FR2783094B1 - Module semiconducteur optique, film de reflexion, dispositifs laser et optique utilisant un film de reflexion et leur procede de fabrication - Google Patents
Module semiconducteur optique, film de reflexion, dispositifs laser et optique utilisant un film de reflexion et leur procede de fabricationInfo
- Publication number
- FR2783094B1 FR2783094B1 FR9911211A FR9911211A FR2783094B1 FR 2783094 B1 FR2783094 B1 FR 2783094B1 FR 9911211 A FR9911211 A FR 9911211A FR 9911211 A FR9911211 A FR 9911211A FR 2783094 B1 FR2783094 B1 FR 2783094B1
- Authority
- FR
- France
- Prior art keywords
- reflection film
- laser
- manufacturing
- same
- semiconductor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25433598 | 1998-09-08 | ||
JP7034699 | 1999-03-16 | ||
JP20025499A JP3865186B2 (ja) | 1998-09-08 | 1999-07-14 | 光半導体モジュール及びその製造方法 |
JP20902099A JP4497251B2 (ja) | 1999-03-16 | 1999-07-23 | 半導体レーザの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2783094A1 FR2783094A1 (fr) | 2000-03-10 |
FR2783094B1 true FR2783094B1 (fr) | 2006-07-28 |
Family
ID=27465230
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9911211A Expired - Fee Related FR2783094B1 (fr) | 1998-09-08 | 1999-09-08 | Module semiconducteur optique, film de reflexion, dispositifs laser et optique utilisant un film de reflexion et leur procede de fabrication |
FR0011281A Expired - Fee Related FR2798519B1 (fr) | 1998-09-08 | 2000-09-05 | Dispositif laser utilisant un film de reflexion et son procede de fabrication |
FR0011280A Expired - Fee Related FR2798518B1 (fr) | 1998-09-08 | 2000-09-05 | Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0011281A Expired - Fee Related FR2798519B1 (fr) | 1998-09-08 | 2000-09-05 | Dispositif laser utilisant un film de reflexion et son procede de fabrication |
FR0011280A Expired - Fee Related FR2798518B1 (fr) | 1998-09-08 | 2000-09-05 | Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion |
Country Status (3)
Country | Link |
---|---|
US (2) | US6448583B1 (fr) |
DE (2) | DE19964228B4 (fr) |
FR (3) | FR2783094B1 (fr) |
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KR20010071420A (ko) * | 1998-06-05 | 2001-07-28 | 라오 허즐 | 디스크 드라이브를 위한 광 스위치 |
US6839475B2 (en) * | 2000-04-27 | 2005-01-04 | Tomoegawa Paper Co., Ltd. | Optical connection component |
DE10041079A1 (de) * | 2000-08-22 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Lasermodul mit Ansteuerschaltung |
CN1259732C (zh) * | 2000-09-29 | 2006-06-14 | 欧姆龙株式会社 | 光学器件及其应用 |
JP4450965B2 (ja) | 2000-09-29 | 2010-04-14 | 日本碍子株式会社 | 光学部品の接着構造 |
JPWO2002054548A1 (ja) * | 2000-12-28 | 2004-05-13 | 松下電器産業株式会社 | 短波長レーザモジュールおよびその製造方法 |
FR2819895B1 (fr) * | 2001-01-19 | 2003-10-03 | Cit Alcatel | Dispositif laser a couplage compensateur passif |
US6777613B2 (en) * | 2001-08-28 | 2004-08-17 | Nihon Dempa Kogyo Co., Ltd | Multifunctional crystal unit and method of manufacturing the same |
JP3792174B2 (ja) * | 2002-05-02 | 2006-07-05 | 株式会社巴川製紙所 | 光学接続部品 |
JP3802844B2 (ja) * | 2002-06-14 | 2006-07-26 | 古河電気工業株式会社 | 光半導体モジュール |
JP2004031215A (ja) * | 2002-06-27 | 2004-01-29 | Toyota Industries Corp | カラー表示デバイス |
JP2005243053A (ja) * | 2003-03-24 | 2005-09-08 | Ricoh Co Ltd | 色素系追記型dvd媒体の記録再生方法及び装置 |
JP4148932B2 (ja) * | 2004-08-31 | 2008-09-10 | シャープ株式会社 | 半導体装置、半導体モジュール及び半導体装置の製造方法 |
JP4760713B2 (ja) * | 2004-10-13 | 2011-08-31 | 住友ベークライト株式会社 | 受光装置 |
US20090000815A1 (en) * | 2007-06-27 | 2009-01-01 | Rf Micro Devices, Inc. | Conformal shielding employing segment buildup |
US8062930B1 (en) | 2005-08-08 | 2011-11-22 | Rf Micro Devices, Inc. | Sub-module conformal electromagnetic interference shield |
US8053872B1 (en) | 2007-06-25 | 2011-11-08 | Rf Micro Devices, Inc. | Integrated shield for a no-lead semiconductor device package |
US8959762B2 (en) | 2005-08-08 | 2015-02-24 | Rf Micro Devices, Inc. | Method of manufacturing an electronic module |
JP2008059658A (ja) * | 2006-08-30 | 2008-03-13 | Sanyo Electric Co Ltd | 光検出器 |
DE102008025491A1 (de) * | 2008-05-28 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Leiterplatte |
JP5507096B2 (ja) * | 2009-03-05 | 2014-05-28 | 株式会社フジクラ | 歯科用プローブの製造方法 |
US9137934B2 (en) | 2010-08-18 | 2015-09-15 | Rf Micro Devices, Inc. | Compartmentalized shielding of selected components |
CN102074609B (zh) * | 2010-10-13 | 2012-07-04 | 清华大学 | 一种紫外雪崩光电二极管探测器及其制作方法 |
US8835226B2 (en) | 2011-02-25 | 2014-09-16 | Rf Micro Devices, Inc. | Connection using conductive vias |
US9627230B2 (en) | 2011-02-28 | 2017-04-18 | Qorvo Us, Inc. | Methods of forming a microshield on standard QFN package |
JP5921723B2 (ja) * | 2013-01-11 | 2016-05-24 | 三菱電機株式会社 | 半導体装置 |
US9807890B2 (en) | 2013-05-31 | 2017-10-31 | Qorvo Us, Inc. | Electronic modules having grounded electromagnetic shields |
JP6664897B2 (ja) * | 2015-07-22 | 2020-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6412042B2 (ja) | 2016-03-29 | 2018-10-24 | ファナック株式会社 | レーザ発振器 |
JP6903534B2 (ja) * | 2017-09-21 | 2021-07-14 | Ntn株式会社 | インホイールモータ駆動装置 |
US11127689B2 (en) | 2018-06-01 | 2021-09-21 | Qorvo Us, Inc. | Segmented shielding using wirebonds |
US11219144B2 (en) | 2018-06-28 | 2022-01-04 | Qorvo Us, Inc. | Electromagnetic shields for sub-modules |
US11114363B2 (en) | 2018-12-20 | 2021-09-07 | Qorvo Us, Inc. | Electronic package arrangements and related methods |
JP7421840B2 (ja) * | 2019-02-08 | 2024-01-25 | 古河電気工業株式会社 | 光モジュール |
US11515282B2 (en) | 2019-05-21 | 2022-11-29 | Qorvo Us, Inc. | Electromagnetic shields with bonding wires for sub-modules |
US11476637B2 (en) * | 2019-12-16 | 2022-10-18 | Nichia Corporation | Light-emitting device |
DE102022106941A1 (de) | 2022-03-24 | 2023-09-28 | Ams-Osram International Gmbh | Optoelektronisches halbleiterlaserbauelement |
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-
1999
- 1999-09-06 DE DE19964228A patent/DE19964228B4/de not_active Expired - Fee Related
- 1999-09-06 DE DE19942470A patent/DE19942470B4/de not_active Expired - Fee Related
- 1999-09-08 FR FR9911211A patent/FR2783094B1/fr not_active Expired - Fee Related
- 1999-09-08 US US09/392,239 patent/US6448583B1/en not_active Expired - Lifetime
-
2000
- 2000-09-05 FR FR0011281A patent/FR2798519B1/fr not_active Expired - Fee Related
- 2000-09-05 FR FR0011280A patent/FR2798518B1/fr not_active Expired - Fee Related
-
2002
- 2002-07-03 US US10/187,948 patent/US6579737B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2798518A1 (fr) | 2001-03-16 |
FR2798519B1 (fr) | 2005-05-27 |
FR2783094A1 (fr) | 2000-03-10 |
FR2798518B1 (fr) | 2005-05-27 |
US6579737B2 (en) | 2003-06-17 |
US6448583B1 (en) | 2002-09-10 |
FR2798519A1 (fr) | 2001-03-16 |
DE19964228B4 (de) | 2008-11-13 |
US20030020076A1 (en) | 2003-01-30 |
DE19942470A1 (de) | 2000-05-04 |
DE19942470B4 (de) | 2013-04-11 |
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