HRP20151016T1 - Postupak stvaranja konduktivnog prikaza na nekonduktivnoj površini - Google Patents
Postupak stvaranja konduktivnog prikaza na nekonduktivnoj površini Download PDFInfo
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- HRP20151016T1 HRP20151016T1 HRP20151016TT HRP20151016T HRP20151016T1 HR P20151016 T1 HRP20151016 T1 HR P20151016T1 HR P20151016T T HRP20151016T T HR P20151016TT HR P20151016 T HRP20151016 T HR P20151016T HR P20151016 T1 HRP20151016 T1 HR P20151016T1
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- Prior art keywords
- metal coordination
- metal
- mixture
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- coordination mixture
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- 238000000034 method Methods 0.000 title claims 17
- 239000002184 metal Substances 0.000 claims 29
- 229910052751 metal Inorganic materials 0.000 claims 29
- 239000000203 mixture Substances 0.000 claims 18
- 230000005855 radiation Effects 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 5
- 238000001035 drying Methods 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 5
- 239000007864 aqueous solution Substances 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000003054 catalyst Substances 0.000 claims 2
- 238000003486 chemical etching Methods 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 2
- 238000010147 laser engraving Methods 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 230000003213 activating effect Effects 0.000 claims 1
- 230000004913 activation Effects 0.000 claims 1
- 239000003513 alkali Substances 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000007590 electrostatic spraying Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 230000005251 gamma ray Effects 0.000 claims 1
- 239000000243 solution Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1673—Magnetic field
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Electrodes Of Semiconductors (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
Claims (16)
1. Postupak stvaranja konduktivnog sloja na površini, naznačen time, da obuhvaća izvođenje sljedećih koraka po redu:
aktiviranje barem jednog odsječka nekonduktivne supstratne površine;
nanošenje magnetskog polja na površinu;
postavljanje metalne koordinacijske mješavine na barem dio od aktiviranog odsječka površine;
odstranjivanje magnetskog polja;
izlaganje metalne koordinacijske mješavine elektromagnetskoj radijaciji;
smanjivanje metalne koordinacijske mješavine na elementarni metal;
odstranjivanje nesmanjene metalne koordinacijske mješavine s površine;
sušenje površine; i
postavljanje konduktivnog materijala na površinu.
2. Postupak prema zahtjevu 1, naznačen time, da aktiviranje supstratne površine, sadrži izvedbu nagrizanja površine.
3. Postupak prema zahtjevu 2, naznačen time, da izvedba nagrizanja površine obuhvaća jedno od sljedećih:
a) kemijsko nagrizanje,
b) kemijsko nagrizanje koje sadrži nagrizanje kiselinom, nagrizanje lužinom ili oksidacijsko nagrizanje,
c) mehaničko urezivanje,
d) plazmatsko urezivanje,
e) lasersko urezivanje, i
f) plazmatsko ili lasersko urezivanje koje sadrži urezivanje prema predodređenom uzorku.
4. Postupak prema zahtjevu 1, naznačen time, da magnetsko polje ima gustoću magnetskog toka od najmanje 1000 gaussa.
5. Postupak prema zahtjevu 4, naznačen time, da je magnetsko polje ortogonalno na površinu.
6. Postupak prema zahtjevu 1, naznačen time, da postavljanje metalne koordinacijske mješavine na barem jedan odsječak površine, sadrži uporabu maske.
7. Postupak prema zahtjevu 6, naznačen time, da maska obuhvaća elektronički sklop, pri čemu taj elektronički sklop može biti analogni sklop, digitalni sklop, sklop sastavljenih signala i RF-sklop.
8. Postupak prema zahtjevu 1, naznačen time, da izlaganje metalne koordinacijske mješavine elektromagnetskoj radijaciji, obuhvaća mikrovalnu radijaciju, infracrvenu radijaciju, radijaciju vidljivim svjetlom, ultraljubičastu radijaciju, radijaciju X-zrakama ili radijaciju gama zrakama.
9. Postupak prema zahtjevu 1, naznačen time, da smanjivanje metalne koordinacijske mješavine na nulto oksidacijsko stanje metala, obuhvaća uporabu kombinacije metala ili kombinacije katalizatora ili oboje, kombinacije i metala i katalizatora.
10. Postupak prema zahtjevu 1, naznačen time, da odstranjivanje nesmanjene metalne koordinacijske mješavine s površine, obuhvaća ispiranje površine s otapalom.
11. Postupak prema zahtjevu 1, naznačen time, da sušenje površine obuhvaća jedan od sljedećih koraka:
a) sušenje na sobnoj temperaturi ili sušenje na povišenoj temperaturi, i
b) sušenje površine na sobnoj ili povišenoj temperaturi uporabom vakuumske komore.
12. Postupak prema zahtjevu 1, naznačen time, da postavljanje konduktivnog materijala na površinu, obuhvaća jedan od sljedećih koraka:
a) elektrolitičko polaganje metala na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu, i
b) elektrolitičko polaganje metala na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu pomoću sljedećih koraka:
- stavljanje u doticaj negativnog priključka direktne energetske opskrbne mreže s barem odsječkom površine koji sadrži smanjenu metalnu koordinacijsku mješavinu;
- dobava vodene otopine koja sadrži sol metala koji se treba položiti, elektrode načinjene od metala, koje se potapaju u vodenoj otopini ili njihove kombinacije;
- stavljanje u doticaj pozitivnog priključka direktne energetske opskrbne mreže s vodenom otopinom;
- stavljanje u doticaj barem odsječka površine koji sadrži smanjenu metalnu koordinacijsku mješavinu s vodenom otopinom; i
- uključivanje energetske opskrbne mreže.
13. Postupak prema zahtjevu 1, naznačen time, da postavljanje konduktivnog materijala na površinu, obuhvaća sljedeće korake:
a) bezstrujno postavljanje metala na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu, i
b) bezstrujno postavljanje metala na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu, koje obuhvaća stavljanje u doticaj barem odsječka površine koji sadrži metalnu koordinacijsku mješavinu s otopinom koja sadrži sol metala, sredstvo za miješanje i sredstvo za redukciju.
14. Postupak prema zahtjevu 1, naznačen time, da polaganje konduktivnog materijala na površinu, obuhvaća polaganje nemetalne konduktivne tvari na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu.
15. Postupak prema zahtjevu 14, naznačen time, da se nemetalni konduktivni materijal polaže na odsječak površine koji sadrži smanjenu metalnu koordinacijsku mješavinu, pomoću elektrostatičkog raspršivanja.
16. Postupak prema zahtjevu 1, naznačen time, da se cijela nekonduktivna supstratna površina aktivira i polaže se metalna koordinacijska mješavina na cijelu površinu ili na dio od aktivirane površine.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161525662P | 2011-08-19 | 2011-08-19 | |
| US201161568736P | 2011-12-09 | 2011-12-09 | |
| US13/403,797 US8784952B2 (en) | 2011-08-19 | 2012-02-23 | Method of forming a conductive image on a non-conductive surface |
| EP12790696.4A EP2745658B1 (en) | 2011-08-19 | 2012-08-16 | Method of forming a conductive image on a non-conductive surface |
| PCT/US2012/051193 WO2013028473A1 (en) | 2011-08-19 | 2012-08-16 | Method of forming a conductive image on a non-conductive surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20151016T1 true HRP20151016T1 (hr) | 2015-12-04 |
Family
ID=47711823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HRP20151016TT HRP20151016T1 (hr) | 2011-08-19 | 2015-09-24 | Postupak stvaranja konduktivnog prikaza na nekonduktivnoj površini |
Country Status (24)
| Country | Link |
|---|---|
| US (3) | US8784952B2 (hr) |
| EP (1) | EP2745658B1 (hr) |
| JP (2) | JP2014525992A (hr) |
| CN (1) | CN104025724B (hr) |
| AU (2) | AU2012299226A1 (hr) |
| BR (1) | BR112014003893A2 (hr) |
| CA (1) | CA2845822A1 (hr) |
| CY (1) | CY1117130T1 (hr) |
| DK (1) | DK2745658T3 (hr) |
| EA (1) | EA027161B1 (hr) |
| ES (1) | ES2548415T3 (hr) |
| HR (1) | HRP20151016T1 (hr) |
| HU (1) | HUE028044T2 (hr) |
| IL (1) | IL231045A0 (hr) |
| MX (2) | MX346900B (hr) |
| MY (1) | MY185302A (hr) |
| PH (1) | PH12014500400A1 (hr) |
| PL (1) | PL2745658T4 (hr) |
| PT (1) | PT2745658E (hr) |
| RS (1) | RS54497B1 (hr) |
| SG (2) | SG11201400069VA (hr) |
| SI (1) | SI2745658T1 (hr) |
| SM (1) | SMT201500269B (hr) |
| WO (1) | WO2013028473A1 (hr) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201600973RA (en) * | 2013-08-06 | 2016-03-30 | Earthone Circuit Technologies Corp | Forming a conductive image using high speed electroless platin |
| US9706667B2 (en) | 2014-05-19 | 2017-07-11 | Sierra Circuits, Inc. | Via in a printed circuit board |
| US9398703B2 (en) | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
| US9380700B2 (en) | 2014-05-19 | 2016-06-28 | Sierra Circuits, Inc. | Method for forming traces of a printed circuit board |
| KR101698160B1 (ko) * | 2014-09-17 | 2017-01-19 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 |
| US10677837B2 (en) | 2016-06-01 | 2020-06-09 | Kyzen Corporation | System and method for electrical circuit monitoring |
| CN105451456A (zh) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | 非导电基材的导体线路的制造方法 |
| GB201600214D0 (en) * | 2016-01-06 | 2016-02-17 | Univ Coventry | Material deposition in a magnetic field |
| US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
| US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
| US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
| US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930784A1 (de) * | 1979-07-28 | 1981-02-12 | Licentia Gmbh | Verfahren zur aktivierung von kunststoffoberflaechen |
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2012
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- 2012-08-16 AU AU2012299226A patent/AU2012299226A1/en not_active Abandoned
- 2012-08-16 US US13/587,785 patent/US8784953B2/en active Active - Reinstated
- 2012-08-16 PT PT127906964T patent/PT2745658E/pt unknown
- 2012-08-16 MY MYPI2014000437A patent/MY185302A/en unknown
- 2012-08-16 SG SG11201400069VA patent/SG11201400069VA/en unknown
- 2012-08-16 CN CN201280051161.2A patent/CN104025724B/zh not_active Expired - Fee Related
- 2012-08-16 MX MX2014001980A patent/MX2014001980A/es active IP Right Grant
- 2012-08-16 WO PCT/US2012/051193 patent/WO2013028473A1/en active Application Filing
- 2012-08-16 JP JP2014527191A patent/JP2014525992A/ja active Pending
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