FR2393427A1 - Circuit integre cellulaire et procede hierarchique de realisation - Google Patents

Circuit integre cellulaire et procede hierarchique de realisation

Info

Publication number
FR2393427A1
FR2393427A1 FR7816275A FR7816275A FR2393427A1 FR 2393427 A1 FR2393427 A1 FR 2393427A1 FR 7816275 A FR7816275 A FR 7816275A FR 7816275 A FR7816275 A FR 7816275A FR 2393427 A1 FR2393427 A1 FR 2393427A1
Authority
FR
France
Prior art keywords
realization
hierarchical process
integrated cellular
cellular circuit
basic cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7816275A
Other languages
English (en)
French (fr)
Other versions
FR2393427B1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of FR2393427A1 publication Critical patent/FR2393427A1/fr
Application granted granted Critical
Publication of FR2393427B1 publication Critical patent/FR2393427B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7816275A 1977-05-31 1978-05-31 Circuit integre cellulaire et procede hierarchique de realisation Granted FR2393427A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80190777A 1977-05-31 1977-05-31
US84747877A 1977-11-01 1977-11-01

Publications (2)

Publication Number Publication Date
FR2393427A1 true FR2393427A1 (fr) 1978-12-29
FR2393427B1 FR2393427B1 (de) 1983-09-09

Family

ID=27122394

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7816275A Granted FR2393427A1 (fr) 1977-05-31 1978-05-31 Circuit integre cellulaire et procede hierarchique de realisation

Country Status (6)

Country Link
JP (1) JPS54116186A (de)
CA (1) CA1106980A (de)
DE (1) DE2823555A1 (de)
FR (1) FR2393427A1 (de)
GB (1) GB1604550A (de)
NL (1) NL185431C (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
EP0080361A2 (de) * 1981-11-25 1983-06-01 Mitsubishi Denki Kabushiki Kaisha Komplementaire Metalloxidhalbleiter enthaltende integrierte Schaltungsvorrichtung in Mutterscheibentechnik
EP0295183A2 (de) * 1987-06-08 1988-12-14 Fujitsu Limited Integrierte-Masterslice-Halbleiterschaltung mit einem Meer von Gates

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295149A (en) * 1978-12-29 1981-10-13 International Business Machines Corporation Master image chip organization technique or method
US4377849A (en) * 1980-12-29 1983-03-22 International Business Machines Corporation Macro assembler process for automated circuit design
JPS5832445A (ja) * 1981-08-20 1983-02-25 Nec Corp 集積回路装置及びその製造方法
JPS5857749A (ja) * 1981-10-01 1983-04-06 Seiko Epson Corp 半導体装置
JPS58111347A (ja) * 1981-12-24 1983-07-02 Matsushita Electric Ind Co Ltd 半導体装置
JPH0669142B2 (ja) * 1983-04-15 1994-08-31 株式会社日立製作所 半導体集積回路装置
US4737836A (en) * 1983-12-30 1988-04-12 International Business Machines Corporation VLSI integrated circuit having parallel bonding areas
JPH0758761B2 (ja) * 1983-12-30 1995-06-21 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体集積回路チップ
JP5552775B2 (ja) 2009-08-28 2014-07-16 ソニー株式会社 半導体集積回路
JP7004038B2 (ja) * 2020-07-28 2022-01-21 ソニーグループ株式会社 半導体集積回路

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2227638A1 (de) * 1973-04-30 1974-11-22 Rca Corp
FR2276693A1 (fr) * 1974-06-26 1976-01-23 Ibm Structure de microplaquette de circuits integres et son procede de fabrication
US3983619A (en) * 1968-01-26 1976-10-05 Hitachi, Ltd. Large scale integrated circuit array of unit cells and method of manufacturing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492796B1 (de) * 1969-02-28 1974-01-22
NL176029C (nl) * 1973-02-01 1985-02-01 Philips Nv Geintegreerde logische schakeling met komplementaire transistoren.
JPS50134385A (de) * 1974-04-09 1975-10-24
JPS5314469B2 (de) * 1974-05-17 1978-05-17
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
JPS5816176Y2 (ja) * 1976-07-16 1983-04-01 三洋電機株式会社 大規模集積回路装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983619A (en) * 1968-01-26 1976-10-05 Hitachi, Ltd. Large scale integrated circuit array of unit cells and method of manufacturing same
FR2227638A1 (de) * 1973-04-30 1974-11-22 Rca Corp
FR2276693A1 (fr) * 1974-06-26 1976-01-23 Ibm Structure de microplaquette de circuits integres et son procede de fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/77 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
EP0080361A2 (de) * 1981-11-25 1983-06-01 Mitsubishi Denki Kabushiki Kaisha Komplementaire Metalloxidhalbleiter enthaltende integrierte Schaltungsvorrichtung in Mutterscheibentechnik
EP0080361A3 (en) * 1981-11-25 1985-01-16 Mitsubishi Denki Kabushiki Kaisha Complementary metal-oxide semiconductor integrated circuit device of master slice type
EP0295183A2 (de) * 1987-06-08 1988-12-14 Fujitsu Limited Integrierte-Masterslice-Halbleiterschaltung mit einem Meer von Gates
EP0295183A3 (en) * 1987-06-08 1990-07-11 Fujitsu Limited Master slice type semiconductor integrated circuit having sea of gates

Also Published As

Publication number Publication date
NL7805833A (nl) 1978-12-04
FR2393427B1 (de) 1983-09-09
GB1604550A (en) 1981-12-09
NL185431C (nl) 1990-04-02
DE2823555A1 (de) 1978-12-07
JPS54116186A (en) 1979-09-10
NL185431B (nl) 1989-11-01
CA1106980A (en) 1981-08-11
JPH0113222B2 (de) 1989-03-03

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