DE3481067D1 - Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme. - Google Patents
Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme.Info
- Publication number
- DE3481067D1 DE3481067D1 DE8484306615T DE3481067T DE3481067D1 DE 3481067 D1 DE3481067 D1 DE 3481067D1 DE 8484306615 T DE8484306615 T DE 8484306615T DE 3481067 T DE3481067 T DE 3481067T DE 3481067 D1 DE3481067 D1 DE 3481067D1
- Authority
- DE
- Germany
- Prior art keywords
- catalyzing
- carrying
- chemical reaction
- metal deposition
- catalyst systems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53692583A | 1983-09-28 | 1983-09-28 | |
GB08424618A GB2164954A (en) | 1983-09-28 | 1984-09-28 | Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3481067D1 true DE3481067D1 (de) | 1990-02-22 |
Family
ID=26288277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484306615T Expired - Fee Related DE3481067D1 (de) | 1983-09-28 | 1984-09-28 | Durchfuehrung oder katalysierung einer chemischen reaktion auf einer oberflaeche, insbesondere bei der stromlosen metallabscheidung und dabei verwendete katalysatorsysteme. |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP0141528B1 (de) |
JP (1) | JPS60175549A (de) |
KR (1) | KR910009982B1 (de) |
AU (1) | AU572564B2 (de) |
BR (1) | BR8404858A (de) |
CA (1) | CA1233158A (de) |
DE (1) | DE3481067D1 (de) |
GB (1) | GB2164954A (de) |
IL (1) | IL73170A (de) |
PH (1) | PH23907A (de) |
SG (1) | SG79090G (de) |
ZA (1) | ZA847657B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634468A (en) * | 1984-05-07 | 1987-01-06 | Shipley Company Inc. | Catalytic metal of reduced particle size |
US4652311A (en) * | 1984-05-07 | 1987-03-24 | Shipley Company Inc. | Catalytic metal of reduced particle size |
US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
IT1232841B (it) * | 1989-02-03 | 1992-03-05 | Kemifar Spa | Composizione attivante per la metallizzazione di substrati isolanti e procedimento di metalizzazione di tali substrati impiegante la stessa |
JPH06279602A (ja) * | 1993-03-26 | 1994-10-04 | Idemitsu Petrochem Co Ltd | 無電解めっき可能なポリオレフィン樹脂成形体 |
BE1007610A3 (nl) * | 1993-10-11 | 1995-08-22 | Philips Electronics Nv | Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat. |
JP5117656B2 (ja) * | 2001-09-28 | 2013-01-16 | セーレン株式会社 | 無電解メッキの前処理方法及びそれを用いてなる導電性材料 |
DE60316108T2 (de) * | 2003-03-31 | 2008-06-05 | Council Of Scientific & Industrial Research | Geträgerter Nanopalladium Katalysator für C-C Kupplungsreaktionen von Haloarenen |
JP5095909B2 (ja) * | 2003-06-24 | 2012-12-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 触媒組成物および析出方法 |
JP2005206905A (ja) * | 2004-01-23 | 2005-08-04 | Ebara Corp | 基板処理方法及び装置、並びに処理液 |
EP1676937B1 (de) * | 2004-11-26 | 2016-06-01 | Rohm and Haas Electronic Materials, L.L.C. | UV härtbare Katalysatormischung |
EP2610365B1 (de) * | 2011-12-31 | 2020-02-26 | Rohm and Haas Electronic Materials LLC | Stromloses abscheidungsverfahren |
EP2610366A3 (de) * | 2011-12-31 | 2014-07-30 | Rohm and Haas Electronic Materials LLC | Plattierkatalysator und Verfahren |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1543792A (fr) * | 1966-12-29 | 1900-01-01 | Ibm | Métallisation de matières plastiques |
BE755520A (fr) * | 1969-09-01 | 1971-02-01 | Dynamit Nobel Ag | Procede de metallisation de matieres synthetiques |
DE2111136A1 (de) * | 1971-03-09 | 1972-09-28 | Kalle Ag | Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material |
GB1403198A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
NL7413977A (nl) * | 1974-10-25 | 1976-04-27 | Philips Nv | Aanbrengen van een geleiderlaagpatroon met op een geringe onderlinge afstand gelegen delen, in het bijzonder bij de vervaardiging van half- geleiderinrichtingen. |
DE2531769C3 (de) * | 1975-07-16 | 1978-07-06 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Verwendung von hochstabilen Metalloxid-Dispersionen zur Erzeugung haftfester Metalloxid-Überzüge auf einem festen chemisch ineiten porösen Katalysatorträger |
GB1573241A (en) * | 1977-03-08 | 1980-08-20 | Western Electric Co | Method of depositing a metal on a surface |
US4073981A (en) * | 1977-03-11 | 1978-02-14 | Western Electric Company, Inc. | Method of selectively depositing metal on a surface |
JPS5586533A (en) * | 1978-12-26 | 1980-06-30 | Toa Nenryo Kogyo Kk | Manufacturing method of granular catalyst coated with polymer |
US4259409A (en) * | 1980-03-06 | 1981-03-31 | Ses, Incorporated | Electroless plating process for glass or ceramic bodies and product |
DK427780A (da) * | 1980-10-10 | 1982-04-11 | Neselco As | Pulver til brug ved toer sensibilisering for stroemloes metallisering |
DE3150985A1 (de) * | 1981-12-23 | 1983-06-30 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
DK153572C (da) * | 1982-02-18 | 1988-12-19 | Platonec Aps | Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf |
-
1984
- 1984-09-19 PH PH31238A patent/PH23907A/en unknown
- 1984-09-26 AU AU33542/84A patent/AU572564B2/en not_active Ceased
- 1984-09-26 CA CA000464009A patent/CA1233158A/en not_active Expired
- 1984-09-27 BR BR8404858A patent/BR8404858A/pt not_active IP Right Cessation
- 1984-09-28 EP EP84306615A patent/EP0141528B1/de not_active Expired - Lifetime
- 1984-09-28 KR KR1019840006021A patent/KR910009982B1/ko not_active IP Right Cessation
- 1984-09-28 ZA ZA847657A patent/ZA847657B/xx unknown
- 1984-09-28 GB GB08424618A patent/GB2164954A/en not_active Withdrawn
- 1984-09-28 JP JP59202140A patent/JPS60175549A/ja active Granted
- 1984-09-28 DE DE8484306615T patent/DE3481067D1/de not_active Expired - Fee Related
- 1984-10-04 IL IL73170A patent/IL73170A/xx not_active IP Right Cessation
-
1990
- 1990-09-27 SG SG790/90A patent/SG79090G/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH23907A (en) | 1989-12-18 |
AU3354284A (en) | 1985-04-04 |
EP0141528B1 (de) | 1990-01-17 |
JPH0585219B2 (de) | 1993-12-06 |
CA1233158A (en) | 1988-02-23 |
JPS60175549A (ja) | 1985-09-09 |
SG79090G (en) | 1990-11-23 |
AU572564B2 (en) | 1988-05-12 |
ZA847657B (en) | 1985-11-27 |
BR8404858A (pt) | 1985-08-13 |
IL73170A (en) | 1988-07-31 |
IL73170A0 (en) | 1985-01-31 |
KR910009982B1 (ko) | 1991-12-09 |
GB8424618D0 (en) | 1984-11-07 |
GB2164954A (en) | 1986-04-03 |
KR850002846A (ko) | 1985-05-20 |
EP0141528A3 (en) | 1987-06-03 |
EP0141528A2 (de) | 1985-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |