16 セーレン株式会社 無電解メッキの前処理方法及びそれを用いてなる導電性材料
EP1464394B1 (en) * 2003-03-31 2007-09-05 Council of Scientific and Industrial Research Supported nanopalladium catalyst for C-C coupling reactions of haloarenes
JP5095909B2 (ja) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 触媒組成物および析出方法
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
EP1676937B1 (en) * 2004-11-26 2016-06-01 Rohm and Haas Electronic Materials, L.L.C. UV curable catalyst compositions
EP2610365B1 (en) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
EP2610366A3 (en) * 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
JP7573322B1 (ja) * 2023-10-30 2024-10-25 奥野製薬工業株式会社 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1543792A (fr) * 1966-12-29 1900-01-01 Ibm Métallisation de matières plastiques
BE755520A (fr) * 1969-09-01 1971-02-01 Dynamit Nobel Ag Procede de metallisation de matieres synthetiques
DE2111136A1 (de) * 1971-03-09 1972-09-28 Kalle Ag Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
NL7413977A (nl) * 1974-10-25 1976-04-27 Philips Nv Aanbrengen van een geleiderlaagpatroon met op een geringe onderlinge afstand gelegen delen, in het bijzonder bij de vervaardiging van half- geleiderinrichtingen.
DE2531769C3 (de) * 1975-07-16 1978-07-06 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Verwendung von hochstabilen Metalloxid-Dispersionen zur Erzeugung haftfester Metalloxid-Überzüge auf einem festen chemisch ineiten porösen Katalysatorträger
GB1573241A (en) * 1977-03-08 1980-08-20 Western Electric Co Method of depositing a metal on a surface
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
JPS5586533A (en) * 1978-12-26 1980-06-30 Toa Nenryo Kogyo Kk Manufacturing method of granular catalyst coated with polymer
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf

Also Published As

Publication number Publication date
KR910009982B1 (ko) 1991-12-09
IL73170A0 (en) 1985-01-31
SG79090G (en) 1990-11-23
KR850002846A (ko) 1985-05-20
JPH0585219B2 (enExample) 1993-12-06
GB8424618D0 (en) 1984-11-07
IL73170A (en) 1988-07-31
CA1233158A (en) 1988-02-23
JPS60175549A (ja) 1985-09-09
AU572564B2 (en) 1988-05-12
ZA847657B (en) 1985-11-27
BR8404858A (pt) 1985-08-13
PH23907A (en) 1989-12-18
EP0141528A2 (en) 1985-05-15
AU3354284A (en) 1985-04-04
EP0141528B1 (en) 1990-01-17
GB2164954A (en) 1986-04-03
EP0141528A3 (en) 1987-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee