PT2745658E - Método para a formação de uma imagem condutora sobre uma superfície não condutora - Google Patents
Método para a formação de uma imagem condutora sobre uma superfície não condutora Download PDFInfo
- Publication number
- PT2745658E PT2745658E PT127906964T PT12790696T PT2745658E PT 2745658 E PT2745658 E PT 2745658E PT 127906964 T PT127906964 T PT 127906964T PT 12790696 T PT12790696 T PT 12790696T PT 2745658 E PT2745658 E PT 2745658E
- Authority
- PT
- Portugal
- Prior art keywords
- conductive
- formation
- image
- conductive surface
- conductive image
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
- H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1673—Magnetic field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Electrodes Of Semiconductors (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161525662P | 2011-08-19 | 2011-08-19 | |
| US201161568736P | 2011-12-09 | 2011-12-09 | |
| US13/403,797 US8784952B2 (en) | 2011-08-19 | 2012-02-23 | Method of forming a conductive image on a non-conductive surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT2745658E true PT2745658E (pt) | 2015-10-27 |
Family
ID=47711823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT127906964T PT2745658E (pt) | 2011-08-19 | 2012-08-16 | Método para a formação de uma imagem condutora sobre uma superfície não condutora |
Country Status (24)
| Country | Link |
|---|---|
| US (3) | US8784952B2 (enExample) |
| EP (1) | EP2745658B1 (enExample) |
| JP (2) | JP2014525992A (enExample) |
| CN (1) | CN104025724B (enExample) |
| AU (2) | AU2012299226A1 (enExample) |
| BR (1) | BR112014003893A2 (enExample) |
| CA (1) | CA2845822A1 (enExample) |
| CY (1) | CY1117130T1 (enExample) |
| DK (1) | DK2745658T3 (enExample) |
| EA (1) | EA027161B1 (enExample) |
| ES (1) | ES2548415T3 (enExample) |
| HR (1) | HRP20151016T1 (enExample) |
| HU (1) | HUE028044T2 (enExample) |
| IL (1) | IL231045A0 (enExample) |
| MX (2) | MX346900B (enExample) |
| MY (1) | MY185302A (enExample) |
| PH (1) | PH12014500400A1 (enExample) |
| PL (1) | PL2745658T4 (enExample) |
| PT (1) | PT2745658E (enExample) |
| RS (1) | RS54497B1 (enExample) |
| SG (2) | SG10201504593RA (enExample) |
| SI (1) | SI2745658T1 (enExample) |
| SM (1) | SMT201500269B (enExample) |
| WO (1) | WO2013028473A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3017083A4 (en) * | 2013-08-06 | 2017-01-04 | Earthone Circuit Technologies Corporation | Forming a conductive image using high speed electroless platin |
| US9398703B2 (en) | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
| US9380700B2 (en) | 2014-05-19 | 2016-06-28 | Sierra Circuits, Inc. | Method for forming traces of a printed circuit board |
| US9706667B2 (en) | 2014-05-19 | 2017-07-11 | Sierra Circuits, Inc. | Via in a printed circuit board |
| KR101698160B1 (ko) * | 2014-09-17 | 2017-01-19 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 |
| US10677837B2 (en) | 2016-06-01 | 2020-06-09 | Kyzen Corporation | System and method for electrical circuit monitoring |
| CN105451456A (zh) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | 非导电基材的导体线路的制造方法 |
| GB201600214D0 (en) * | 2016-01-06 | 2016-02-17 | Univ Coventry | Material deposition in a magnetic field |
| US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
| US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
| US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
| US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930784A1 (de) * | 1979-07-28 | 1981-02-12 | Licentia Gmbh | Verfahren zur aktivierung von kunststoffoberflaechen |
| JPS5917223A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | 磁気記録媒体の製造方法 |
| JPS5917225A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | 磁気記録媒体の製造方法 |
| JPS6147695A (ja) * | 1984-08-15 | 1986-03-08 | 株式会社日立製作所 | 部分めつき，エツチング方法 |
| US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
| US5506091A (en) * | 1990-04-20 | 1996-04-09 | Nisshinbo Industries, Inc. | Photosensitive resin composition and method of forming conductive pattern |
| RU2039128C1 (ru) * | 1990-07-30 | 1995-07-09 | Институт общей и неорганической химии АН Украины | Способ химического никелирования |
| US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
| JP3916023B2 (ja) * | 1998-06-26 | 2007-05-16 | 株式会社エフオーアイ | 鍍金システム |
| JP2002532620A (ja) * | 1998-12-10 | 2002-10-02 | ナウンドルフ・ゲルハルト | 印刷導体構造物の製造方法 |
| JP2001089673A (ja) * | 1999-09-27 | 2001-04-03 | Hideo Kakigi | 高分子成形物およびその製造方法 |
| US7622024B1 (en) * | 2000-05-10 | 2009-11-24 | Novellus Systems, Inc. | High resistance ionic current source |
| US20050018595A1 (en) * | 2001-06-06 | 2005-01-27 | Spectra Systems Corporation | System for applying markings to optical media |
| US6838352B1 (en) * | 2002-07-05 | 2005-01-04 | Newport Fab, Llc. | Damascene trench capacitor for mixed-signal/RF IC applications |
| DE10255520B4 (de) * | 2002-11-28 | 2007-12-27 | Infineon Technologies Ag | Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung |
| KR101038494B1 (ko) * | 2004-12-28 | 2011-06-01 | 삼성테크윈 주식회사 | Ｒｆｉｄ 태그용 안테나 제조 방법 |
| US7867570B2 (en) * | 2006-10-26 | 2011-01-11 | Basf Coatings Gmbh | Method of producing a coating having metal coordinating and film-forming materials |
| US20080116077A1 (en) * | 2006-11-21 | 2008-05-22 | M/A-Com, Inc. | System and method for solder bump plating |
| JP5448524B2 (ja) * | 2008-04-23 | 2014-03-19 | 富士フイルム株式会社 | めっき用積層フィルム、表面金属膜材料の作製方法及び表面金属膜材料 |
| US20090269510A1 (en) * | 2008-04-25 | 2009-10-29 | Daniel Lieberman | Printed electronics by metal plating through uv light |
| KR20100009752A (ko) * | 2008-07-21 | 2010-01-29 | 삼성전자주식회사 | 자기장을 이용한 무전해 도금 장치 및 방법 |
| JP2010106316A (ja) * | 2008-10-30 | 2010-05-13 | Du Pont Toray Co Ltd | 導電性繊維の製造方法 |
| JP2011124523A (ja) * | 2010-02-02 | 2011-06-23 | Napura:Kk | 電子デバイス用基板、電子デバイス用積層体、電子デバイス及びそれらの製造方法 |
-
2012
- 2012-02-23 US US13/403,797 patent/US8784952B2/en active Active - Reinstated
- 2012-08-16 HU HUE12790696A patent/HUE028044T2/en unknown
- 2012-08-16 BR BR112014003893A patent/BR112014003893A2/pt not_active Application Discontinuation
- 2012-08-16 PH PH1/2014/500400A patent/PH12014500400A1/en unknown
- 2012-08-16 JP JP2014527191A patent/JP2014525992A/ja active Pending
- 2012-08-16 HR HRP20151016TT patent/HRP20151016T1/hr unknown
- 2012-08-16 MX MX2015007418A patent/MX346900B/es unknown
- 2012-08-16 AU AU2012299226A patent/AU2012299226A1/en not_active Abandoned
- 2012-08-16 WO PCT/US2012/051193 patent/WO2013028473A1/en not_active Ceased
- 2012-08-16 RS RS20150869A patent/RS54497B1/sr unknown
- 2012-08-16 MY MYPI2014000437A patent/MY185302A/en unknown
- 2012-08-16 SI SI201230313T patent/SI2745658T1/sl unknown
- 2012-08-16 MX MX2014001980A patent/MX2014001980A/es active IP Right Grant
- 2012-08-16 PT PT127906964T patent/PT2745658E/pt unknown
- 2012-08-16 SG SG10201504593RA patent/SG10201504593RA/en unknown
- 2012-08-16 US US13/587,785 patent/US8784953B2/en active Active - Reinstated
- 2012-08-16 SG SG11201400069VA patent/SG11201400069VA/en unknown
- 2012-08-16 DK DK12790696.4T patent/DK2745658T3/en active
- 2012-08-16 CA CA2845822A patent/CA2845822A1/en not_active Abandoned
- 2012-08-16 PL PL12790696T patent/PL2745658T4/pl unknown
- 2012-08-16 EA EA201490479A patent/EA027161B1/ru not_active IP Right Cessation
- 2012-08-16 CN CN201280051161.2A patent/CN104025724B/zh not_active Expired - Fee Related
- 2012-08-16 EP EP12790696.4A patent/EP2745658B1/en active Active
- 2012-08-16 ES ES12790696.4T patent/ES2548415T3/es active Active
-
2014
- 2014-02-19 IL IL231045A patent/IL231045A0/en unknown
- 2014-06-13 US US14/304,609 patent/US20140357081A1/en not_active Abandoned
-
2015
- 2015-09-24 CY CY20151100810T patent/CY1117130T1/el unknown
- 2015-10-29 SM SM201500269T patent/SMT201500269B/it unknown
-
2016
- 2016-08-12 JP JP2016158458A patent/JP2016196708A/ja active Pending
-
2017
- 2017-02-09 AU AU2017200890A patent/AU2017200890A1/en not_active Abandoned
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