GB1403197A - Metal encapsulation - Google Patents
Metal encapsulationInfo
- Publication number
- GB1403197A GB1403197A GB4151372A GB4151372A GB1403197A GB 1403197 A GB1403197 A GB 1403197A GB 4151372 A GB4151372 A GB 4151372A GB 4151372 A GB4151372 A GB 4151372A GB 1403197 A GB1403197 A GB 1403197A
- Authority
- GB
- United Kingdom
- Prior art keywords
- binder
- particles
- polymer
- metal
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Abstract
1403197 Metallizing particles BELL & HOWELL CO 7 Sept 1972 [30 Sept 1971] 41513/72 Heading C7F Particles of solid or liquid have applied thereto a composition comprising a metal compound capable of reduction to catalytically active sites for electroless plating and a binder comprising one or more polymers and/or polymer-formers and a solvent for said compound and binder so that a coating of compound and binder is formed thereon, and the coated particles are then electroless plated. The particles may be solid, e.g. glass beads, metal, inorganic compounds, minerals asbestos, wax, thermoplastic or thermosetting polymer, copolymer or inorganic compound/ polymer mixtures, of size 10-200Á or colloidal particles of size 0.001-10Á Said composition may contain 0.001-1 wt per cent of metal compound, e.g. a salt of Ag, Au, Ru, Rh, Pd, Os, Ir or Pt, a binder in wt. ratio binder: metal of 0.3 to 15: 1 which binder is an alkali metal silicate, aluminosilicate, phosphonitrile, polyborane, or an organic polymer (or polymer-former) or a natural product such as starch or gum; the solvent is organic (a list is given) and a binder/metal compound layer 20- 300 A thick is formed, and the particles separated, washed and dried, then conventionally electroless plated e.g. with Ni, Co, Cu, Ni-Fe, Ni- Co, or Ni-W-P for 5 sec-2min. at 25-65 C to thickness 0.01-5Á. Liquids may be encapsulated by forming a suspension thereof in a solution containing binder and metal compound as above so that the binder coats the liquid to give encapsulated sensitized particles, or ready-encapsulated liquids or solids may be treated as above.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18510971A | 1971-09-30 | 1971-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1403197A true GB1403197A (en) | 1975-08-28 |
Family
ID=22679631
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4151372A Expired GB1403197A (en) | 1971-09-30 | 1972-09-07 | Metal encapsulation |
GB5452774A Expired GB1403198A (en) | 1971-09-30 | 1972-09-07 | Metal encapsulation |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5452774A Expired GB1403198A (en) | 1971-09-30 | 1972-09-07 | Metal encapsulation |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS4841926A (en) |
DE (1) | DE2245766A1 (en) |
GB (2) | GB1403197A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2000197A (en) * | 1977-06-24 | 1979-01-04 | Preh Gmbh W | Method of producing a solderable conductive layer on a substrate |
GB2164954A (en) * | 1983-09-28 | 1986-04-03 | Rohm & Haas | Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein |
WO2004007767A2 (en) * | 2002-07-12 | 2004-01-22 | University Of Strathclyde | Serrs reactive particles |
EP1856309A2 (en) * | 2005-02-03 | 2007-11-21 | Macdermid Incorporated | Selective catalytic activation of non-conductive substrates |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1558762A (en) * | 1975-07-04 | 1980-01-09 | Johnson Matthey Co Ltd | Metal or alloy coated powders |
JPS60181294A (en) * | 1984-02-24 | 1985-09-14 | Agency Of Ind Science & Technol | Production of inorganic powder having metallic film on surface |
JPS61276979A (en) * | 1985-05-30 | 1986-12-06 | Nippon Chem Ind Co Ltd:The | Manufacture of nickel plated material |
JPS62196378A (en) * | 1986-02-21 | 1987-08-29 | Brother Ind Ltd | Forming method for thin film |
JPS62297401A (en) * | 1986-06-17 | 1987-12-24 | Tsurumi Soda Kk | Production of composite powder material |
US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
-
1972
- 1972-09-07 GB GB4151372A patent/GB1403197A/en not_active Expired
- 1972-09-07 GB GB5452774A patent/GB1403198A/en not_active Expired
- 1972-09-18 DE DE19722245766 patent/DE2245766A1/en active Pending
- 1972-09-29 JP JP9724872A patent/JPS4841926A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2000197A (en) * | 1977-06-24 | 1979-01-04 | Preh Gmbh W | Method of producing a solderable conductive layer on a substrate |
GB2000197B (en) * | 1977-06-24 | 1982-03-17 | Preh Elektrofeinmechanische Werke Jakob Preh Nachf Gmbh Co | Method of producing a solderable conductive layer on a substrate |
GB2164954A (en) * | 1983-09-28 | 1986-04-03 | Rohm & Haas | Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein |
WO2004007767A2 (en) * | 2002-07-12 | 2004-01-22 | University Of Strathclyde | Serrs reactive particles |
WO2004007767A3 (en) * | 2002-07-12 | 2004-03-11 | Univ Strathclyde | Serrs reactive particles |
CN100413977C (en) * | 2002-07-12 | 2008-08-27 | 斯特拉斯克莱德大学 | SERRS reactive particles |
EP1856309A2 (en) * | 2005-02-03 | 2007-11-21 | Macdermid Incorporated | Selective catalytic activation of non-conductive substrates |
EP1856309A4 (en) * | 2005-02-03 | 2009-10-28 | Macdermid Inc | Selective catalytic activation of non-conductive substrates |
Also Published As
Publication number | Publication date |
---|---|
DE2245766A1 (en) | 1973-04-05 |
JPS4841926A (en) | 1973-06-19 |
GB1403198A (en) | 1975-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |