JPS54116186A - Integrated circuit and method of fabricating same - Google Patents
Integrated circuit and method of fabricating sameInfo
- Publication number
- JPS54116186A JPS54116186A JP6443478A JP6443478A JPS54116186A JP S54116186 A JPS54116186 A JP S54116186A JP 6443478 A JP6443478 A JP 6443478A JP 6443478 A JP6443478 A JP 6443478A JP S54116186 A JPS54116186 A JP S54116186A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- fabricating same
- fabricating
- same
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11803—Masterslice integrated circuits using field effect technology
- H01L27/11807—CMOS gate arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80190777A | 1977-05-31 | 1977-05-31 | |
US84747877A | 1977-11-01 | 1977-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54116186A true JPS54116186A (en) | 1979-09-10 |
JPH0113222B2 JPH0113222B2 (de) | 1989-03-03 |
Family
ID=27122394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6443478A Granted JPS54116186A (en) | 1977-05-31 | 1978-05-31 | Integrated circuit and method of fabricating same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS54116186A (de) |
CA (1) | CA1106980A (de) |
DE (1) | DE2823555A1 (de) |
FR (1) | FR2393427A1 (de) |
GB (1) | GB1604550A (de) |
NL (1) | NL185431C (de) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5591856A (en) * | 1978-12-29 | 1980-07-11 | Ibm | Semiconductor integrated circuit chip structure |
JPS57114269A (en) * | 1980-12-29 | 1982-07-16 | Ibm | Method of designing multibus circuit |
JPS5832445A (ja) * | 1981-08-20 | 1983-02-25 | Nec Corp | 集積回路装置及びその製造方法 |
JPS5857749A (ja) * | 1981-10-01 | 1983-04-06 | Seiko Epson Corp | 半導体装置 |
JP2020174223A (ja) * | 2020-07-28 | 2020-10-22 | ソニー株式会社 | 半導体集積回路 |
USRE48831E1 (en) | 2009-08-28 | 2021-11-23 | Sony Group Corporation | Semiconductor integrated circuit |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495834A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif a circuits integres de haute densite |
JPS5890758A (ja) * | 1981-11-25 | 1983-05-30 | Mitsubishi Electric Corp | 相補形集積回路装置 |
JPS58111347A (ja) * | 1981-12-24 | 1983-07-02 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JPH0669142B2 (ja) * | 1983-04-15 | 1994-08-31 | 株式会社日立製作所 | 半導体集積回路装置 |
US4737836A (en) * | 1983-12-30 | 1988-04-12 | International Business Machines Corporation | VLSI integrated circuit having parallel bonding areas |
JPH0758761B2 (ja) * | 1983-12-30 | 1995-06-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 半導体集積回路チップ |
KR910005605B1 (en) * | 1987-06-08 | 1991-07-31 | Fujitsu Ltd | Master-slice type semiconductor device imbeded multi gate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50134385A (de) * | 1974-04-09 | 1975-10-24 | ||
JPS5314469U (de) * | 1976-07-16 | 1978-02-06 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3983619A (en) * | 1968-01-26 | 1976-10-05 | Hitachi, Ltd. | Large scale integrated circuit array of unit cells and method of manufacturing same |
JPS492796B1 (de) * | 1969-02-28 | 1974-01-22 | ||
NL176029C (nl) * | 1973-02-01 | 1985-02-01 | Philips Nv | Geintegreerde logische schakeling met komplementaire transistoren. |
GB1440512A (en) * | 1973-04-30 | 1976-06-23 | Rca Corp | Universal array using complementary transistors |
JPS5314469B2 (de) * | 1974-05-17 | 1978-05-17 | ||
US3999214A (en) * | 1974-06-26 | 1976-12-21 | Ibm Corporation | Wireable planar integrated circuit chip structure |
CA1024661A (en) * | 1974-06-26 | 1978-01-17 | International Business Machines Corporation | Wireable planar integrated circuit chip structure |
-
1978
- 1978-05-30 DE DE19782823555 patent/DE2823555A1/de not_active Ceased
- 1978-05-30 GB GB2448578A patent/GB1604550A/en not_active Expired
- 1978-05-30 NL NL7805833A patent/NL185431C/xx not_active IP Right Cessation
- 1978-05-31 CA CA304,470A patent/CA1106980A/en not_active Expired
- 1978-05-31 JP JP6443478A patent/JPS54116186A/ja active Granted
- 1978-05-31 FR FR7816275A patent/FR2393427A1/fr active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50134385A (de) * | 1974-04-09 | 1975-10-24 | ||
JPS5314469U (de) * | 1976-07-16 | 1978-02-06 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5591856A (en) * | 1978-12-29 | 1980-07-11 | Ibm | Semiconductor integrated circuit chip structure |
JPS57114269A (en) * | 1980-12-29 | 1982-07-16 | Ibm | Method of designing multibus circuit |
JPS5832445A (ja) * | 1981-08-20 | 1983-02-25 | Nec Corp | 集積回路装置及びその製造方法 |
JPS5857749A (ja) * | 1981-10-01 | 1983-04-06 | Seiko Epson Corp | 半導体装置 |
USRE48831E1 (en) | 2009-08-28 | 2021-11-23 | Sony Group Corporation | Semiconductor integrated circuit |
JP2020174223A (ja) * | 2020-07-28 | 2020-10-22 | ソニー株式会社 | 半導体集積回路 |
Also Published As
Publication number | Publication date |
---|---|
FR2393427A1 (fr) | 1978-12-29 |
GB1604550A (en) | 1981-12-09 |
FR2393427B1 (de) | 1983-09-09 |
CA1106980A (en) | 1981-08-11 |
DE2823555A1 (de) | 1978-12-07 |
NL7805833A (nl) | 1978-12-04 |
JPH0113222B2 (de) | 1989-03-03 |
NL185431B (nl) | 1989-11-01 |
NL185431C (nl) | 1990-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2963058D1 (en) | Large scale integrated circuit and method of fabricating the same | |
JPS53121493A (en) | Semiconductor and method of producing same | |
JPS5595391A (en) | Printed circuit and method of fabricating same | |
JPS53134378A (en) | Semiconductor and method of forming same | |
JPS5496383A (en) | High performance ic and method of fabricating same | |
JPS5460566A (en) | Chip forming ic and method of fabricating same | |
JPS54145487A (en) | Method of fabricating circuit structure and circuit structure | |
JPS54116186A (en) | Integrated circuit and method of fabricating same | |
GB2000336B (en) | Electronic device and method of fabricating the same | |
JPS5491187A (en) | Semiconductor and method of fabricating same | |
JPS5478678A (en) | Semiconductor and method of producing same | |
JPS566497A (en) | Method of manufacturing integrated circuit | |
JPS5390779A (en) | Semiconductor and method of producing same | |
JPS5578600A (en) | Electronic part series and method of fabricating same | |
JPS5499582A (en) | Semiconductor ic and method of fabricating same | |
JPS5494889A (en) | Method of fabricating ic | |
JPS54126487A (en) | Integrated circuit and method of fabricating same | |
JPS5610917A (en) | Electronic part and method of manufacturing same | |
GB2057760B (en) | Integrated circuit device and method of making the same | |
JPS53100784A (en) | Semiconductor and method of producing same | |
JPS5433523A (en) | Cementtbased structure and method of making same | |
JPS5478985A (en) | Semiconductor and method of producing same | |
JPS5491060A (en) | Method of fabricating ic | |
JPS5483383A (en) | Semiconductor and method of fabricating same | |
JPS5593286A (en) | Electronic circuit and method of fabricating same |