MX166706B - Microfusible de bajo amperaje - Google Patents

Microfusible de bajo amperaje

Info

Publication number
MX166706B
MX166706B MX025361A MX2536191A MX166706B MX 166706 B MX166706 B MX 166706B MX 025361 A MX025361 A MX 025361A MX 2536191 A MX2536191 A MX 2536191A MX 166706 B MX166706 B MX 166706B
Authority
MX
Mexico
Prior art keywords
fusible element
insulating
fusible
percent
central portion
Prior art date
Application number
MX025361A
Other languages
English (en)
Inventor
James William Cook
Terrence John Evans
Original Assignee
Cooper Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooper Ind Inc filed Critical Cooper Ind Inc
Publication of MX166706B publication Critical patent/MX166706B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
    • H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
    • H01H2085/0034—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices with molded casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
    • H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
    • H01H85/003—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices casings for the fusible element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/38—Means for extinguishing or suppressing arc

Landscapes

  • Fuses (AREA)

Abstract

La presente invención se refiere a un subconjunto fusible que comprende: un substrato aislante que tiene una porción central colocada entre las porciones de extremo opuestas; un revestimiento aislante colocado sobre solamente la porción central; un elemento fusible colocado sobre el revestimiento aislante; una chapa de unión de cable conductor, metalizado, colocada en cada una de las porciones de extremo opuestas y que se extiende sobre el borde de revestimiento de vidrio y que están en contacto con el elemento fusible; un revestimiento aislante con una rugosidad de superficie promedio limitada a 25 por ciento del grosor del elemento fusible colocado en el revestimiento aislante, y dislocaciones de superficie limitadas a 10 por ciento del grosor del elemento fusible.
MX025361A 1990-04-16 1991-04-15 Microfusible de bajo amperaje MX166706B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/510,361 US5097246A (en) 1990-04-16 1990-04-16 Low amperage microfuse

Publications (1)

Publication Number Publication Date
MX166706B true MX166706B (es) 1993-01-28

Family

ID=24030438

Family Applications (1)

Application Number Title Priority Date Filing Date
MX025361A MX166706B (es) 1990-04-16 1991-04-15 Microfusible de bajo amperaje

Country Status (8)

Country Link
US (1) US5097246A (es)
EP (1) EP0453217B1 (es)
JP (1) JPH0750128A (es)
KR (1) KR100187938B1 (es)
CA (1) CA2040073C (es)
DE (1) DE69125307T2 (es)
HK (1) HK1000060A1 (es)
MX (1) MX166706B (es)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH682959A5 (fr) * 1990-05-04 1993-12-15 Battelle Memorial Institute Fusible.
DE4240569C2 (de) * 1992-12-02 1995-12-07 Bosch Gmbh Robert Verfahren zur Herstellung einer haftfesten Kunststoff-Metall-Verbindung
DE4243048A1 (de) * 1992-12-18 1994-06-23 Siemens Ag Verfahren zur Herstellung eines hartmagnetischen Materials auf Basis des Stoffsystems Sm-Fe-C
US5432378A (en) * 1993-12-15 1995-07-11 Cooper Industries, Inc. Subminiature surface mounted circuit protector
US5664320A (en) * 1994-04-13 1997-09-09 Cooper Industries Method of making a circuit protector
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5440802A (en) * 1994-09-12 1995-08-15 Cooper Industries Method of making wire element ceramic chip fuses
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US5914648A (en) 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
KR100214463B1 (ko) * 1995-12-06 1999-08-02 구본준 클립형 리드프레임과 이를 사용한 패키지의 제조방법
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
DE19738575A1 (de) * 1997-09-04 1999-06-10 Wickmann Werke Gmbh Elektrisches Sicherungselement
JP3562696B2 (ja) * 1997-12-16 2004-09-08 矢崎総業株式会社 ヒューズエレメントの製造方法
US6317307B1 (en) * 1998-10-07 2001-11-13 Siecor Operations, Llc Coaxial fuse and protector
US6432564B1 (en) 1999-08-12 2002-08-13 Mini Systems, Inc. Surface preparation of a substrate for thin film metallization
US20030048620A1 (en) * 2000-03-14 2003-03-13 Kohshi Nishimura Printed-circuit board with fuse
EP1274110A1 (de) * 2001-07-02 2003-01-08 Abb Research Ltd. Schmelzsicherung
US7034652B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
JP4237615B2 (ja) * 2001-07-10 2009-03-11 リッテルフューズ，インコーポレイティド ネットワーク装置用の静電放電装置
US6878004B2 (en) * 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
US7183891B2 (en) * 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US7132922B2 (en) * 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
WO2003088356A1 (en) * 2002-04-08 2003-10-23 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
PL360332A1 (en) * 2003-05-26 2004-11-29 Abb Sp.Z O.O. High voltage high breaking capacity thin-layer fusible cut-out
DE112004002301T5 (de) * 2003-11-26 2006-09-28 Littelfuse, Inc., Des Plaines Elektrische Schutzeinrichtung für ein Fahrzeug und System, das diese einsetzt
DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
US7569907B2 (en) * 2005-03-28 2009-08-04 Cooper Technologies Company Hybrid chip fuse assembly having wire leads and fabrication method therefor
US8289123B2 (en) * 2005-07-22 2012-10-16 Littelfuse, Inc. Electrical device with integrally fused conductor
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
JP4896630B2 (ja) * 2006-08-28 2012-03-14 矢崎総業株式会社 ヒューズエレメント及びヒューズエレメントの製造方法
US7983024B2 (en) * 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
DE102008025917A1 (de) * 2007-06-04 2009-01-08 Littelfuse, Inc., Des Plaines Hochspannungssicherung
KR20090090161A (ko) * 2008-02-20 2009-08-25 삼성전자주식회사 전기적 퓨즈 소자
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
KR20090112390A (ko) * 2008-04-24 2009-10-28 삼성전자주식회사 전기적 퓨즈 소자
PL2175457T3 (pl) * 2008-10-09 2012-09-28 Joinset Co Ltd Zespół ceramicznego układu scalonego
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
DE102010037390B4 (de) * 2010-09-08 2012-08-30 Vossloh-Schwabe Deutschland Gmbh Mehrlagige Leiterplatte mit Leiterplattensicherung
CN102646558B (zh) * 2012-05-10 2014-07-09 苏州晶讯科技股份有限公司 耐高压的表面贴装熔断器
JP2016122560A (ja) * 2014-12-25 2016-07-07 京セラ株式会社 ヒューズ装置、ヒューズユニット、消弧体、および消弧体の製造方法
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
US12317518B2 (en) * 2021-10-27 2025-05-27 Texas Instruments Incorporated Isolation device with safety fuse

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1213736A (en) * 1968-05-31 1970-11-25 D S Plugs Ltd Fusible elements for cartridge fuses
DE2830963C2 (de) * 1978-07-14 1985-03-14 Standard Elektrik Lorenz Ag, 7000 Stuttgart Bei Überlastung infolge überhöhter Temperatur und/oder überhöhtem Strom den Stromfluß unterbrechende elektrische Sicherung
DE3051177C2 (es) * 1979-09-11 1991-02-21 Rohm Co. Ltd., Kyoto, Jp
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4873506A (en) * 1988-03-09 1989-10-10 Cooper Industries, Inc. Metallo-organic film fractional ampere fuses and method of making

Also Published As

Publication number Publication date
KR100187938B1 (ko) 1999-06-01
US5097246A (en) 1992-03-17
DE69125307T2 (de) 1997-09-25
KR910019087A (ko) 1991-11-30
JPH0750128A (ja) 1995-02-21
EP0453217B1 (en) 1997-03-26
HK1000060A1 (en) 1997-10-31
CA2040073A1 (en) 1991-10-17
DE69125307D1 (de) 1997-04-30
CA2040073C (en) 2000-08-29
EP0453217A1 (en) 1991-10-23

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