KR910019087A - 저전류마이크로퓨우즈 - Google Patents
저전류마이크로퓨우즈 Download PDFInfo
- Publication number
- KR910019087A KR910019087A KR1019910006068A KR910006068A KR910019087A KR 910019087 A KR910019087 A KR 910019087A KR 1019910006068 A KR1019910006068 A KR 1019910006068A KR 910006068 A KR910006068 A KR 910006068A KR 910019087 A KR910019087 A KR 910019087A
- Authority
- KR
- South Korea
- Prior art keywords
- disposed
- insulating coating
- fuse element
- coating portion
- thickness
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
- H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
- H01H2085/0034—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices with molded casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
- H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
- H01H85/003—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices casings for the fusible element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/38—Means for extinguishing or suppressing arc
Landscapes
- Fuses (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 퓨우즈의 단면투시도, 제2도는 제1도에 도시된 퓨우즈에 있어서의 유리코팅된 각각의 칩을 생산하기 위해 이용되는 유리코팅된 세라믹 기판의 평면도, 제3도는 제1도에 도시된 퓨우즈에서의 유리코팅된 각각의 칩의 측면도.
Claims (7)
- 양단부(28, 30)사이에 중심부(32)가 배치된 절연기판(22)과, 이 중심부(32)상에만 배치된 절연코팅부(34), 이 절연코팅부(34)상에 배치된 퓨우즈소자, 이 퓨우즈소자가 접속되고, 상기한 유리코팅부(34)의 모서리상에 확장되며, 상기한 각각의 양단부(28,30)상에 배치된 금속화된 리드부착패드(24,26)및, 상기한 절연코팅부(34)가 배치된 퓨추즈소자의 두께의 25%로 제한된 평균표면거칠기와 이 퓨우즈소자의 두께의 10%로 제한된 표면전위를 가진 절연코팅부(34)등을 포함하는 것을 특징으로 하는 마이크로퓨우즈.
- 제1항에 있어서, 상기 절연코팅부(34)가 유리한 것을 특징으로 하는 마이크로퓨우즈.
- 제1항에 있어서, 상기 퓨우즈소자의 두께가 100마이크로인치(Micro-inches)미만인 것을 특징으로 하는 마이크로퓨우즈.
- 제1항에 있어서, 상기 절연기판이 세라믹인 것을 특징으로 하는 마이크로퓨우즈.
- 상기 양단부(28, 30)사이에 중심부(32)가 배치된 절연기판(22)과, 이 중심부(32)상에만 배치된 절연코팅부(34), 이 절연코팅부(34)상에 배치된 퓨우즈소자, 이 퓨우즈소자가 접속되고, 상기한 유리코팅부(34)의 모서리상에 확장되며, 상기한 각각의 양단부상에 배치된 금속화된 리드부착패드(24, 26), 상기한 절연코팅부(34)가 배치된 퓨우즈소자의 두께의 25%로 제한된 평균표면거칠기와 이 퓨우즈소자의 두께의 10%로 제한된 표면전위를 가진 절연코팅부(34), 상기 리드부착패드(24, 26)로부터 밖으로 돌출되어 부착된 리드(14, 16), 이 퓨우즈소자를 충분히 피복하는 아아크담금질코팅부(38)및, 상기한 퓨우즈조립부품을 둘러쌓아 몰드된 플라스틱봉입물(12)과 거기로부터 돌출되는 리드(14,16)를 갖춘 코팅부를 포함한 것을 특징으로 하는 마이크로퓨우즈.
- 상기 양단부(28, 30)사이에 배치된 중심부(32)를 가진 절연기판(22)과, 이 중심부(32)상엠난 배치된 절연코팅부(34), 이 절연코팅부(34)상에 배치된 퓨우즈소자, 이 퓨우즈소자가 접속되고, 상기한 유리코팅부(34)의 모서리상에 확장되며, 상기한 각각의 양단부(28, 30)상에 배치된 금속화된 리드부착패드(24, 26), 상기한 절연코팅부(34)가 배치된 퓨우즈소자의 두께의 25%로 제한된 평균표면거칠기와 이 퓨우즈소자의 두께의 10%로 제한된 표면전위를 가진 절연코팅부(34), 상기 리드부착패드(24, 26)로부터 밖으로 돌출되어 부착된 리드(14, 16), 그 돌출되는 리드(14, 16)를 갖춘 상기한 퓨우즈조립부품을 둘러쌓아 몰드된 플라스틱봉입물(12)을 포함하는 것을 특징으로 하는 마이크로퓨우즈.
- 절연금속관(12)과, 양단부(28, 30)사이에 배치된 중심부(32)를 갖춘 절연기판(22). 이 중심부(32)상에만 배치된 절연코팅부(34), 이 절연코팅부(34)상에 배치된 퓨우즈소자, 이 퓨우즈소자가 접속되고, 상기한 유리코팅부(34)의 모서리상에 확장되며, 상기한 각각의 양단부(28, 30)상에 배치된 금속화된 리드부착패드(24, 26)및, 상기 금속관(12)과 쌍을 이루고, 상기 리드부착패드(24, 26)에 전기적인 접속을 이루고 있는 캡슐말단부(14, 16)를 포함하는 것을 특징으로 하는 마이크로퓨우즈.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/510,361 | 1990-04-16 | ||
US7/510,361 | 1990-04-16 | ||
US07/510,361 US5097246A (en) | 1990-04-16 | 1990-04-16 | Low amperage microfuse |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910019087A true KR910019087A (ko) | 1991-11-30 |
KR100187938B1 KR100187938B1 (ko) | 1999-06-01 |
Family
ID=24030438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910006068A KR100187938B1 (ko) | 1990-04-16 | 1991-04-16 | 저전류마이크로퓨우즈 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5097246A (ko) |
EP (1) | EP0453217B1 (ko) |
JP (1) | JPH0750128A (ko) |
KR (1) | KR100187938B1 (ko) |
CA (1) | CA2040073C (ko) |
DE (1) | DE69125307T2 (ko) |
HK (1) | HK1000060A1 (ko) |
MX (1) | MX166706B (ko) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH682959A5 (fr) * | 1990-05-04 | 1993-12-15 | Battelle Memorial Institute | Fusible. |
DE4240569C2 (de) * | 1992-12-02 | 1995-12-07 | Bosch Gmbh Robert | Verfahren zur Herstellung einer haftfesten Kunststoff-Metall-Verbindung |
DE4243048A1 (de) * | 1992-12-18 | 1994-06-23 | Siemens Ag | Verfahren zur Herstellung eines hartmagnetischen Materials auf Basis des Stoffsystems Sm-Fe-C |
US5432378A (en) * | 1993-12-15 | 1995-07-11 | Cooper Industries, Inc. | Subminiature surface mounted circuit protector |
US5664320A (en) * | 1994-04-13 | 1997-09-09 | Cooper Industries | Method of making a circuit protector |
US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
US5440802A (en) * | 1994-09-12 | 1995-08-15 | Cooper Industries | Method of making wire element ceramic chip fuses |
US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
US5914648A (en) | 1995-03-07 | 1999-06-22 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
KR100214463B1 (ko) * | 1995-12-06 | 1999-08-02 | 구본준 | 클립형 리드프레임과 이를 사용한 패키지의 제조방법 |
US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
US6373371B1 (en) * | 1997-08-29 | 2002-04-16 | Microelectronic Modules Corp. | Preformed thermal fuse |
DE19738575A1 (de) * | 1997-09-04 | 1999-06-10 | Wickmann Werke Gmbh | Elektrisches Sicherungselement |
JP3562696B2 (ja) * | 1997-12-16 | 2004-09-08 | 矢崎総業株式会社 | ヒューズエレメントの製造方法 |
US6317307B1 (en) * | 1998-10-07 | 2001-11-13 | Siecor Operations, Llc | Coaxial fuse and protector |
US6432564B1 (en) | 1999-08-12 | 2002-08-13 | Mini Systems, Inc. | Surface preparation of a substrate for thin film metallization |
US20030048620A1 (en) * | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
EP1274110A1 (de) * | 2001-07-02 | 2003-01-08 | Abb Research Ltd. | Schmelzsicherung |
US7034652B2 (en) * | 2001-07-10 | 2006-04-25 | Littlefuse, Inc. | Electrostatic discharge multifunction resistor |
DE10297040T5 (de) * | 2001-07-10 | 2004-08-05 | Littelfuse, Inc., Des Plaines | Elektrostatische Entladungsgerät für Netzwerksysteme |
US6878004B2 (en) * | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
US7132922B2 (en) * | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
US7183891B2 (en) * | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
DE10392524B4 (de) * | 2002-04-08 | 2008-08-07 | OTC Littelfuse, Inc., Des Plaines | Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung |
PL360332A1 (en) * | 2003-05-26 | 2004-11-29 | Abb Sp.Z O.O. | High voltage high breaking capacity thin-layer fusible cut-out |
CN100408382C (zh) * | 2003-11-26 | 2008-08-06 | 力特保险丝有限公司 | 交通工具电气保护装置及利用该装置的系统 |
DE102004033251B3 (de) | 2004-07-08 | 2006-03-09 | Vishay Bccomponents Beyschlag Gmbh | Schmelzsicherung für einem Chip |
US7569907B2 (en) * | 2005-03-28 | 2009-08-04 | Cooper Technologies Company | Hybrid chip fuse assembly having wire leads and fabrication method therefor |
US8289123B2 (en) * | 2005-07-22 | 2012-10-16 | Littelfuse, Inc. | Electrical device with integrally fused conductor |
US20070075822A1 (en) * | 2005-10-03 | 2007-04-05 | Littlefuse, Inc. | Fuse with cavity forming enclosure |
JP4896630B2 (ja) * | 2006-08-28 | 2012-03-14 | 矢崎総業株式会社 | ヒューズエレメント及びヒューズエレメントの製造方法 |
US7983024B2 (en) * | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
DE102008025917A1 (de) * | 2007-06-04 | 2009-01-08 | Littelfuse, Inc., Des Plaines | Hochspannungssicherung |
KR20090090161A (ko) * | 2008-02-20 | 2009-08-25 | 삼성전자주식회사 | 전기적 퓨즈 소자 |
US8525633B2 (en) * | 2008-04-21 | 2013-09-03 | Littelfuse, Inc. | Fusible substrate |
KR20090112390A (ko) * | 2008-04-24 | 2009-10-28 | 삼성전자주식회사 | 전기적 퓨즈 소자 |
PL2175457T3 (pl) * | 2008-10-09 | 2012-09-28 | Joinset Co Ltd | Zespół ceramicznego układu scalonego |
PL2408277T3 (pl) * | 2010-07-16 | 2016-08-31 | Schurter Ag | Element bezpiecznikowy |
DE102010037390B4 (de) * | 2010-09-08 | 2012-08-30 | Vossloh-Schwabe Deutschland Gmbh | Mehrlagige Leiterplatte mit Leiterplattensicherung |
CN102646558B (zh) * | 2012-05-10 | 2014-07-09 | 苏州晶讯科技股份有限公司 | 耐高压的表面贴装熔断器 |
JP2016122560A (ja) * | 2014-12-25 | 2016-07-07 | 京セラ株式会社 | ヒューズ装置、ヒューズユニット、消弧体、および消弧体の製造方法 |
JP7368144B2 (ja) * | 2019-08-27 | 2023-10-24 | Koa株式会社 | チップ型電流ヒューズ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1213736A (en) * | 1968-05-31 | 1970-11-25 | D S Plugs Ltd | Fusible elements for cartridge fuses |
DE2830963C2 (de) * | 1978-07-14 | 1985-03-14 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Bei Überlastung infolge überhöhter Temperatur und/oder überhöhtem Strom den Stromfluß unterbrechende elektrische Sicherung |
DE3051177C2 (ko) * | 1979-09-11 | 1991-02-21 | Rohm Co. Ltd., Kyoto, Jp | |
US4626818A (en) * | 1983-11-28 | 1986-12-02 | Centralab, Inc. | Device for programmable thick film networks |
US4771260A (en) * | 1987-03-24 | 1988-09-13 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
US4873506A (en) * | 1988-03-09 | 1989-10-10 | Cooper Industries, Inc. | Metallo-organic film fractional ampere fuses and method of making |
-
1990
- 1990-04-16 US US07/510,361 patent/US5097246A/en not_active Expired - Lifetime
-
1991
- 1991-04-09 CA CA002040073A patent/CA2040073C/en not_active Expired - Lifetime
- 1991-04-12 JP JP3080035A patent/JPH0750128A/ja active Pending
- 1991-04-15 MX MX025361A patent/MX166706B/es unknown
- 1991-04-16 EP EP91303321A patent/EP0453217B1/en not_active Expired - Lifetime
- 1991-04-16 KR KR1019910006068A patent/KR100187938B1/ko not_active IP Right Cessation
- 1991-04-16 DE DE69125307T patent/DE69125307T2/de not_active Expired - Lifetime
-
1997
- 1997-07-08 HK HK97101515A patent/HK1000060A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0453217A1 (en) | 1991-10-23 |
CA2040073C (en) | 2000-08-29 |
CA2040073A1 (en) | 1991-10-17 |
US5097246A (en) | 1992-03-17 |
HK1000060A1 (en) | 1997-10-31 |
JPH0750128A (ja) | 1995-02-21 |
DE69125307D1 (de) | 1997-04-30 |
MX166706B (es) | 1993-01-28 |
EP0453217B1 (en) | 1997-03-26 |
DE69125307T2 (de) | 1997-09-25 |
KR100187938B1 (ko) | 1999-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910019087A (ko) | 저전류마이크로퓨우즈 | |
KR920015496A (ko) | 반도체장치 | |
TW200715918A (en) | Conductive connecting pin and package board | |
KR880008730A (ko) | 플렉시블 인쇄회로 기판용 단자구조물 | |
KR930024145A (ko) | 적층된 다중칩 모듈 및 그의 제조방법 | |
KR900007113A (ko) | 과전류 방지형 다이오드 | |
KR920010853A (ko) | 수지봉지형 반도체장치 | |
KR900005587A (ko) | 반도체 디바이스 및 그 제작방법 | |
KR930005167A (ko) | 반도체 장치 | |
KR890013748A (ko) | 반도체 장치 | |
KR930005174A (ko) | 수지 봉지형 반도체 장치 | |
MY103403A (en) | Chip-tyre micro-fuse | |
KR960005972A (ko) | 수지 밀폐형 반도체 장치 및 그 제조 방법 | |
KR870009613A (ko) | 집적회로 칩 마운팅 및 패키징 조립품 | |
KR850006654A (ko) | 반도체 장치 | |
KR930005101A (ko) | 테이프 자동 결합 반도체 장치 | |
KR890005859A (ko) | 집적회로 칩 조립품 | |
KR880005685A (ko) | 혼성집적회로 | |
FI855115A (fi) | Plastfilmkondensator i form av en bricka. | |
KR860003657A (ko) | 집적회로 패키지 | |
KR840000955A (ko) | 전기코일 | |
TW200610457A (en) | Conductive connecting pin and package board | |
RU1683447C (ru) | Микросборка | |
JPS57147262A (en) | Manufacture of semiconductor device | |
KR930003333A (ko) | 반도체 디바이스 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20101229 Year of fee payment: 13 |
|
EXPY | Expiration of term |