FR2399126A1 - Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier - Google Patents

Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier

Info

Publication number
FR2399126A1
FR2399126A1 FR7808644A FR7808644A FR2399126A1 FR 2399126 A1 FR2399126 A1 FR 2399126A1 FR 7808644 A FR7808644 A FR 7808644A FR 7808644 A FR7808644 A FR 7808644A FR 2399126 A1 FR2399126 A1 FR 2399126A1
Authority
FR
France
Prior art keywords
region
regions
semiconductor
substrate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7808644A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2399126A1 publication Critical patent/FR2399126A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/30Single-ended push-pull [SEPP] amplifiers; Phase-splitters therefor
    • H03F3/3001Single-ended push-pull [SEPP] amplifiers; Phase-splitters therefor with field-effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

Dispositif semi-conducteur du type IGFET. Ce dispositif comprend un substrat semi-conducteur d'un premier type de conductibilité qui comporte une surface principale, une paire de régions semi-conductrices comprenant des première et seconde régions semi-conductrices d'un second type de conductibilité opposé au premier formées dans le substrat et s'étendant jusqu'à sa surface principale, une troisième région semi-conductrice du second type de conductibilité adjacente à la seconde région, cette troisième région étant également formée dans le substrat et s'étendant également jusqu'à sa surface principale et cela de manière à entourer la seconde région, ladite troisième région ayant une concentration en impureté inférieure à celles des première et seconde régions, une quatrième région semi-conductrice du second type de conductibilité adjacente à la troisième région et formée partiellement dans ladite surface principale entre les troisième et première régions, cette quatrième région ayant une concentration en impureté encore plus faible que celle de la troisième région et une épaisseur inférieure à celles première et seconde régions, une pellicule isolante formée sur la surface principale, y compris la surface du substrat s'étendant entre les quatrième et première régions et une grille formée sur cette pellicule isolante de manière à recouvrir la surface du substrat entre les quatrième et première régions. Application particulière aux amplificateurs acoustiques
FR7808644A 1977-04-15 1978-03-24 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier Withdrawn FR2399126A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4265177A JPS53128281A (en) 1977-04-15 1977-04-15 Insulated gate field effect type semiconductor device for large power

Publications (1)

Publication Number Publication Date
FR2399126A1 true FR2399126A1 (fr) 1979-02-23

Family

ID=12641902

Family Applications (4)

Application Number Title Priority Date Filing Date
FR7808644A Withdrawn FR2399126A1 (fr) 1977-04-15 1978-03-24 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier
FR7832898A Withdrawn FR2396412A1 (fr) 1977-04-15 1978-11-22
FR7832899A Withdrawn FR2400260A1 (fr) 1977-04-15 1978-11-22 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier
FR7832897A Withdrawn FR2400259A1 (fr) 1977-04-15 1978-11-22 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier

Family Applications After (3)

Application Number Title Priority Date Filing Date
FR7832898A Withdrawn FR2396412A1 (fr) 1977-04-15 1978-11-22
FR7832899A Withdrawn FR2400260A1 (fr) 1977-04-15 1978-11-22 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier
FR7832897A Withdrawn FR2400259A1 (fr) 1977-04-15 1978-11-22 Dispositif semi-conducteur a effet de champ du type a grille isolee, montage utilisant ce dispositif et procede de fabrication de ce dernier

Country Status (5)

Country Link
US (1) US4599576A (fr)
JP (1) JPS53128281A (fr)
DE (1) DE2816271C2 (fr)
FR (4) FR2399126A1 (fr)
NL (1) NL7804028A (fr)

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US4735914A (en) * 1979-03-28 1988-04-05 Honeywell Inc. FET for high reverse bias voltage and geometrical design for low on resistance
US5187552A (en) * 1979-03-28 1993-02-16 Hendrickson Thomas E Shielded field-effect transistor devices
FR2460542A1 (fr) * 1979-06-29 1981-01-23 Thomson Csf Transistor a effet de champ vertical de puissance pour hautes frequences et procede de realisation d'un tel transistor
US4394674A (en) * 1979-10-09 1983-07-19 Nippon Electric Co., Ltd. Insulated gate field effect transistor
JPS5950562A (ja) * 1982-09-17 1984-03-23 Toshiba Corp 半導体装置
JPS5998557A (ja) * 1982-11-27 1984-06-06 Nissan Motor Co Ltd Mosトランジスタ
JPS61135149A (ja) * 1984-12-06 1986-06-23 Toshiba Corp Mos型集積回路
DE3786314D1 (de) * 1986-09-23 1993-07-29 Siemens Ag Halbleiterbauelemente mit leistungs-mosfet und steuerschaltung.
US4978628A (en) * 1986-11-19 1990-12-18 Teledyne Industries, Inc. Drail-well/extension high voltage MOS transistor structure and method of fabrication
JPS63262873A (ja) * 1987-04-21 1988-10-31 Fuji Xerox Co Ltd 半導体装置
US4937756A (en) * 1988-01-15 1990-06-26 Industrial Technology Research Institute Gated isolated structure
US4991221A (en) * 1989-04-13 1991-02-05 Rush James M Active speaker system and components therefor
US5234853A (en) * 1990-03-05 1993-08-10 Fujitsu Limited Method of producing a high voltage MOS transistor
US5140392A (en) * 1990-03-05 1992-08-18 Fujitsu Limited High voltage mos transistor and production method thereof, and semiconductor device having high voltage mos transistor and production method thereof
JPH06143574A (ja) * 1992-11-05 1994-05-24 Xerox Corp エンハンスされた相互コンダクタンスを持つパワーmosドライバデバイスを有するサーマルインクジェットプリントヘッド
US5396097A (en) * 1993-11-22 1995-03-07 Motorola Inc Transistor with common base region
US5751015A (en) * 1995-11-17 1998-05-12 Micron Technology, Inc. Semiconductor reliability test chip
JP3287279B2 (ja) * 1997-09-25 2002-06-04 日本電気株式会社 半導体チップ、および該半導体チップが実装された半導体装置
US6642578B1 (en) 2002-07-22 2003-11-04 Anadigics, Inc. Linearity radio frequency switch with low control voltage
US8643055B2 (en) * 2007-09-26 2014-02-04 Stmicroelectronics N.V. Series current limiter device
WO2009042807A2 (fr) 2007-09-26 2009-04-02 Lakota Technologies, Inc. Redresseur à effet de champ ajustable
US8148748B2 (en) * 2007-09-26 2012-04-03 Stmicroelectronics N.V. Adjustable field effect rectifier
US8487547B2 (en) * 2008-04-24 2013-07-16 Cypress Semiconductor Corporation Lighting assembly, circuits and methods
US9179509B2 (en) * 2008-04-24 2015-11-03 Google Inc. Light emitting diode assembly
WO2010080855A2 (fr) * 2009-01-06 2010-07-15 Lakota Technologies Inc. Structures de diode à effet de champ à auto-amorçage et procédés correspondants
US8937797B2 (en) * 2012-03-19 2015-01-20 Allegro Microsystems, Llc Method and apparatus to detect a broken wire condition in an integrated circuit
US9641070B2 (en) 2014-06-11 2017-05-02 Allegro Microsystems, Llc Circuits and techniques for detecting an open pin condition of an integrated circuit
US10001519B2 (en) 2015-06-12 2018-06-19 Allegro Microsystems, Llc Ground reference fault detection in circuits with multiple ground references

Citations (6)

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GB1183150A (en) * 1967-04-17 1970-03-04 Hughes Aircraft Co Field Effect Transistor
US3533158A (en) * 1967-10-30 1970-10-13 Hughes Aircraft Co Method of utilizing an ion beam to form custom circuits
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FR2215676A1 (fr) * 1973-01-29 1974-08-23 Cipel
DE2636214A1 (de) * 1975-09-22 1977-03-31 Ibm Feldeffekttransistor und verfahren zu seiner herstellung
NL7713333A (nl) * 1976-12-01 1978-06-05 Hitachi Ltd Veldeffecttransistor met geisoleerde poort.

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GB1183150A (en) * 1967-04-17 1970-03-04 Hughes Aircraft Co Field Effect Transistor
US3533158A (en) * 1967-10-30 1970-10-13 Hughes Aircraft Co Method of utilizing an ion beam to form custom circuits
GB1214431A (en) * 1968-02-03 1970-12-02 Standard Elektrik Lorenz Ag Method of protecting picture tubes against implosion
FR2215676A1 (fr) * 1973-01-29 1974-08-23 Cipel
DE2636214A1 (de) * 1975-09-22 1977-03-31 Ibm Feldeffekttransistor und verfahren zu seiner herstellung
NL7713333A (nl) * 1976-12-01 1978-06-05 Hitachi Ltd Veldeffecttransistor met geisoleerde poort.
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Also Published As

Publication number Publication date
DE2816271C2 (de) 1984-06-20
FR2400260A1 (fr) 1979-03-09
FR2396412A1 (fr) 1979-01-26
NL7804028A (nl) 1978-10-17
DE2816271A1 (de) 1978-11-02
JPS53128281A (en) 1978-11-09
US4599576A (en) 1986-07-08
FR2400259A1 (fr) 1979-03-09
JPS6159540B2 (fr) 1986-12-17

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