AR039775A1 - Metodo para producir un circuito electrico - Google Patents

Metodo para producir un circuito electrico

Info

Publication number
AR039775A1
AR039775A1 ARP030101473A ARP030101473A AR039775A1 AR 039775 A1 AR039775 A1 AR 039775A1 AR P030101473 A ARP030101473 A AR P030101473A AR P030101473 A ARP030101473 A AR P030101473A AR 039775 A1 AR039775 A1 AR 039775A1
Authority
AR
Argentina
Prior art keywords
integrated circuit
conductive
conductive layers
substrates
substrate
Prior art date
Application number
ARP030101473A
Other languages
English (en)
Original Assignee
Alcoa Closure Systems Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcoa Closure Systems Int Inc filed Critical Alcoa Closure Systems Int Inc
Publication of AR039775A1 publication Critical patent/AR039775A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Un circuito eléctrico es formado formando y configurando una capa conductora sobre un sustrato, formando y configurando una tapa conductora sobre otro sustrato, depositando una capa dieléctrica sobre por lo menos una porción de una de las capas conductoras, montando un circuito integrado entre los sustratos, acoplando el circuito integrado a las capas conductoras, y fijando los sustratos entre sí con las capas conductoras entre los sustratos. Estos son sustratos separados o un sustrato unitario. El circuito integrado es montado ya sea sobre un sustrato, una capa conductora, o una capa dieléctrica. El circuito integrado está acoplado a las capas conductoras ya sea directamente o a través de aberturas formadas en la capa dieléctrica. Una capa conductora interior puede ser utilizada para acoplar el circuito integrado a las capas conductoras.
ARP030101473A 2002-04-26 2003-04-28 Metodo para producir un circuito electrico AR039775A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/132,939 US6900536B1 (en) 2002-04-26 2002-04-26 Method for producing an electrical circuit

Publications (1)

Publication Number Publication Date
AR039775A1 true AR039775A1 (es) 2005-03-02

Family

ID=29268762

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP030101473A AR039775A1 (es) 2002-04-26 2003-04-28 Metodo para producir un circuito electrico

Country Status (8)

Country Link
US (2) US6900536B1 (es)
EP (1) EP1508162A4 (es)
CN (1) CN1312626C (es)
AR (1) AR039775A1 (es)
AU (1) AU2003243162B2 (es)
MY (1) MY136587A (es)
TW (1) TW200306684A (es)
WO (1) WO2003092045A2 (es)

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US7342496B2 (en) 2000-01-24 2008-03-11 Nextreme Llc RF-enabled pallet
US8077040B2 (en) 2000-01-24 2011-12-13 Nextreme, Llc RF-enabled pallet
JP3803085B2 (ja) * 2002-08-08 2006-08-02 株式会社日立製作所 無線ｉｃタグ
JP4141857B2 (ja) * 2003-02-18 2008-08-27 日立マクセル株式会社 半導体装置
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
JP2005093867A (ja) * 2003-09-19 2005-04-07 Seiko Epson Corp 半導体装置及びその製造方法
DE102004031396A1 (de) * 2004-06-29 2006-02-02 Infineon Technologies Ag Gleichspannungswandler
US7750434B2 (en) * 2005-01-31 2010-07-06 Sanyo Electric Co., Ltd. Circuit substrate structure and circuit apparatus
US7760104B2 (en) * 2005-04-08 2010-07-20 Entegris, Inc. Identification tag for fluid containment drum
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
CN101467162B (zh) 2006-06-07 2011-11-23 Nxp股份有限公司 半导体芯片、应答机以及制造应答机的方法
US7531407B2 (en) * 2006-07-18 2009-05-12 International Business Machines Corporation Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same
US20100090832A1 (en) * 2006-08-31 2010-04-15 Francois Bozet Method of protecting a radio frequency identification inlay
US7768407B2 (en) * 2007-06-22 2010-08-03 Avery Dennison Corporation Foldable RFID device interposer and method
FR2927441B1 (fr) * 2008-02-13 2011-06-17 Yannick Grasset Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif
FR2936096B1 (fr) * 2008-09-12 2011-01-28 Yannick Grasset Procede de fabrication d'objets portatifs sans contact
DE102009030818B4 (de) 2009-06-26 2013-04-18 Bundesdruckerei Gmbh Verfahren und Vorrichtung zum Herstellen eines Halbzeugs oder eines das Halbzeug umfassenden Sicherheitsdokuments
US8727744B2 (en) * 2010-02-26 2014-05-20 Entegris, Inc. Method and system for optimizing operation of a pump
US8684705B2 (en) * 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
JP5370581B2 (ja) * 2010-03-24 2013-12-18 株式会社村田製作所 Ｒｆｉｄシステム
TWI563351B (en) 2010-10-20 2016-12-21 Entegris Inc Method and system for pump priming
FI125720B (fi) * 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
US8628018B2 (en) 2012-04-17 2014-01-14 Nxp, B.V. RFID circuit and method
US9418950B2 (en) * 2013-04-24 2016-08-16 Skyworks Solutions, Inc. Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
CN103530579A (zh) * 2013-10-31 2014-01-22 太阳神(珠海)电子有限公司 一种电子产品保密装置及磁头和读卡器
CN104077620A (zh) * 2013-12-03 2014-10-01 北京中电华大电子设计有限责任公司 一种具有安全功能的非接触智能卡电磁场耦合的实现电路
CN106909867B (zh) * 2017-05-05 2023-06-20 成都因纳伟盛科技股份有限公司 具有防水结构的手持式居民身份证阅读器
CN109216900A (zh) * 2017-06-30 2019-01-15 比亚迪股份有限公司 近场通信天线
CN109390676A (zh) * 2017-08-04 2019-02-26 比亚迪股份有限公司 近场通信天线

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US5675345A (en) * 1995-11-21 1997-10-07 Raytheon Company Compact antenna with folded substrate
US6025725A (en) * 1996-12-05 2000-02-15 Massachusetts Institute Of Technology Electrically active resonant structures for wireless monitoring and control
ES2199705T1 (es) * 1997-09-11 2004-03-01 Prec Dynamics Corp Transpondor de identificacion con circuito integrado consistente de materiales organicos.
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6300679B1 (en) * 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
CN1229863C (zh) * 1998-09-09 2005-11-30 精工爱普生株式会社 半导体装置及其制造方法、电路基板和电子装置
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
DE19962194A1 (de) * 1999-12-22 2001-06-28 Flexchip Ag Verfahren zur Herstellung von kontaktierbaren Leiterschleifen für Transponder
JP4190696B2 (ja) * 2000-03-02 2008-12-03 大日本印刷株式会社 アンテナシートおよび非接触式データキャリア
JP2001257471A (ja) * 2000-03-10 2001-09-21 Ngk Insulators Ltd 多層配線基板及びその製造方法
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing

Also Published As

Publication number Publication date
AU2003243162B2 (en) 2008-03-20
CN1312626C (zh) 2007-04-25
US7078304B2 (en) 2006-07-18
TW200306684A (en) 2003-11-16
MY136587A (en) 2008-10-31
WO2003092045A2 (en) 2003-11-06
EP1508162A4 (en) 2008-02-20
AU2003243162A1 (en) 2003-11-10
EP1508162A2 (en) 2005-02-23
WO2003092045A3 (en) 2004-01-15
CN1663331A (zh) 2005-08-31
US6900536B1 (en) 2005-05-31
US20050181537A1 (en) 2005-08-18

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