ES2548415T3 - Procedimiento para formar una imagen conductora sobre una superficie no conductora - Google Patents

Procedimiento para formar una imagen conductora sobre una superficie no conductora Download PDF

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Publication number
ES2548415T3
ES2548415T3 ES12790696.4T ES12790696T ES2548415T3 ES 2548415 T3 ES2548415 T3 ES 2548415T3 ES 12790696 T ES12790696 T ES 12790696T ES 2548415 T3 ES2548415 T3 ES 2548415T3
Authority
ES
Spain
Prior art keywords
coordination complex
metal
metal coordination
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12790696.4T
Other languages
English (en)
Spanish (es)
Inventor
William Wismann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EARTHONE CIRCUIT TECHNOLOGIES CORP
Original Assignee
EARTHONE CIRCUIT TECHNOLOGIES CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EARTHONE CIRCUIT TECHNOLOGIES CORP filed Critical EARTHONE CIRCUIT TECHNOLOGIES CORP
Application granted granted Critical
Publication of ES2548415T3 publication Critical patent/ES2548415T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1673—Magnetic field
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
ES12790696.4T 2011-08-19 2012-08-16 Procedimiento para formar una imagen conductora sobre una superficie no conductora Active ES2548415T3 (es)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201161525662P 2011-08-19 2011-08-19
US201161525662P 2011-08-19
US201161568736P 2011-12-09 2011-12-09
US201161568736P 2011-12-09
US13/403,797 US8784952B2 (en) 2011-08-19 2012-02-23 Method of forming a conductive image on a non-conductive surface
US201213403797 2012-02-23
PCT/US2012/051193 WO2013028473A1 (en) 2011-08-19 2012-08-16 Method of forming a conductive image on a non-conductive surface

Publications (1)

Publication Number Publication Date
ES2548415T3 true ES2548415T3 (es) 2015-10-16

Family

ID=47711823

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12790696.4T Active ES2548415T3 (es) 2011-08-19 2012-08-16 Procedimiento para formar una imagen conductora sobre una superficie no conductora

Country Status (24)

Country Link
US (3) US8784952B2 (enExample)
EP (1) EP2745658B1 (enExample)
JP (2) JP2014525992A (enExample)
CN (1) CN104025724B (enExample)
AU (2) AU2012299226A1 (enExample)
BR (1) BR112014003893A2 (enExample)
CA (1) CA2845822A1 (enExample)
CY (1) CY1117130T1 (enExample)
DK (1) DK2745658T3 (enExample)
EA (1) EA027161B1 (enExample)
ES (1) ES2548415T3 (enExample)
HR (1) HRP20151016T1 (enExample)
HU (1) HUE028044T2 (enExample)
IL (1) IL231045A0 (enExample)
MX (2) MX346900B (enExample)
MY (1) MY185302A (enExample)
PH (1) PH12014500400A1 (enExample)
PL (1) PL2745658T4 (enExample)
PT (1) PT2745658E (enExample)
RS (1) RS54497B1 (enExample)
SG (2) SG10201504593RA (enExample)
SI (1) SI2745658T1 (enExample)
SM (1) SMT201500269B (enExample)
WO (1) WO2013028473A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3017083A4 (en) * 2013-08-06 2017-01-04 Earthone Circuit Technologies Corporation Forming a conductive image using high speed electroless platin
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9380700B2 (en) 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
KR101698160B1 (ko) * 2014-09-17 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
US10677837B2 (en) 2016-06-01 2020-06-09 Kyzen Corporation System and method for electrical circuit monitoring
CN105451456A (zh) * 2015-12-08 2016-03-30 昆山联滔电子有限公司 非导电基材的导体线路的制造方法
GB201600214D0 (en) * 2016-01-06 2016-02-17 Univ Coventry Material deposition in a magnetic field
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

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JPS5917223A (ja) * 1982-07-20 1984-01-28 Nec Corp 磁気記録媒体の製造方法
JPS5917225A (ja) * 1982-07-20 1984-01-28 Nec Corp 磁気記録媒体の製造方法
JPS6147695A (ja) * 1984-08-15 1986-03-08 株式会社日立製作所 部分めつき，エツチング方法
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
US5506091A (en) * 1990-04-20 1996-04-09 Nisshinbo Industries, Inc. Photosensitive resin composition and method of forming conductive pattern
RU2039128C1 (ru) * 1990-07-30 1995-07-09 Институт общей и неорганической химии АН Украины Способ химического никелирования
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JP2002532620A (ja) * 1998-12-10 2002-10-02 ナウンドルフ・ゲルハルト 印刷導体構造物の製造方法
JP2001089673A (ja) * 1999-09-27 2001-04-03 Hideo Kakigi 高分子成形物およびその製造方法
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KR101038494B1 (ko) * 2004-12-28 2011-06-01 삼성테크윈 주식회사 Ｒｆｉｄ 태그용 안테나 제조 방법
US7867570B2 (en) * 2006-10-26 2011-01-11 Basf Coatings Gmbh Method of producing a coating having metal coordinating and film-forming materials
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JP5448524B2 (ja) * 2008-04-23 2014-03-19 富士フイルム株式会社 めっき用積層フィルム、表面金属膜材料の作製方法及び表面金属膜材料
US20090269510A1 (en) * 2008-04-25 2009-10-29 Daniel Lieberman Printed electronics by metal plating through uv light
KR20100009752A (ko) * 2008-07-21 2010-01-29 삼성전자주식회사 자기장을 이용한 무전해 도금 장치 및 방법
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Also Published As

Publication number Publication date
PL2745658T3 (pl) 2016-02-29
NZ716340A (en) 2016-10-28
PL2745658T4 (pl) 2016-03-31
SG11201400069VA (en) 2014-04-28
PH12014500400A1 (en) 2014-04-14
NZ622408A (en) 2016-03-31
EP2745658A1 (en) 2014-06-25
MX346900B (es) 2017-04-04
US20140357081A1 (en) 2014-12-04
US20130043603A1 (en) 2013-02-21
MY185302A (en) 2021-04-30
AU2017200890A1 (en) 2017-03-02
HRP20151016T1 (hr) 2015-12-04
EP2745658B1 (en) 2015-06-24
BR112014003893A2 (pt) 2017-03-14
US8784953B2 (en) 2014-07-22
RS54497B1 (sr) 2016-06-30
CA2845822A1 (en) 2013-02-28
EA201490479A1 (ru) 2014-07-30
SI2745658T1 (sl) 2015-12-31
JP2014525992A (ja) 2014-10-02
DK2745658T3 (en) 2015-10-12
SMT201500269B (it) 2016-01-08
CN104025724B (zh) 2017-09-26
SG10201504593RA (en) 2015-07-30
MX2014001980A (es) 2014-05-14
WO2013028473A1 (en) 2013-02-28
CN104025724A (zh) 2014-09-03
PT2745658E (pt) 2015-10-27
US8784952B2 (en) 2014-07-22
CY1117130T1 (el) 2017-04-05
HUE028044T2 (en) 2016-11-28
AU2012299226A1 (en) 2014-04-03
JP2016196708A (ja) 2016-11-24
EA027161B1 (ru) 2017-06-30
US20130043062A1 (en) 2013-02-21
IL231045A0 (en) 2014-03-31

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