DE60032127D1 - Halbleiterlaservorrichtung und deren herstellungsverfahren, optisches kommunikationssystem und optisches sensorsystem - Google Patents

Halbleiterlaservorrichtung und deren herstellungsverfahren, optisches kommunikationssystem und optisches sensorsystem

Info

Publication number
DE60032127D1
DE60032127D1 DE60032127T DE60032127T DE60032127D1 DE 60032127 D1 DE60032127 D1 DE 60032127D1 DE 60032127 T DE60032127 T DE 60032127T DE 60032127 T DE60032127 T DE 60032127T DE 60032127 D1 DE60032127 D1 DE 60032127D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor laser
laser device
communication system
optical sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032127T
Other languages
English (en)
Other versions
DE60032127T2 (de
Inventor
Atsushi Shimonaka
Hidenori Kawanishi
Kazuhiro Emoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE60032127D1 publication Critical patent/DE60032127D1/de
Publication of DE60032127T2 publication Critical patent/DE60032127T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Polarising Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60032127T 1999-04-05 2000-04-05 Halbleiterlaservorrichtung und deren herstellungsverfahren, optisches kommunikationssystem und optisches sensorsystem Expired - Lifetime DE60032127T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9824399 1999-04-05
JP9824399 1999-04-05
PCT/JP2000/002207 WO2000060711A1 (fr) 1999-04-05 2000-04-05 Dispositif laser a semiconducteur et son procede de fabrication, systeme de communication optique, et systeme a capteur optique

Publications (2)

Publication Number Publication Date
DE60032127D1 true DE60032127D1 (de) 2007-01-11
DE60032127T2 DE60032127T2 (de) 2007-10-25

Family

ID=14214530

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60041465T Expired - Lifetime DE60041465D1 (de) 1999-04-05 2000-04-05 Halbleiterlaservorrichtung mit einem aus Harz bestehenden Abschnitt
DE60032127T Expired - Lifetime DE60032127T2 (de) 1999-04-05 2000-04-05 Halbleiterlaservorrichtung und deren herstellungsverfahren, optisches kommunikationssystem und optisches sensorsystem

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60041465T Expired - Lifetime DE60041465D1 (de) 1999-04-05 2000-04-05 Halbleiterlaservorrichtung mit einem aus Harz bestehenden Abschnitt

Country Status (4)

Country Link
US (1) US6778574B1 (de)
EP (2) EP1746692B1 (de)
DE (2) DE60041465D1 (de)
WO (1) WO2000060711A1 (de)

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US7695166B2 (en) * 2001-11-23 2010-04-13 Derose Anthony Shaped LED light bulb
US20080084009A1 (en) * 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
DE60220711T2 (de) 2001-12-10 2008-03-06 Inolase 2002 Ltd. Verfahren und gerät zur erhöhung der sicherheit während der anwesenheit einer monochromatischen lichtquelle
US7762964B2 (en) 2001-12-10 2010-07-27 Candela Corporation Method and apparatus for improving safety during exposure to a monochromatic light source
US7762965B2 (en) 2001-12-10 2010-07-27 Candela Corporation Method and apparatus for vacuum-assisted light-based treatments of the skin
US7935139B2 (en) 2001-12-10 2011-05-03 Candela Corporation Eye safe dermatological phototherapy
EP1627662B1 (de) 2004-06-10 2011-03-02 Candela Corporation Apparat für vakuumunterstützte dermatologische Phototherapien
US7740600B2 (en) 2002-08-02 2010-06-22 Candela Corporation Apparatus and method for inhibiting pain signals transmitted during a skin related medical treatment
JP3982396B2 (ja) * 2002-11-26 2007-09-26 セイコーエプソン株式会社 光学式センサ、カード型情報記録媒体及びそれを用いた情報処理システム
ES2570987T3 (es) 2003-02-25 2016-05-23 Tria Beauty Inc Aparato de tratamiento dermatológico, basado en láser de diodo y autónomo
EP2604216B1 (de) 2003-02-25 2018-08-22 Tria Beauty, Inc. In sich geschlossene Vorrichtung zur dermatologischen Behandlung auf Diodenlaserbasis
WO2004075976A2 (en) 2003-02-25 2004-09-10 Spectragenics, Inc. Method and apparatus for the treatment of benign pigmented lesions
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
US8777935B2 (en) 2004-02-25 2014-07-15 Tria Beauty, Inc. Optical sensor and method for identifying the presence of skin
JP4401348B2 (ja) 2004-12-28 2010-01-20 シャープ株式会社 発光デバイスならびにそれを用いた照明機器および表示機器
JP4720621B2 (ja) * 2005-06-09 2011-07-13 セイコーエプソン株式会社 レーザ光源装置、表示装置、走査型表示装置およびプロジェクタ
KR100703216B1 (ko) * 2006-02-21 2007-04-09 삼성전기주식회사 발광다이오드 패키지의 제조 방법
US20080058496A1 (en) * 2006-08-29 2008-03-06 Daily Polymer Co., Ltd. Polyamic acid-based composition, and liquid crystal orienting agent and orienting film containing the same
JP5595270B2 (ja) 2007-08-08 2014-09-24 トリア ビューティ インコーポレイテッド 皮膚検知のための静電容量型センシング方法及び装置
US7740651B2 (en) 2007-09-28 2010-06-22 Candela Corporation Vacuum assisted treatment of the skin
US9687671B2 (en) 2008-04-25 2017-06-27 Channel Investments, Llc Optical sensor and method for identifying the presence of skin and the pigmentation of skin
US8212467B2 (en) * 2008-05-26 2012-07-03 Sharp Kabushiki Kaisha Light emitting device
WO2012115246A1 (ja) * 2011-02-25 2012-08-30 ローム株式会社 通信モジュールおよび携帯型電子機器
US20130037931A1 (en) * 2011-08-08 2013-02-14 Leo M. Higgins, III Semiconductor package with a heat spreader and method of making
US8882310B2 (en) * 2012-12-10 2014-11-11 Microsoft Corporation Laser die light source module with low inductance
FR3001026A1 (fr) * 2013-01-14 2014-07-18 Waitrony Optoelectronics Ltd Appareil a del a diffusion d'intensite lumineuse
JP2016029718A (ja) * 2014-07-15 2016-03-03 ローム株式会社 半導体レーザ装置
JP2017112321A (ja) * 2015-12-18 2017-06-22 ソニー株式会社 発光ユニットおよび表示装置
JP6458825B2 (ja) * 2016-06-29 2019-01-30 日亜化学工業株式会社 光源装置
DE102016225242A1 (de) * 2016-12-16 2018-06-21 Robert Bosch Gmbh Verfahren zur Herstellung eines Lasermoduls einer Laser-Nivelliervorrichtung sowie Laser-Nivelliervorrichtung
JP6764435B2 (ja) * 2018-04-27 2020-09-30 Ｅ＆Ｅ Ｊａｐａｎ株式会社 センサー
CN210153731U (zh) 2018-06-12 2020-03-17 意法半导体(格勒诺布尔2)公司 安装在基板上的光源的外壳以及电子设备
US10738985B2 (en) 2018-06-12 2020-08-11 Stmicroelectronics (Research & Development) Limited Housing for light source
FR3085465B1 (fr) * 2018-08-31 2021-05-21 St Microelectronics Grenoble 2 Mecanisme de protection pour source lumineuse
US10865962B2 (en) 2018-06-12 2020-12-15 Stmicroelectronics (Grenoble 2) Sas Protection mechanism for light source
CN110594705A (zh) 2018-06-12 2019-12-20 意法半导体(格勒诺布尔2)公司 光源的保护机构
DE102020131968A1 (de) 2020-12-02 2022-06-02 Ifm Electronic Gmbh Beleuchtung mit Strahlaufweitung

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JP2687167B2 (ja) 1989-06-06 1997-12-08 松下電器産業株式会社 半導体レーザ装置とその製造方法
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Also Published As

Publication number Publication date
EP1168535B1 (de) 2006-11-29
EP1746692A2 (de) 2007-01-24
EP1746692B1 (de) 2009-01-21
DE60041465D1 (de) 2009-03-12
EP1168535A4 (de) 2005-03-16
WO2000060711A1 (fr) 2000-10-12
EP1746692A3 (de) 2007-03-21
DE60032127T2 (de) 2007-10-25
EP1168535A1 (de) 2002-01-02
US6778574B1 (en) 2004-08-17

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Legal Events

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