ES2710101T3 - Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada - Google Patents
Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada Download PDFInfo
- Publication number
- ES2710101T3 ES2710101T3 ES10790100T ES10790100T ES2710101T3 ES 2710101 T3 ES2710101 T3 ES 2710101T3 ES 10790100 T ES10790100 T ES 10790100T ES 10790100 T ES10790100 T ES 10790100T ES 2710101 T3 ES2710101 T3 ES 2710101T3
- Authority
- ES
- Spain
- Prior art keywords
- electrode
- layer
- pixel
- pixel circuit
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20184—Detector read-out circuitry, e.g. for clearing of traps, compensating for traps or compensating for direct hits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/208—Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/241—Electrode arrangements, e.g. continuous or parallel strips or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Toxicology (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21353009P | 2009-06-17 | 2009-06-17 | |
| PCT/US2010/038777 WO2010148060A1 (en) | 2009-06-17 | 2010-06-16 | Photodiode and other sensor structures in flat-panel x-ray imagers and method for improving topological uniformity of the photodiode and other sensor structures in flat-panel x-ray imagers based on thin-film electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2710101T3 true ES2710101T3 (es) | 2019-04-23 |
Family
ID=43353461
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10790100T Active ES2710101T3 (es) | 2009-06-17 | 2010-06-16 | Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada |
| ES18197740T Active ES2880357T3 (es) | 2009-06-17 | 2010-06-16 | Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES18197740T Active ES2880357T3 (es) | 2009-06-17 | 2010-06-16 | Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada |
Country Status (9)
| Country | Link |
|---|---|
| US (5) | US8492728B2 (enExample) |
| EP (2) | EP3447802B1 (enExample) |
| JP (1) | JP5744861B2 (enExample) |
| KR (1) | KR101819757B1 (enExample) |
| CN (1) | CN107425020B (enExample) |
| CA (1) | CA2765702A1 (enExample) |
| ES (2) | ES2710101T3 (enExample) |
| TW (2) | TWI615956B (enExample) |
| WO (1) | WO2010148060A1 (enExample) |
Families Citing this family (103)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9741901B2 (en) * | 2006-11-07 | 2017-08-22 | Cbrite Inc. | Two-terminal electronic devices and their methods of fabrication |
| US9991311B2 (en) | 2008-12-02 | 2018-06-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Dual active layer semiconductor device and method of manufacturing the same |
| CA2765702A1 (en) * | 2009-06-17 | 2010-12-23 | The Regents Of The University Of Michigan | Photodiode and other sensor structures in flat-panel x-ray imagers and method for improving topological uniformity of the photodiode and other sensor structures in flat-panel x-ray imagers based on thin-film electronics |
| TWI424574B (zh) * | 2009-07-28 | 2014-01-21 | Prime View Int Co Ltd | 數位x光探測面板及其製作方法 |
| RU2426694C1 (ru) * | 2010-02-15 | 2011-08-20 | Общество С Ограниченной Ответственностью "Сцинтилляционные Технологии Радиационного Контроля" | Неорганический сцинтилляционный материал, кристаллический сцинтиллятор и детектор излучения |
| KR20120076439A (ko) * | 2010-12-29 | 2012-07-09 | 삼성모바일디스플레이주식회사 | 엑스선 검출 장치 |
| KR101257699B1 (ko) * | 2011-02-07 | 2013-04-24 | 삼성전자주식회사 | 방사선 디텍터 및 그 제조방법 |
| US8969779B2 (en) * | 2011-02-11 | 2015-03-03 | Nokia Corporation | Photodetecting structure with photon sensing graphene layer(s) and vertically integrated graphene field effect transistor |
| US20120242621A1 (en) * | 2011-03-24 | 2012-09-27 | Christopher James Brown | Image sensor and display device incorporating the same |
| JP5875420B2 (ja) * | 2011-04-07 | 2016-03-02 | キヤノン株式会社 | 放射線検出素子およびその製造方法 |
| US9347893B2 (en) * | 2011-07-26 | 2016-05-24 | Robert Sigurd Nelson | Enhanced resolution imaging systems for digital radiography |
| CN103718063B (zh) * | 2011-07-28 | 2017-04-26 | 皇家飞利浦有限公司 | 基于铽的探测器闪烁体 |
| CN103296035B (zh) * | 2012-02-29 | 2016-06-08 | 中国科学院微电子研究所 | X射线平板探测器及其制造方法 |
| CN102790068B (zh) | 2012-07-26 | 2014-10-22 | 北京京东方光电科技有限公司 | 一种传感器的制造方法 |
| CN102790069B (zh) * | 2012-07-26 | 2014-09-10 | 北京京东方光电科技有限公司 | 一种传感器及其制造方法 |
| KR101965259B1 (ko) * | 2012-07-27 | 2019-08-08 | 삼성디스플레이 주식회사 | 엑스선 검출기 |
| US8872120B2 (en) * | 2012-08-23 | 2014-10-28 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and method for driving the same |
| WO2014036002A1 (en) * | 2012-08-28 | 2014-03-06 | Northeastern University | Tunable heterojunction for multifunctional electronics and photovoltaics |
| US9214782B2 (en) * | 2012-09-11 | 2015-12-15 | The Board Of Trustees Of The Leland Stanford Junior University | Dielectric laser electron accelerators |
| DE102013217278B4 (de) | 2012-09-12 | 2017-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Photodetektorschaltung, Bildgebungsvorrichtung und Verfahren zum Ansteuern einer Photodetektorschaltung |
| TWI496277B (zh) * | 2012-12-03 | 2015-08-11 | Innocom Tech Shenzhen Co Ltd | X光偵測裝置 |
| BR112015013392A2 (pt) * | 2012-12-12 | 2017-07-11 | Koninklijke Philips Nv | sistema de imagem, e método |
| US9773824B2 (en) * | 2012-12-13 | 2017-09-26 | Cbrite Inc. | Active matrix light emitting diode array and projector display comprising it |
| US9935152B2 (en) | 2012-12-27 | 2018-04-03 | General Electric Company | X-ray detector having improved noise performance |
| KR101919426B1 (ko) * | 2013-01-08 | 2018-11-19 | 삼성전자주식회사 | 그래핀 전자 소자 및 그 제조 방법 |
| RU2532645C1 (ru) | 2013-04-29 | 2014-11-10 | Общество с ограниченной ответственностью "Научно-технический центр "МТ" (ООО "НТЦ-МТ") | Способ формирования структурированного сцинтиллятора на поверхности пикселированного фотоприемника (варианты) и сцинтилляционный детектор, полученнный данным способом (варианты) |
| KR101520433B1 (ko) * | 2013-07-08 | 2015-05-14 | 주식회사 레이언스 | 이미지센서 및 이의 제조방법 |
| TWI587186B (zh) | 2013-07-15 | 2017-06-11 | Ying-Jia Xue | Multi-function display |
| US9360564B2 (en) | 2013-08-30 | 2016-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| US20150078513A1 (en) * | 2013-09-13 | 2015-03-19 | Seung H. Baek | Dental x-ray imaging system having higher spatial resolution |
| TWI535289B (zh) * | 2013-11-22 | 2016-05-21 | 財團法人工業技術研究院 | X光平板感測器之殘留電荷消除方法及裝置 |
| US9917133B2 (en) | 2013-12-12 | 2018-03-13 | General Electric Company | Optoelectronic device with flexible substrate |
| JP6282671B2 (ja) * | 2014-01-15 | 2018-02-21 | シャープ株式会社 | エネルギー線検出装置 |
| WO2017034644A2 (en) | 2015-06-09 | 2017-03-02 | ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY | Method of providing an electronic device and electronic device thereof |
| US10381224B2 (en) | 2014-01-23 | 2019-08-13 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an electronic device and electronic device thereof |
| US20160013243A1 (en) * | 2014-03-10 | 2016-01-14 | Dpix, Llc | Photosensor arrays for detection of radiation and process for the preparation thereof |
| EP3117204B1 (en) | 2014-03-13 | 2021-06-16 | General Electric Company | Curved digital x-ray detector for weld inspection |
| WO2015141777A1 (ja) * | 2014-03-20 | 2015-09-24 | シャープ株式会社 | 光検出装置 |
| EP3143641A4 (en) | 2014-05-13 | 2018-01-17 | Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University | Method of providing an electronic device and electronic device thereof |
| KR102349955B1 (ko) | 2014-08-06 | 2022-01-11 | 삼성전자주식회사 | 다중 검출 모드를 지닌 포토 센서 및 그 동작 방법 |
| US9520437B2 (en) * | 2014-08-14 | 2016-12-13 | Cbrite Inc. | Flexible APS X-ray imager with MOTFT pixel readout and a pin diode sensing element |
| US9515106B2 (en) * | 2014-08-15 | 2016-12-06 | Perkinelmer Holdings, Inc. | Radiation imaging device with metal-insulator-semiconductor photodetector and thin film transistor |
| JP2016062997A (ja) * | 2014-09-16 | 2016-04-25 | ソニー株式会社 | 撮像素子、固体撮像装置及び電子デバイス |
| KR20160048535A (ko) * | 2014-10-24 | 2016-05-04 | 삼성전자주식회사 | 엑스선 디텍터와 그 제조방법과 엑스선 디텍터를 포함하는 시스템과 그 동작방법 |
| US10446582B2 (en) | 2014-12-22 | 2019-10-15 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an imaging system and imaging system thereof |
| EP3038157A1 (en) * | 2014-12-22 | 2016-06-29 | Nokia Technologies OY | Detector structure for electromagnetic radiation sensing |
| US9741742B2 (en) | 2014-12-22 | 2017-08-22 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Deformable electronic device and methods of providing and using deformable electronic device |
| WO2016132242A1 (en) * | 2015-02-17 | 2016-08-25 | Redlen Technologies, Inc. | High-performance radiation detectors and methods of fabricating thereof |
| US10269839B2 (en) * | 2015-03-26 | 2019-04-23 | Carestream Health, Inc. | Apparatus and method using a dual gate TFT structure |
| CN104716152B (zh) * | 2015-04-01 | 2018-09-14 | 京东方科技集团股份有限公司 | X射线平板探测器及其制备方法与白色绝缘材料 |
| CN104810375B (zh) * | 2015-04-28 | 2018-09-04 | 合肥鑫晟光电科技有限公司 | 一种阵列基板及其制作方法和一种显示装置 |
| KR101723438B1 (ko) * | 2015-06-16 | 2017-04-06 | 한국원자력연구원 | 방사선 검출기 및 그 제조 방법 |
| CN105093259B (zh) * | 2015-08-14 | 2018-12-18 | 京东方科技集团股份有限公司 | 射线探测器 |
| US9786856B2 (en) | 2015-08-20 | 2017-10-10 | Dpix, Llc | Method of manufacturing an image sensor device |
| ES2778676T3 (es) | 2015-10-28 | 2020-08-11 | Nokia Technologies Oy | Un aparato y métodos asociados para tomografía computarizada |
| JP6700737B2 (ja) * | 2015-11-20 | 2020-05-27 | キヤノン株式会社 | 放射線撮像システム、信号処理装置、及び、放射線画像の信号処理方法 |
| KR102547798B1 (ko) | 2015-12-08 | 2023-06-26 | 삼성전자주식회사 | 방사선 검출기 및 이를 채용한 방사선 촬영 장치 |
| US11137504B2 (en) * | 2016-02-05 | 2021-10-05 | General Electric Company | Tiled radiation detector |
| EP3206235B1 (en) * | 2016-02-12 | 2021-04-28 | Nokia Technologies Oy | Method of forming an apparatus comprising a two dimensional material |
| CN107134496B (zh) * | 2016-02-29 | 2019-05-31 | 昆山工研院新型平板显示技术中心有限公司 | 薄膜晶体管及其制造方法、显示面板及显示装置 |
| KR102567713B1 (ko) * | 2016-03-24 | 2023-08-17 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 이의 제조 방법 |
| CN105789324B (zh) * | 2016-04-15 | 2019-05-03 | 京东方科技集团股份有限公司 | 传感器及其制造方法、电子设备 |
| WO2017218898A2 (en) | 2016-06-16 | 2017-12-21 | Arizona Board Of Regents On Behalf Of Arizona State University | Electronic devices and related methods |
| US9929215B2 (en) | 2016-07-12 | 2018-03-27 | Dpix, Llc | Method of optimizing an interface for processing of an organic semiconductor |
| US10125312B2 (en) | 2016-09-06 | 2018-11-13 | Ut-Battelle, Llc | Divalent-ion-doped single crystal alkali halide scintillators |
| US9947704B1 (en) * | 2016-10-18 | 2018-04-17 | Cbrite Inc. | Method of recovery of MOTFT backplane after a-Si photodiode fabrication |
| AU2017367615B9 (en) * | 2016-11-30 | 2022-06-16 | The Research Foundation For The State University Of New York | Hybrid active matrix flat panel detector system and method |
| US10366674B1 (en) | 2016-12-27 | 2019-07-30 | Facebook Technologies, Llc | Display calibration in electronic displays |
| CN106684199B (zh) * | 2017-02-13 | 2018-04-03 | 中北大学 | 金属微纳超结构表面等离激元超快探测结构 |
| CN114252902B (zh) * | 2017-04-24 | 2025-10-03 | 睿生光电股份有限公司 | 感测装置 |
| JP7150415B2 (ja) * | 2017-04-27 | 2022-10-11 | コーニンクレッカ フィリップス エヌ ヴェ | 磁気共鳴イメージング誘導放射線治療用の医療機器 |
| CN107219698B (zh) * | 2017-06-13 | 2020-04-03 | 京东方科技集团股份有限公司 | 显示面板和显示装置 |
| KR20200083433A (ko) | 2017-08-03 | 2020-07-08 | 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 | 비대칭 반사 스크린을 갖는 듀얼-스크린 디지털 라디오그래피 |
| CN111247455B (zh) * | 2017-10-30 | 2023-11-10 | 深圳帧观德芯科技有限公司 | 基于载流子雪崩的图像传感器 |
| KR102552845B1 (ko) * | 2017-12-19 | 2023-07-06 | 엘지디스플레이 주식회사 | 엑스레이 영상감지소자 |
| US10797193B2 (en) * | 2018-01-23 | 2020-10-06 | Lumentum Operations Llc | Bias control structure for avalanche photodiodes |
| US10684555B2 (en) * | 2018-03-22 | 2020-06-16 | Applied Materials, Inc. | Spatial light modulator with variable intensity diodes |
| CN110398767B (zh) * | 2018-04-25 | 2020-11-10 | 中国科学院高能物理研究所 | 射线探测电路 |
| CN112020328B (zh) * | 2018-04-26 | 2025-01-07 | 瓦里安医疗系统公司 | 成像设备 |
| US11016202B2 (en) | 2018-04-26 | 2021-05-25 | Varian Medical Systems, Inc. | Imaging devices |
| US10444378B1 (en) * | 2018-04-27 | 2019-10-15 | Varian Medical Systems, Inc. | Imaging devices |
| US10627530B2 (en) * | 2018-05-07 | 2020-04-21 | Ka Imaging Inc. | Method and apparatus for a high resolution, high speed radiation imaging |
| JP2019220685A (ja) * | 2018-06-19 | 2019-12-26 | シャープ株式会社 | 放射線検出器 |
| US10418408B1 (en) * | 2018-06-22 | 2019-09-17 | Omnivision Technologies, Inc. | Curved image sensor using thermal plastic substrate material |
| CN110660816B (zh) | 2018-06-29 | 2022-06-10 | 京东方科技集团股份有限公司 | 一种平板探测器 |
| CN109742178B (zh) * | 2019-01-29 | 2020-07-17 | 西安工业大学 | 一种透红外的高灵敏可见光探测器及其制备方法 |
| CN110031883B (zh) * | 2019-03-05 | 2022-06-07 | 中国辐射防护研究院 | 一种基于无线电容式高电离辐射剂量传感器 |
| WO2020198933A1 (en) * | 2019-03-29 | 2020-10-08 | Shenzhen Xpectvision Technology Co., Ltd. | Radiation detectors with scintillators |
| US10910432B1 (en) * | 2019-07-23 | 2021-02-02 | Cyber Medical Imaging, Inc. | Use of surface patterning for fabricating a single die direct capture dental X-ray imaging sensor |
| US11551777B2 (en) | 2019-08-09 | 2023-01-10 | Micron Technology, Inc. | Apparatus with circuit-locating mechanism |
| US11378701B2 (en) | 2019-10-08 | 2022-07-05 | Redlen Technologies, Inc. | Low dark current radiation detector and method of making the same |
| US11086032B1 (en) | 2020-03-04 | 2021-08-10 | Prismatic Sensors Ab | Edge-on X-ray detector |
| US11733408B2 (en) | 2020-04-28 | 2023-08-22 | Redlen Technologies, Inc. | High-performance radiation detectors and methods of fabricating thereof |
| CN112133717B (zh) * | 2020-09-24 | 2024-03-29 | 京东方科技集团股份有限公司 | 一种探测基板及射线探测器 |
| FR3119708B1 (fr) * | 2021-02-11 | 2023-08-25 | Trixell | Détecteur numérique à étages de conversion superposés |
| EP4068363B1 (en) * | 2021-03-30 | 2023-06-07 | Siemens Healthcare GmbH | Radiation detector with butted absorber tiles without dead areas |
| JP2021101491A (ja) * | 2021-03-31 | 2021-07-08 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
| JP2022167161A (ja) * | 2021-04-22 | 2022-11-04 | シャープディスプレイテクノロジー株式会社 | X線撮像パネル及びその製造方法 |
| CN116034479A (zh) * | 2021-08-25 | 2023-04-28 | 京东方科技集团股份有限公司 | 一种有源像素图像传感器及显示装置 |
| KR20230049787A (ko) | 2021-10-06 | 2023-04-14 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| KR20230149893A (ko) | 2022-04-20 | 2023-10-30 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20240050556A (ko) | 2022-10-11 | 2024-04-19 | 삼성디스플레이 주식회사 | 표시장치 |
| CN119894054B (zh) * | 2024-12-25 | 2025-12-19 | 北京大学深圳研究生院 | 一种金属氧化物薄膜晶体管及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045057A (ja) * | 1983-08-23 | 1985-03-11 | Toshiba Corp | 固体撮像装置の製造方法 |
| US5262649A (en) * | 1989-09-06 | 1993-11-16 | The Regents Of The University Of Michigan | Thin-film, flat panel, pixelated detector array for real-time digital imaging and dosimetry of ionizing radiation |
| CA2065246C (en) * | 1989-09-06 | 2001-11-13 | Larry E. Antonuk | Multi-element-amorphous-silicon-detector-array for real-time imaging and dosimetry of megavoltage photons and diagnostic x-rays |
| CA2034118A1 (en) * | 1990-02-09 | 1991-08-10 | Nang Tri Tran | Solid state radiation detector |
| US5057892A (en) * | 1990-09-14 | 1991-10-15 | Xsirius Photonics, Inc. | Light responsive avalanche diode |
| EP0546779A1 (en) * | 1991-12-13 | 1993-06-16 | Shimadzu Corporation | Oxynitride glass fiber for composite products, and glass fiber-reinforced products |
| JPH06314779A (ja) * | 1993-04-28 | 1994-11-08 | Nec Corp | イメージセンサ |
| JPH08250698A (ja) * | 1995-03-14 | 1996-09-27 | Toshiba Corp | 固体撮像装置 |
| JP3957803B2 (ja) | 1996-02-22 | 2007-08-15 | キヤノン株式会社 | 光電変換装置 |
| JPH1093062A (ja) * | 1996-09-11 | 1998-04-10 | Toshiba Corp | 光検出器 |
| JP4294745B2 (ja) * | 1997-09-26 | 2009-07-15 | 株式会社半導体エネルギー研究所 | 光電変換装置の作製方法 |
| JP3838806B2 (ja) * | 1999-03-26 | 2006-10-25 | 株式会社東芝 | 信号増倍x線撮像装置 |
| JP3984808B2 (ja) * | 2000-09-07 | 2007-10-03 | キヤノン株式会社 | 信号処理装置及びそれを用いた撮像装置並びに放射線撮像システム |
| US6891194B2 (en) * | 2001-02-07 | 2005-05-10 | Sharp Kabushiki Kaisha | Active matrix substrate, electromagnetic detector, and liquid crystal display apparatus |
| US6730914B2 (en) * | 2002-02-05 | 2004-05-04 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing equal-potential pixel electrodes |
| JP4147094B2 (ja) * | 2002-11-22 | 2008-09-10 | キヤノン株式会社 | 放射線撮像装置及び放射線撮像システム |
| JP3621400B2 (ja) | 2003-03-03 | 2005-02-16 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
| US7279353B2 (en) * | 2003-04-02 | 2007-10-09 | Micron Technology, Inc. | Passivation planarization |
| JP4683836B2 (ja) * | 2003-12-12 | 2011-05-18 | 株式会社神戸製鋼所 | ダイヤモンド半導体素子及びその製造方法 |
| JP2006156555A (ja) * | 2004-11-26 | 2006-06-15 | Toshiba Corp | X線平面検出器 |
| JP2006017742A (ja) * | 2005-08-24 | 2006-01-19 | Canon Inc | 放射線検出装置 |
| JP4498283B2 (ja) | 2006-01-30 | 2010-07-07 | キヤノン株式会社 | 撮像装置、放射線撮像装置及びこれらの製造方法 |
| JP5109686B2 (ja) * | 2007-06-22 | 2012-12-26 | セイコーエプソン株式会社 | 検出装置及び電子機器 |
| JP2009010075A (ja) * | 2007-06-27 | 2009-01-15 | Fujifilm Corp | 放射線画像検出器 |
| JP2009038123A (ja) * | 2007-07-31 | 2009-02-19 | Fujifilm Corp | 画像検出装置 |
| JP2009047577A (ja) * | 2007-08-21 | 2009-03-05 | Konica Minolta Medical & Graphic Inc | シンチレータパネル及びその作製方法 |
| JP5489423B2 (ja) * | 2007-09-21 | 2014-05-14 | 富士フイルム株式会社 | 放射線撮像素子 |
| JP2010186723A (ja) | 2009-02-13 | 2010-08-26 | Fujifilm Corp | 有機el装置及びその製造方法 |
| CA2765702A1 (en) | 2009-06-17 | 2010-12-23 | The Regents Of The University Of Michigan | Photodiode and other sensor structures in flat-panel x-ray imagers and method for improving topological uniformity of the photodiode and other sensor structures in flat-panel x-ray imagers based on thin-film electronics |
-
2010
- 2010-06-16 CA CA2765702A patent/CA2765702A1/en not_active Abandoned
- 2010-06-16 ES ES10790100T patent/ES2710101T3/es active Active
- 2010-06-16 EP EP18197740.6A patent/EP3447802B1/en active Active
- 2010-06-16 EP EP10790100.1A patent/EP2443656B1/en active Active
- 2010-06-16 CN CN201610942592.8A patent/CN107425020B/zh active Active
- 2010-06-16 ES ES18197740T patent/ES2880357T3/es active Active
- 2010-06-16 KR KR1020127001362A patent/KR101819757B1/ko active Active
- 2010-06-16 WO PCT/US2010/038777 patent/WO2010148060A1/en not_active Ceased
- 2010-06-16 JP JP2012516229A patent/JP5744861B2/ja active Active
- 2010-06-17 US US12/817,634 patent/US8492728B2/en active Active
- 2010-06-17 TW TW104135939A patent/TWI615956B/zh active
- 2010-06-17 TW TW099119799A patent/TWI520315B/zh active
-
2013
- 2013-07-01 US US13/932,519 patent/US8754379B2/en active Active
-
2014
- 2014-05-12 US US14/275,476 patent/US20140246596A1/en not_active Abandoned
-
2015
- 2015-04-16 US US14/477,960 patent/US9395453B2/en active Active
-
2016
- 2016-07-18 US US15/213,390 patent/US9880296B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3447802A1 (en) | 2019-02-27 |
| US8492728B2 (en) | 2013-07-23 |
| WO2010148060A1 (en) | 2010-12-23 |
| KR101819757B1 (ko) | 2018-01-17 |
| JP2012531046A (ja) | 2012-12-06 |
| EP2443656B1 (en) | 2018-11-07 |
| CA2765702A1 (en) | 2010-12-23 |
| EP3447802B1 (en) | 2021-04-21 |
| US8754379B2 (en) | 2014-06-17 |
| US9880296B2 (en) | 2018-01-30 |
| CN102576715A (zh) | 2012-07-11 |
| US20130292573A1 (en) | 2013-11-07 |
| JP5744861B2 (ja) | 2015-07-08 |
| CN107425020A (zh) | 2017-12-01 |
| US20100320391A1 (en) | 2010-12-23 |
| US9395453B2 (en) | 2016-07-19 |
| KR20120027541A (ko) | 2012-03-21 |
| US20140246596A1 (en) | 2014-09-04 |
| TWI615956B (zh) | 2018-02-21 |
| CN107425020B (zh) | 2019-10-18 |
| TWI520315B (zh) | 2016-02-01 |
| TW201119021A (en) | 2011-06-01 |
| EP2443656A4 (en) | 2013-11-20 |
| US20150301195A1 (en) | 2015-10-22 |
| TW201605034A (zh) | 2016-02-01 |
| ES2880357T3 (es) | 2021-11-24 |
| EP2443656A1 (en) | 2012-04-25 |
| US20170045629A1 (en) | 2017-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2710101T3 (es) | Fotodiodo y otras estructuras de sensores en generadores de imágenes de rayos X de panel plano y método para mejorar la uniformidad topológica del fotodiodo y otras estructuras de sensores en impresoras de rayos X de panel plano basadas en electrónica de película delgada | |
| CN102593164B (zh) | 放射线摄像装置、放射线摄像显示系统以及晶体管 | |
| JP5489542B2 (ja) | 放射線検出装置及び放射線撮像システム | |
| US9190437B2 (en) | Semiconductor detection apparatus capable of switching capacitance among different levels, and detection system including the apparatus | |
| US20130234219A1 (en) | Radioactive-ray imaging apparatus, radioactive-ray imaging display system and transistor | |
| US9698193B1 (en) | Multi-sensor pixel architecture for use in a digital imaging system | |
| EP3507621B1 (en) | Radiation detector and fabricating method thereof | |
| US20100051820A1 (en) | X-ray detecting element | |
| US11504079B2 (en) | Hybrid active matrix flat panel detector system and method | |
| JP2005114731A (ja) | 後方照射を有する半導体放射線撮像装置 | |
| CA3062873A1 (en) | Apparatus for radiation detection in a digital imaging system | |
| CN113330567B (zh) | 一种探测基板、其制作方法及平板探测器 | |
| CN112673286B (zh) | 双传感器子像素辐射探测器 | |
| JP6218760B2 (ja) | 光電変換素子及び撮像装置 | |
| CN102576715B (zh) | 平板x射线成像器中的光电二极管和其他传感器结构以及用于基于薄膜电子器件来改进平板x射线成像器中的光电二极管和其他传感器结构的拓扑均匀性的方法 | |
| US20250113632A1 (en) | Detector substrate and flat panel detector | |
| WO2013180078A1 (ja) | 放射線画撮影装置、放射線画像撮影システム、放射線画撮影方法、及び放射線画撮影プログラム | |
| BR102017019729B1 (pt) | Elemento detector para um sistema de imageamento digital |