ES2191073T3 - Unidad electronica y metodo para su fabricacion. - Google Patents
Unidad electronica y metodo para su fabricacion.Info
- Publication number
- ES2191073T3 ES2191073T3 ES96112037T ES96112037T ES2191073T3 ES 2191073 T3 ES2191073 T3 ES 2191073T3 ES 96112037 T ES96112037 T ES 96112037T ES 96112037 T ES96112037 T ES 96112037T ES 2191073 T3 ES2191073 T3 ES 2191073T3
- Authority
- ES
- Spain
- Prior art keywords
- coil
- layers
- circuit
- extreme
- integrated connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Coils Or Transformers For Communication (AREA)
- Credit Cards Or The Like (AREA)
Abstract
LA INVENCION SE REFIERE A UNA UNIDAD DE CIRCUITO CON UN SUBSTRATO (1) SOPORTE AISLANTE, SOBRE EL QUE SE ENCUENTRA UNA BOBINA (3) PLANA, CONDUCTORA. LA BOBINA (3) PUEDE COMPONERSE DE MULTIPLES CAPAS (9,7) DE BOBINA, QUE SE SEPARAN A TRAVES DE CAPAS (11) AISLANTES. PARA LA CONEXION CONJUNTA DE LAS CAPAS (9,17) DE BOBINAS INDIVIDUALES A FIN DE FORMAR UNA BOBINA COMPLETA, SE HA PROVISTO EN CADA UNA DE LAS CAPAS (11) AISLANTE AL MENOS UNA ROTURA (13). LA UNION ENTRE LOS EXTREMOS (15,19) DE LA BOBINA (3) Y UN CIRCUITO (7) DE CONEXION INTEGRADO O UN MODULO (23), QUE CONTIENE EL CIRCUITO (7) DE CONEXION INTEGRADO, PUEDE CONSEGUIRSE DE FORMA AISLADA DE TAL MODO, QUE SE DISPONEN EN CONTACTOS LOS EXTREMOS (15,19) DE BOBINA Y LOS PUNTOS (27) DE CONEXION DEL CIRCUITO (7) DE CONEXION INTEGRADO O LOS CONTACTOS (25) DEL MODULO (23). LOS ARROLLAMIENTOS INDIVIDUALES DE LA BOBINA (3) PUEDEN SER DISPUESTOS DE TAL MODO Y DIMENSIONADOS DE TAL MANERA, QUE DENTRO DE UNA DE LAS ZONAS (37,38) PREVISTAS DE ACUERDO CON LA NORMATIVA ES POSIBLE UNA ESTAMPACION ALTA DE LA UNIDAD DE CIRCUITO DE FORMA NO LIMITADA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19527359A DE19527359A1 (de) | 1995-07-26 | 1995-07-26 | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2191073T3 true ES2191073T3 (es) | 2003-09-01 |
Family
ID=7767864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96112037T Expired - Lifetime ES2191073T3 (es) | 1995-07-26 | 1996-07-25 | Unidad electronica y metodo para su fabricacion. |
Country Status (4)
Country | Link |
---|---|
US (2) | US6049461A (es) |
EP (1) | EP0756244B1 (es) |
DE (2) | DE19527359A1 (es) |
ES (1) | ES2191073T3 (es) |
Families Citing this family (88)
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DE19753619A1 (de) * | 1997-10-29 | 1999-05-06 | Meto International Gmbh | Identifizierungselement und Verfahren zu seiner Herstellung |
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DE102010015659A1 (de) | 2010-04-20 | 2011-10-20 | Giesecke & Devrient Gmbh | Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten |
JP5501114B2 (ja) * | 2010-06-25 | 2014-05-21 | 東洋アルミニウム株式会社 | Icカード・タグ用アンテナ回路構成体とその製造方法 |
FR2963137B1 (fr) * | 2010-07-20 | 2016-02-19 | Oberthur Technologies | Insert a transpondeur et dispositif comprenant un tel insert |
US20120104103A1 (en) * | 2010-10-29 | 2012-05-03 | Nxp B.V. | Integrated pcb uhf rfid matching network/antenna |
US10381720B2 (en) | 2010-12-08 | 2019-08-13 | Nxp B.V. | Radio frequency identification (RFID) integrated circuit (IC) and matching network/antenna embedded in surface mount devices (SMD) |
DE102011016512A1 (de) * | 2011-04-08 | 2012-10-11 | Giesecke & Devrient Gmbh | Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats |
DE102012025785B3 (de) * | 2011-11-24 | 2020-01-09 | Avl Software And Functions Gmbh | Vorrichtung zur berührungslosen Energieübertragung, Leiterplatte mit einer Primärspulenanordnung und eine Ladestation |
FR3001070B1 (fr) * | 2013-01-17 | 2016-05-06 | Inside Secure | Systeme d'antenne pour microcircuit sans contact |
DE102014106062B4 (de) * | 2014-04-30 | 2018-11-22 | Infineon Technologies Ag | Chipkartenmodul, Chipkartenkörper, Chipkarte und Chipkartenherstellungsverfahren |
KR101594380B1 (ko) | 2015-03-04 | 2016-02-16 | 엘지전자 주식회사 | 이동 단말기 및 코일 안테나 모듈 |
FR3033435B1 (fr) * | 2015-03-04 | 2018-03-30 | Smart Packaging Solutions | Carte a puce sans contact avec antenne optimisee pour permette l'embossage des caracteres |
DE102015014408A1 (de) * | 2015-11-06 | 2017-05-11 | Giesecke & Devrient Gmbh | Stabile Chipkarte, Spulenanordnung und Verfahren zum Bereitstellen einer Chipkarte |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
DE102018212594B4 (de) * | 2018-07-27 | 2021-11-18 | Textilma Ag | Dualbandtransponder und textiles Etikett mit Dualbandtransponder |
CN112652880B (zh) * | 2019-12-12 | 2024-03-19 | 友达光电股份有限公司 | 天线装置及其制造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH01157896A (ja) * | 1987-09-28 | 1989-06-21 | Mitsubishi Electric Corp | 非接触型icカード及び非接触型カードリーダライタ |
JP2615151B2 (ja) * | 1988-08-19 | 1997-05-28 | 株式会社村田製作所 | チップ型コイル及びその製造方法 |
FR2641102B1 (es) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
DE9115582U1 (es) * | 1991-12-16 | 1992-12-17 | Siemens Ag, 8000 Muenchen, De | |
DE9217070U1 (es) * | 1991-12-16 | 1993-03-04 | Siemens Ag, 8000 Muenchen, De | |
JPH06336096A (ja) * | 1993-05-28 | 1994-12-06 | Omron Corp | カード形基板 |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4428732C1 (de) * | 1994-08-15 | 1996-01-04 | Angewandte Digital Elektronik | Mehrlagige Chipkartenspulen für kontaktfreie Chipkarten |
HUP9903550A3 (en) * | 1996-07-18 | 2000-09-28 | Nagraid Sa | Method for producing electronic module containing at least one electronic component, and electonic module formed as a chip card produced by the method |
-
1995
- 1995-07-26 DE DE19527359A patent/DE19527359A1/de not_active Withdrawn
-
1996
- 1996-07-25 EP EP96112037A patent/EP0756244B1/de not_active Expired - Lifetime
- 1996-07-25 DE DE59610212T patent/DE59610212D1/de not_active Expired - Lifetime
- 1996-07-25 US US08/686,026 patent/US6049461A/en not_active Expired - Lifetime
- 1996-07-25 ES ES96112037T patent/ES2191073T3/es not_active Expired - Lifetime
-
1999
- 1999-12-09 US US09/457,701 patent/US6839963B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0756244A3 (de) | 1998-12-09 |
US6839963B1 (en) | 2005-01-11 |
DE19527359A1 (de) | 1997-02-13 |
EP0756244B1 (de) | 2003-03-12 |
EP0756244A2 (de) | 1997-01-29 |
DE59610212D1 (de) | 2003-04-17 |
US6049461A (en) | 2000-04-11 |
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