EA027161B1 - Способ формирования проводящего слоя на поверхности непроводящей подложки - Google Patents

Способ формирования проводящего слоя на поверхности непроводящей подложки Download PDF

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Publication number
EA027161B1
EA027161B1 EA201490479A EA201490479A EA027161B1 EA 027161 B1 EA027161 B1 EA 027161B1 EA 201490479 A EA201490479 A EA 201490479A EA 201490479 A EA201490479 A EA 201490479A EA 027161 B1 EA027161 B1 EA 027161B1
Authority
EA
Eurasian Patent Office
Prior art keywords
metal
etching
deposited
substrate
complex
Prior art date
Application number
EA201490479A
Other languages
English (en)
Russian (ru)
Other versions
EA201490479A1 (ru
Inventor
Уилльям Уисманн
Original Assignee
Эртван Серкит Текнолоджиз Корпорейшн
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Эртван Серкит Текнолоджиз Корпорейшн filed Critical Эртван Серкит Текнолоджиз Корпорейшн
Publication of EA201490479A1 publication Critical patent/EA201490479A1/ru
Publication of EA027161B1 publication Critical patent/EA027161B1/ru

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1673—Magnetic field
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
EA201490479A 2011-08-19 2012-08-16 Способ формирования проводящего слоя на поверхности непроводящей подложки EA027161B1 (ru)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161525662P 2011-08-19 2011-08-19
US201161568736P 2011-12-09 2011-12-09
US13/403,797 US8784952B2 (en) 2011-08-19 2012-02-23 Method of forming a conductive image on a non-conductive surface
PCT/US2012/051193 WO2013028473A1 (en) 2011-08-19 2012-08-16 Method of forming a conductive image on a non-conductive surface

Publications (2)

Publication Number Publication Date
EA201490479A1 EA201490479A1 (ru) 2014-07-30
EA027161B1 true EA027161B1 (ru) 2017-06-30

Family

ID=47711823

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201490479A EA027161B1 (ru) 2011-08-19 2012-08-16 Способ формирования проводящего слоя на поверхности непроводящей подложки

Country Status (24)

Country Link
US (3) US8784952B2 (enExample)
EP (1) EP2745658B1 (enExample)
JP (2) JP2014525992A (enExample)
CN (1) CN104025724B (enExample)
AU (2) AU2012299226A1 (enExample)
BR (1) BR112014003893A2 (enExample)
CA (1) CA2845822A1 (enExample)
CY (1) CY1117130T1 (enExample)
DK (1) DK2745658T3 (enExample)
EA (1) EA027161B1 (enExample)
ES (1) ES2548415T3 (enExample)
HR (1) HRP20151016T1 (enExample)
HU (1) HUE028044T2 (enExample)
IL (1) IL231045A0 (enExample)
MX (2) MX346900B (enExample)
MY (1) MY185302A (enExample)
PH (1) PH12014500400A1 (enExample)
PL (1) PL2745658T4 (enExample)
PT (1) PT2745658E (enExample)
RS (1) RS54497B1 (enExample)
SG (2) SG10201504593RA (enExample)
SI (1) SI2745658T1 (enExample)
SM (1) SMT201500269B (enExample)
WO (1) WO2013028473A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3017083A4 (en) * 2013-08-06 2017-01-04 Earthone Circuit Technologies Corporation Forming a conductive image using high speed electroless platin
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9380700B2 (en) 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
KR101698160B1 (ko) * 2014-09-17 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
US10677837B2 (en) 2016-06-01 2020-06-09 Kyzen Corporation System and method for electrical circuit monitoring
CN105451456A (zh) * 2015-12-08 2016-03-30 昆山联滔电子有限公司 非导电基材的导体线路的制造方法
GB201600214D0 (en) * 2016-01-06 2016-02-17 Univ Coventry Material deposition in a magnetic field
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Citations (4)

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Publication number Priority date Publication date Assignee Title
WO2000035259A2 (de) * 1998-12-10 2000-06-15 Gerhard Naundorf Verfahren zur herstellung von leiterbahnstrukturen
DE10255520A1 (de) * 2002-11-28 2004-06-17 Infineon Technologies Ag Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung
US20060143898A1 (en) * 2004-12-28 2006-07-06 Samsung Techwin Co., Ltd. Method of manufacturing antenna for RFID tag
US20090269510A1 (en) * 2008-04-25 2009-10-29 Daniel Lieberman Printed electronics by metal plating through uv light

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JPS5917223A (ja) * 1982-07-20 1984-01-28 Nec Corp 磁気記録媒体の製造方法
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JP2001089673A (ja) * 1999-09-27 2001-04-03 Hideo Kakigi 高分子成形物およびその製造方法
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US20080116077A1 (en) * 2006-11-21 2008-05-22 M/A-Com, Inc. System and method for solder bump plating
JP5448524B2 (ja) * 2008-04-23 2014-03-19 富士フイルム株式会社 めっき用積層フィルム、表面金属膜材料の作製方法及び表面金属膜材料
KR20100009752A (ko) * 2008-07-21 2010-01-29 삼성전자주식회사 자기장을 이용한 무전해 도금 장치 및 방법
JP2010106316A (ja) * 2008-10-30 2010-05-13 Du Pont Toray Co Ltd 導電性繊維の製造方法
JP2011124523A (ja) * 2010-02-02 2011-06-23 Napura:Kk 電子デバイス用基板、電子デバイス用積層体、電子デバイス及びそれらの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000035259A2 (de) * 1998-12-10 2000-06-15 Gerhard Naundorf Verfahren zur herstellung von leiterbahnstrukturen
DE10255520A1 (de) * 2002-11-28 2004-06-17 Infineon Technologies Ag Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung
US20060143898A1 (en) * 2004-12-28 2006-07-06 Samsung Techwin Co., Ltd. Method of manufacturing antenna for RFID tag
US20090269510A1 (en) * 2008-04-25 2009-10-29 Daniel Lieberman Printed electronics by metal plating through uv light

Also Published As

Publication number Publication date
PL2745658T3 (pl) 2016-02-29
NZ716340A (en) 2016-10-28
PL2745658T4 (pl) 2016-03-31
SG11201400069VA (en) 2014-04-28
PH12014500400A1 (en) 2014-04-14
NZ622408A (en) 2016-03-31
EP2745658A1 (en) 2014-06-25
MX346900B (es) 2017-04-04
ES2548415T3 (es) 2015-10-16
US20140357081A1 (en) 2014-12-04
US20130043603A1 (en) 2013-02-21
MY185302A (en) 2021-04-30
AU2017200890A1 (en) 2017-03-02
HRP20151016T1 (hr) 2015-12-04
EP2745658B1 (en) 2015-06-24
BR112014003893A2 (pt) 2017-03-14
US8784953B2 (en) 2014-07-22
RS54497B1 (sr) 2016-06-30
CA2845822A1 (en) 2013-02-28
EA201490479A1 (ru) 2014-07-30
SI2745658T1 (sl) 2015-12-31
JP2014525992A (ja) 2014-10-02
DK2745658T3 (en) 2015-10-12
SMT201500269B (it) 2016-01-08
CN104025724B (zh) 2017-09-26
SG10201504593RA (en) 2015-07-30
MX2014001980A (es) 2014-05-14
WO2013028473A1 (en) 2013-02-28
CN104025724A (zh) 2014-09-03
PT2745658E (pt) 2015-10-27
US8784952B2 (en) 2014-07-22
CY1117130T1 (el) 2017-04-05
HUE028044T2 (en) 2016-11-28
AU2012299226A1 (en) 2014-04-03
JP2016196708A (ja) 2016-11-24
US20130043062A1 (en) 2013-02-21
IL231045A0 (en) 2014-03-31

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Designated state(s): AM AZ BY KZ KG TJ TM RU