FR2454182A1 - Procede pour fabriquer des corps semi-conducteurs constitues par du silicium amorphe, au moyen d'une decharge par effluves - Google Patents

Procede pour fabriquer des corps semi-conducteurs constitues par du silicium amorphe, au moyen d'une decharge par effluves

Info

Publication number
FR2454182A1
FR2454182A1 FR8001751A FR8001751A FR2454182A1 FR 2454182 A1 FR2454182 A1 FR 2454182A1 FR 8001751 A FR8001751 A FR 8001751A FR 8001751 A FR8001751 A FR 8001751A FR 2454182 A1 FR2454182 A1 FR 2454182A1
Authority
FR
France
Prior art keywords
discharge
deposit
silicon
manufacturing semiconductor
semiconductor bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8001751A
Other languages
English (en)
French (fr)
Other versions
FR2454182B1 (forum.php
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2454182A1 publication Critical patent/FR2454182A1/fr
Application granted granted Critical
Publication of FR2454182B1 publication Critical patent/FR2454182B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02425—Conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
FR8001751A 1979-02-05 1980-01-28 Procede pour fabriquer des corps semi-conducteurs constitues par du silicium amorphe, au moyen d'une decharge par effluves Granted FR2454182A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792904171 DE2904171A1 (de) 1979-02-05 1979-02-05 Verfahren zum herstellen von aus amorphem silizium bestehenden halbleiterkoerpern durch glimmentladung

Publications (2)

Publication Number Publication Date
FR2454182A1 true FR2454182A1 (fr) 1980-11-07
FR2454182B1 FR2454182B1 (forum.php) 1983-08-05

Family

ID=6062128

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8001751A Granted FR2454182A1 (fr) 1979-02-05 1980-01-28 Procede pour fabriquer des corps semi-conducteurs constitues par du silicium amorphe, au moyen d'une decharge par effluves

Country Status (5)

Country Link
US (1) US4292343A (forum.php)
JP (1) JPS55107228A (forum.php)
DE (1) DE2904171A1 (forum.php)
FR (1) FR2454182A1 (forum.php)
GB (1) GB2043042B (forum.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518318A1 (fr) * 1981-12-14 1983-06-17 Energy Conversion Devices Inc Dispositif photovoltaique a capacite de production de courant plus importante

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730325A (en) * 1980-07-30 1982-02-18 Nec Corp Manufacture of amorphous silicon thin film
DE3208494C2 (de) * 1981-03-09 1993-09-30 Canon Kk Verfahren zur Herstellung eines fotoleitfähigen Elements
US4490208A (en) * 1981-07-08 1984-12-25 Agency Of Industrial Science And Technology Method of producing thin films of silicon
US4401687A (en) * 1981-11-12 1983-08-30 Advanced Semiconductor Materials America Plasma deposition of silicon
DE3206421A1 (de) * 1982-02-23 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von schichten aus hochschmelzenden metallen bzw. metallverbindungen durch abscheidung aus der dampfphase
JPS60200523A (ja) * 1984-03-26 1985-10-11 Agency Of Ind Science & Technol シリコン薄膜の製造法
GB2193976B (en) * 1986-03-19 1990-05-30 Gen Electric Plc Process for depositing a polysilicon film on a substrate
ES2040914T3 (es) * 1988-03-24 1993-11-01 Siemens Aktiengesellschaft Procedimiento y dispositivo para la elaboracion de capas semiconductoras que consisten de aleaciones amorfas de silicio-germanio segun la tecnica de descarga de efluvios, sobre todo para celulas solares.
CA2014540A1 (en) * 1989-04-18 1990-10-18 Mitsui Toatsu Chemicals, Inc. Method for forming semiconductor thin film
EP0800705B1 (en) * 1995-10-20 2000-07-12 Koninklijke Philips Electronics N.V. Manufacture of a semiconductor device with selectively deposited semiconductor zone
WO2000042620A1 (fr) 1999-01-11 2000-07-20 Ebara Corporation Dispositif de reaction a une projection de faisceau electronique
US6613695B2 (en) 2000-11-24 2003-09-02 Asm America, Inc. Surface preparation prior to deposition
US6960537B2 (en) 2001-10-02 2005-11-01 Asm America, Inc. Incorporation of nitrogen into high k dielectric film
TWI233204B (en) * 2002-07-26 2005-05-21 Infineon Technologies Ag Nonvolatile memory element and associated production methods and memory element arrangements
US8557702B2 (en) * 2009-02-02 2013-10-15 Asm America, Inc. Plasma-enhanced atomic layers deposition of conductive material over dielectric layers
US20100294367A1 (en) * 2009-05-19 2010-11-25 Honeywell International Inc. Solar cell with enhanced efficiency
US20110108102A1 (en) * 2009-11-06 2011-05-12 Honeywell International Inc. Solar cell with enhanced efficiency
CN111850471B (zh) * 2019-04-25 2023-05-12 芝浦机械电子装置株式会社 成膜装置以及成膜方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2547692A1 (de) * 1975-10-24 1977-05-05 Siemens Ag Verfahren zum herstellen einer halbleitervorrichtung
FR2345810A1 (fr) * 1976-03-22 1977-10-21 Rca Corp Perfectionnements apportes aux dispositifs photovoltaiques et aux dispositifs redresseurs de courant
US4064521A (en) * 1975-07-28 1977-12-20 Rca Corporation Semiconductor device having a body of amorphous silicon
DE2743141A1 (de) * 1976-09-29 1978-03-30 Rca Corp Amorphes silizium aufweisende bauelemente

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1104935A (en) * 1964-05-08 1968-03-06 Standard Telephones Cables Ltd Improvements in or relating to a method of forming a layer of an inorganic compound
US4004954A (en) * 1976-02-25 1977-01-25 Rca Corporation Method of selective growth of microcrystalline silicon
FR2394173A1 (fr) * 1977-06-06 1979-01-05 Thomson Csf Procede de fabrication de dispositifs electroniques qui comportent une couche mince de silicium amorphe et dispositif electronique obtenu par un tel procede
US4202928A (en) * 1978-07-24 1980-05-13 Rca Corporation Updateable optical storage medium

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064521A (en) * 1975-07-28 1977-12-20 Rca Corporation Semiconductor device having a body of amorphous silicon
DE2547692A1 (de) * 1975-10-24 1977-05-05 Siemens Ag Verfahren zum herstellen einer halbleitervorrichtung
FR2345810A1 (fr) * 1976-03-22 1977-10-21 Rca Corp Perfectionnements apportes aux dispositifs photovoltaiques et aux dispositifs redresseurs de courant
DE2743141A1 (de) * 1976-09-29 1978-03-30 Rca Corp Amorphes silizium aufweisende bauelemente

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/78 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518318A1 (fr) * 1981-12-14 1983-06-17 Energy Conversion Devices Inc Dispositif photovoltaique a capacite de production de courant plus importante

Also Published As

Publication number Publication date
GB2043042B (en) 1983-01-12
DE2904171A1 (de) 1980-08-14
JPS55107228A (en) 1980-08-16
DE2904171C2 (forum.php) 1989-04-06
GB2043042A (en) 1980-10-01
JPH0127570B2 (forum.php) 1989-05-30
US4292343A (en) 1981-09-29
FR2454182B1 (forum.php) 1983-08-05

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Legal Events

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ST Notification of lapse