ES2171424T3 - Modulo electronico para tarjetas y fabricacion del mismo. - Google Patents

Modulo electronico para tarjetas y fabricacion del mismo.

Info

Publication number
ES2171424T3
ES2171424T3 ES94111975T ES94111975T ES2171424T3 ES 2171424 T3 ES2171424 T3 ES 2171424T3 ES 94111975 T ES94111975 T ES 94111975T ES 94111975 T ES94111975 T ES 94111975T ES 2171424 T3 ES2171424 T3 ES 2171424T3
Authority
ES
Spain
Prior art keywords
electronic module
manufacture
connection circuit
integrated connection
cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94111975T
Other languages
English (en)
Inventor
Yahya Haghiri-Tehrani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Application granted granted Critical
Publication of ES2171424T3 publication Critical patent/ES2171424T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PARA LA FABRICACION DE UN MODULO ELECTRONICO CON CIRCUITO DE CONEXION INTEGRADO SE ELABORA UN PRODUCTO DE PARTIDA ESTANDARDIZADO, COMPUESTO DE UNA SUSTANCIA AISLANTE, QUE ESTA PROVISTA CON UN RECUBRIMIENTO CONDUCTOR. EN EL RECUBRIMIENTO CONDUCTOR SE CONFIGURAN SUPERFICIES DE CONTACTO POR MEDIO DE INTERRUPCIONES. EN LA CAPA AISLANTE DEL PRODUCTO DE PARTIDA SE APLICAN CAVIDADES CON LA AYUDA DE UNA HERRAMIENTA DE FRESADO, A TRAVES DE LAS CUALES SE GUIEN MAS TARDE LOS COMPUESTOS CONDUCTORES ENTRE LAS SUPERFICIES DE CONTACTO Y EL CIRCUITO DE CONEXION INTEGRADO. LA CAPA DE LAS CAVIDADES SE ADAPTADA AL CIRCUITO DE CONEXION INTEGRADO INSTALADO DE ACUERDO CON EL TAMAÑO EN EL MODULO ELECTRONICO.
ES94111975T 1993-08-10 1994-08-01 Modulo electronico para tarjetas y fabricacion del mismo. Expired - Lifetime ES2171424T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4326816A DE4326816A1 (de) 1993-08-10 1993-08-10 Elektronisches Modul für Karten und Herstellung eines solchen Moduls

Publications (1)

Publication Number Publication Date
ES2171424T3 true ES2171424T3 (es) 2002-09-16

Family

ID=6494849

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94111975T Expired - Lifetime ES2171424T3 (es) 1993-08-10 1994-08-01 Modulo electronico para tarjetas y fabricacion del mismo.

Country Status (6)

Country Link
US (2) US5756379A (es)
EP (1) EP0643366B1 (es)
JP (1) JPH07154049A (es)
AT (1) ATE213349T1 (es)
DE (2) DE4326816A1 (es)
ES (1) ES2171424T3 (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100480522B1 (ko) * 1995-08-01 2005-08-31 오스트리아 카드 플라스틱카르텐 운트 아우스바이스시스템게젤샤프트 엠베하 컴포넌트보유모듈및코일을갖는데이터캐리어와이데이터캐리어의제조방법
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
US6861290B1 (en) * 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
DE19609134A1 (de) * 1996-03-08 1997-09-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
US6064111A (en) * 1996-07-31 2000-05-16 Hitachi Company, Ltd. Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
DE19638371C2 (de) * 1996-09-19 2001-05-31 Siemens Ag Verfahren zur Erzeugung einer einseitigen galvanischen Metallschicht auf Chipmodulen
DE19639934A1 (de) * 1996-09-27 1998-04-09 Siemens Ag Verfahren zur Flipchip-Kontaktierung eines Halbleiterchips mit geringer Anschlußzahl
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
DE19738588B4 (de) * 1997-09-03 2004-11-25 Infineon Technologies Ag Elektrisches Bauelement mit einer Umhüllung und mit einem in der Umhüllung angeordneten Anschlußbereich und Verfahren zur Herstellung eines solchen elektrischen Bauelements
US6787389B1 (en) * 1997-10-09 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having pads for connecting a semiconducting element to a mother board
JP3481117B2 (ja) 1998-02-25 2003-12-22 富士通株式会社 半導体装置及びその製造方法
JP3764587B2 (ja) * 1998-06-30 2006-04-12 富士通株式会社 半導体装置の製造方法
JP2000331962A (ja) * 1999-05-18 2000-11-30 Lintec Corp 半導体ウエハの加工方法および半導体ウエハ支持部材
FR2794267B1 (fr) * 1999-05-27 2003-06-20 Gemplus Card Int Dispositif portable a circuit integre, de type carte a puce de format reduit par rapport au format standard des cartes a puces et procede de fabrication
EP1093083B1 (de) * 1999-10-11 2009-03-11 Infineon Technologies AG Chipkartenmodul
DE10214314A1 (de) * 2002-03-28 2003-10-23 Nedcard B V Chipmodul
DE10318688A1 (de) * 2003-04-24 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür
DE10334578A1 (de) * 2003-07-28 2005-03-10 Infineon Technologies Ag Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls
US20060145317A1 (en) * 2004-12-31 2006-07-06 Brennan John M Leadframe designs for plastic cavity transistor packages
US20060146271A1 (en) * 2005-01-04 2006-07-06 Pennaz Thomas J Universal display module
US7821794B2 (en) * 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
US7977161B2 (en) * 2008-11-17 2011-07-12 Infineon Technologies Ag Method of manufacturing a semiconductor package using a carrier
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
CN111341750B (zh) * 2018-12-19 2024-03-01 奥特斯奥地利科技与系统技术有限公司 包括有导电基部结构的部件承载件及制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2583574B1 (fr) * 1985-06-14 1988-06-17 Eurotechnique Sa Micromodule a contacts enterres et carte contenant des circuits comportant un tel micromodule.
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2624652B1 (fr) * 1987-12-14 1990-08-31 Sgs Thomson Microelectronics Procede de mise en place sur un support, d'un composant electronique, muni de ses contacts
JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
EP0643366A2 (de) 1995-03-15
EP0643366B1 (de) 2002-02-13
ATE213349T1 (de) 2002-02-15
DE4326816A1 (de) 1995-02-16
JPH07154049A (ja) 1995-06-16
US6013945A (en) 2000-01-11
US5756379A (en) 1998-05-26
DE59410046D1 (de) 2002-03-21
EP0643366A3 (de) 1996-01-03

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