FR2798518B1 - Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion - Google Patents

Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion

Info

Publication number
FR2798518B1
FR2798518B1 FR0011280A FR0011280A FR2798518B1 FR 2798518 B1 FR2798518 B1 FR 2798518B1 FR 0011280 A FR0011280 A FR 0011280A FR 0011280 A FR0011280 A FR 0011280A FR 2798518 B1 FR2798518 B1 FR 2798518B1
Authority
FR
France
Prior art keywords
reflection film
laser
manufacturing
optical devices
reflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0011280A
Other languages
English (en)
Other versions
FR2798518A1 (fr
Inventor
Yoshihiro Yoneda
Akira Fukushima
Hajime Shoji
Haruhisa Soda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP20025499A external-priority patent/JP3865186B2/ja
Priority claimed from JP20902099A external-priority patent/JP4497251B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of FR2798518A1 publication Critical patent/FR2798518A1/fr
Application granted granted Critical
Publication of FR2798518B1 publication Critical patent/FR2798518B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0021—Degradation or life time measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0287—Facet reflectivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
FR0011280A 1998-09-08 2000-09-05 Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion Expired - Fee Related FR2798518B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP25433598 1998-09-08
JP7034699 1999-03-16
JP20025499A JP3865186B2 (ja) 1998-09-08 1999-07-14 光半導体モジュール及びその製造方法
JP20902099A JP4497251B2 (ja) 1999-03-16 1999-07-23 半導体レーザの製造方法

Publications (2)

Publication Number Publication Date
FR2798518A1 FR2798518A1 (fr) 2001-03-16
FR2798518B1 true FR2798518B1 (fr) 2005-05-27

Family

ID=27465230

Family Applications (3)

Application Number Title Priority Date Filing Date
FR9911211A Expired - Fee Related FR2783094B1 (fr) 1998-09-08 1999-09-08 Module semiconducteur optique, film de reflexion, dispositifs laser et optique utilisant un film de reflexion et leur procede de fabrication
FR0011281A Expired - Fee Related FR2798519B1 (fr) 1998-09-08 2000-09-05 Dispositif laser utilisant un film de reflexion et son procede de fabrication
FR0011280A Expired - Fee Related FR2798518B1 (fr) 1998-09-08 2000-09-05 Procede de fabrication d'un film de reflexion et dispositifs laser et optique utilisant le film de reflexion

Family Applications Before (2)

Application Number Title Priority Date Filing Date
FR9911211A Expired - Fee Related FR2783094B1 (fr) 1998-09-08 1999-09-08 Module semiconducteur optique, film de reflexion, dispositifs laser et optique utilisant un film de reflexion et leur procede de fabrication
FR0011281A Expired - Fee Related FR2798519B1 (fr) 1998-09-08 2000-09-05 Dispositif laser utilisant un film de reflexion et son procede de fabrication

Country Status (3)

Country Link
US (2) US6448583B1 (fr)
DE (2) DE19964228B4 (fr)
FR (3) FR2783094B1 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2334202A1 (fr) * 1998-06-05 1999-12-09 Herzel Laor Commutation optique pour mecanisme d'entrainement de disques
KR100447673B1 (ko) * 2000-04-27 2004-09-08 가부시키가이샤 도모에가와 세이시쇼 광학접속부품
DE10041079A1 (de) * 2000-08-22 2002-03-14 Osram Opto Semiconductors Gmbh Lasermodul mit Ansteuerschaltung
JP4450965B2 (ja) 2000-09-29 2010-04-14 日本碍子株式会社 光学部品の接着構造
CN1259732C (zh) * 2000-09-29 2006-06-14 欧姆龙株式会社 光学器件及其应用
US6847660B2 (en) * 2000-12-28 2005-01-25 Matsushita Electric Industrial Co., Ltd. Short-wavelength laser module and method of producing the same
FR2819895B1 (fr) 2001-01-19 2003-10-03 Cit Alcatel Dispositif laser a couplage compensateur passif
US6777613B2 (en) * 2001-08-28 2004-08-17 Nihon Dempa Kogyo Co., Ltd Multifunctional crystal unit and method of manufacturing the same
JP3792174B2 (ja) * 2002-05-02 2006-07-05 株式会社巴川製紙所 光学接続部品
JP3802844B2 (ja) * 2002-06-14 2006-07-26 古河電気工業株式会社 光半導体モジュール
JP2004031215A (ja) * 2002-06-27 2004-01-29 Toyota Industries Corp カラー表示デバイス
JP2005243053A (ja) * 2003-03-24 2005-09-08 Ricoh Co Ltd 色素系追記型ｄｖｄ媒体の記録再生方法及び装置
JP4148932B2 (ja) * 2004-08-31 2008-09-10 シャープ株式会社 半導体装置、半導体モジュール及び半導体装置の製造方法
JP4760713B2 (ja) * 2004-10-13 2011-08-31 住友ベークライト株式会社 受光装置
US8409658B2 (en) * 2007-06-27 2013-04-02 Rf Micro Devices, Inc. Conformal shielding process using flush structures
US8053872B1 (en) 2007-06-25 2011-11-08 Rf Micro Devices, Inc. Integrated shield for a no-lead semiconductor device package
US8062930B1 (en) 2005-08-08 2011-11-22 Rf Micro Devices, Inc. Sub-module conformal electromagnetic interference shield
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
JP2008059658A (ja) * 2006-08-30 2008-03-13 Sanyo Electric Co Ltd 光検出器
DE102008025491A1 (de) * 2008-05-28 2009-12-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Leiterplatte
JP5507096B2 (ja) * 2009-03-05 2014-05-28 株式会社フジクラ 歯科用プローブの製造方法
US9137934B2 (en) 2010-08-18 2015-09-15 Rf Micro Devices, Inc. Compartmentalized shielding of selected components
CN102074609B (zh) * 2010-10-13 2012-07-04 清华大学 一种紫外雪崩光电二极管探测器及其制作方法
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
US9293390B2 (en) * 2013-01-11 2016-03-22 Mitsubishi Electric Corporation Heat radiation structure for semiconductor device
US9807890B2 (en) 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
JP6664897B2 (ja) * 2015-07-22 2020-03-13 ルネサスエレクトロニクス株式会社 半導体装置
JP6412042B2 (ja) 2016-03-29 2018-10-24 ファナック株式会社 レーザ発振器
JP6903534B2 (ja) * 2017-09-21 2021-07-14 Ntn株式会社 インホイールモータ駆動装置
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
JP7421840B2 (ja) * 2019-02-08 2024-01-25 古河電気工業株式会社 光モジュール
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules
US11476637B2 (en) * 2019-12-16 2022-10-18 Nichia Corporation Light-emitting device
DE102022106941A1 (de) 2022-03-24 2023-09-28 Ams-Osram International Gmbh Optoelektronisches halbleiterlaserbauelement

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0114258A1 (fr) * 1982-11-30 1984-08-01 Kabushiki Kaisha Toshiba Capsulation en résine de dispositifs photovoltaiques à semi-conducteur
JPS59145588A (ja) * 1983-02-09 1984-08-21 Hitachi Ltd 半導体レ−ザ装置
JPS6090315A (ja) * 1983-10-24 1985-05-21 Dainichi Nippon Cables Ltd 遮水形光フアイバケ−ブル
US4510607A (en) * 1984-01-03 1985-04-09 The United States Of America As Represented By The Secretary Of The Navy Semiconductor laser end-facet coatings for use in solid or liquid environments
JPS60242689A (ja) * 1984-05-16 1985-12-02 Sharp Corp 半導体レ−ザ素子
US4659765A (en) * 1985-02-19 1987-04-21 General Electric Company Elastomeric compositions
JPS6314489A (ja) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp 半導体レ−ザ装置
JPH01214809A (ja) * 1988-02-23 1989-08-29 Sumitomo Electric Ind Ltd 光伝送用フアイバ
JPH0793474B2 (ja) * 1988-03-01 1995-10-09 松下電器産業株式会社 半導体レーザ装置
DE68911420T2 (de) * 1988-08-18 1994-05-11 Seiko Epson Corp Festkörper-Bildaufnahmevorrichtung.
JPH02152285A (ja) 1988-12-02 1990-06-12 Nec Corp 光伝送リンク用内部光素子
US4971927A (en) * 1989-04-25 1990-11-20 International Business Machines Corporation Method of making embedded integrated laser arrays and support circuits
DE4022234A1 (de) * 1990-07-12 1992-01-16 Herberts Gmbh Verfahren zur herstellung von schutz-, hilfs- und isoliermaterialien auf faserbasis, fuer elektrische zwecke und optische leiter unter verwendung von durch energiereiche strahlung haertbaren impraegniermassen
JPH04176180A (ja) * 1990-11-08 1992-06-23 Fuji Electric Co Ltd 半導体レーザ素子のチップ
JPH04207091A (ja) * 1990-11-30 1992-07-29 Toshiba Corp 半導体レーザ装置
DE4130175A1 (de) * 1991-09-11 1993-03-18 Nourney Carl Ernst Prof Dipl I Saiteninstrument wobei die mechanischen schwingungen der saiten in elektromagnetische schwingungen umwandelbar sind
DE4134548A1 (de) * 1991-10-18 1993-04-22 Dsg Schrumpfschlauch Gmbh Abschirmungsueberbrueckung und verfahren zu deren montage
US5228101A (en) * 1992-03-02 1993-07-13 Motorola, Inc. Electrical to optical links using metalization
DE4243874C2 (de) * 1992-12-23 1997-09-18 Fraunhofer Ges Forschung Optische Kopplungsvorrichtung
US5434874A (en) * 1993-10-08 1995-07-18 Hewlett-Packard Company Method and apparatus for optimizing output characteristics of a tunable external cavity laser
US6784511B1 (en) * 1994-01-20 2004-08-31 Fuji Electric Co., Ltd. Resin-sealed laser diode device
JPH0818163A (ja) * 1994-06-24 1996-01-19 Nippon Telegr & Teleph Corp <Ntt> 光装置
JPH08110447A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光半導体モジュ−ル及びその組立て方法
JPH08240739A (ja) 1995-03-03 1996-09-17 Fujikura Ltd 光部品と光部品の接続方法
DE19509793C2 (de) * 1995-03-17 1997-04-30 Audi Ag Zündkerzenstecker
JPH08335744A (ja) * 1995-06-06 1996-12-17 Hitachi Ltd 光半導体モジュール及びその組み立て方法
JP3966429B2 (ja) * 1996-04-18 2007-08-29 山陽石油化学株式会社 芳香族炭化水素製造用触媒
JPH10126000A (ja) * 1996-10-18 1998-05-15 Nippon Telegr & Teleph Corp <Ntt> 光半導体装置モジュール
JP3881074B2 (ja) * 1996-11-21 2007-02-14 株式会社ルネサステクノロジ 半導体レーザモジュール
JP3087676B2 (ja) * 1997-02-13 2000-09-11 日本電気株式会社 ゲル状樹脂を用いた光結合系及び実装構造
EP0864893A3 (fr) * 1997-03-13 1999-09-22 Nippon Telegraph and Telephone Corporation Plate-forme de montage, module optique avec ce module, et procédés de fabrication de la plate-forme et du module
JP3783411B2 (ja) * 1997-08-15 2006-06-07 富士ゼロックス株式会社 表面発光型半導体レーザ
US6137121A (en) * 1997-10-01 2000-10-24 Mitsubishi Denki Kabushiki Kaisha Integrated semiconductor light generating and detecting device

Also Published As

Publication number Publication date
FR2798518A1 (fr) 2001-03-16
DE19942470A1 (de) 2000-05-04
FR2798519A1 (fr) 2001-03-16
US20030020076A1 (en) 2003-01-30
FR2798519B1 (fr) 2005-05-27
FR2783094B1 (fr) 2006-07-28
US6448583B1 (en) 2002-09-10
FR2783094A1 (fr) 2000-03-10
DE19942470B4 (de) 2013-04-11
US6579737B2 (en) 2003-06-17
DE19964228B4 (de) 2008-11-13

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