JP5830711B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
- Publication number
- JP5830711B2 JP5830711B2 JP2010239103A JP2010239103A JP5830711B2 JP 5830711 B2 JP5830711 B2 JP 5830711B2 JP 2010239103 A JP2010239103 A JP 2010239103A JP 2010239103 A JP2010239103 A JP 2010239103A JP 5830711 B2 JP5830711 B2 JP 5830711B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- circuit board
- electrode
- power supply
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002093 peripheral effect Effects 0.000 claims description 31
- 239000010410 layer Substances 0.000 description 33
- 239000000758 substrate Substances 0.000 description 27
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005401 electroluminescence Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- CGIGDMFJXJATDK-UHFFFAOYSA-N indomethacin Chemical compound CC1=C(CC(O)=O)C2=CC(OC)=CC=C2N1C(=O)C1=CC=C(Cl)C=C1 CGIGDMFJXJATDK-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
2 発光部
2a 正電極
2b 発光層
2c 負電極
3 発光パネル
3a 給電電極
3b 給電電極
4 回路基板
41 回路部品
5 ケース部
6 ランド基板(配線用ランド基板)
7 配線
8 配線
9 配線
Claims (5)
- 発光層を正電極及び負電極で挟持させた発光部と、前記正電極及び負電極と電気的に接続された給電電極と、を有する発光パネルと、
前記給電電極に電気的に接続されて前記発光部に電力供給する回路基板と、
前記発光パネル及び前記回路基板を収容するケース部と、を備えた発光モジュールであって、
前記発光パネルの給電電極は、該発光パネルの周縁領域に複数配置され、
前記回路基板は、前記発光パネルの周縁部より中央よりの領域に配置され、
前記給電電極と前記回路基板との電気的接続は、前記発光パネルの中央よりの領域から周縁部に伸びる配線により成されていることを特徴とする有機発光モジュール。 - 前記給電電極は、同じ極性が互いに隣り合わないように配置されていることを特徴とする請求項1に記載の発光モジュール。
- 前記回路基板に搭載される回路部品は、前記発光パネルの中央よりの領域に集中して配置されることを特徴とする請求項1又は請求項2に記載の発光モジュール。
- 前記給電電極よりも中央よりの領域に配置された配線用ランド基板を備え、
前記給電電極と前記回路基板との電気的接続は、前記配線用ランド基板を介在して成されていることを特徴とする請求項1乃至請求項3のいずれか一項に記載の発光モジュール。 - 前記回路基板と前記配線用ランド基板とが分離して配置されていることを特徴とする請求項4に記載の発光モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010239103A JP5830711B2 (ja) | 2010-10-25 | 2010-10-25 | 発光モジュール |
CN201180051707.XA CN103189679B (zh) | 2010-10-25 | 2011-09-29 | 发光模块 |
EP11835988.4A EP2634474A4 (en) | 2010-10-25 | 2011-09-29 | Light emitting module |
PCT/JP2011/072328 WO2012056848A1 (ja) | 2010-10-25 | 2011-09-29 | 発光モジュール |
US13/816,752 US9013096B2 (en) | 2010-10-25 | 2011-09-29 | Light emitting module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010239103A JP5830711B2 (ja) | 2010-10-25 | 2010-10-25 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012094303A JP2012094303A (ja) | 2012-05-17 |
JP5830711B2 true JP5830711B2 (ja) | 2015-12-09 |
Family
ID=45993578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010239103A Expired - Fee Related JP5830711B2 (ja) | 2010-10-25 | 2010-10-25 | 発光モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9013096B2 (ja) |
EP (1) | EP2634474A4 (ja) |
JP (1) | JP5830711B2 (ja) |
CN (1) | CN103189679B (ja) |
WO (1) | WO2012056848A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5789757B2 (ja) * | 2011-03-04 | 2015-10-07 | パナソニックIpマネジメント株式会社 | 照明装置 |
JP6078295B2 (ja) * | 2012-10-29 | 2017-02-08 | 株式会社カネカ | 有機el装置 |
JP2015079737A (ja) * | 2013-09-11 | 2015-04-23 | パナソニックIpマネジメント株式会社 | 発光モジュール |
CH709411B1 (de) * | 2014-03-26 | 2018-03-29 | Ribag Licht Ag | Leuchtelement mit OLED. |
CN106574756B (zh) | 2014-03-27 | 2021-02-05 | 飞利浦灯具控股公司 | 灯具 |
JP2019053994A (ja) * | 2018-11-14 | 2019-04-04 | パイオニア株式会社 | 発光装置及び発光システム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051385A (ja) * | 2001-08-06 | 2003-02-21 | Sony Corp | 表示装置の製造方法 |
KR100702517B1 (ko) * | 2005-05-17 | 2007-04-04 | 엘지전자 주식회사 | 유기 전계 발광 소자 |
EP1933194B1 (en) * | 2006-12-13 | 2014-01-08 | LG Display Co., Ltd. | Backlight unit and liquid crystal display module including the same |
JP5289709B2 (ja) * | 2007-01-09 | 2013-09-11 | 株式会社ジャパンディスプレイ | 調光機能を備えた画像表示装置 |
DE102008013031B4 (de) | 2008-03-07 | 2019-07-25 | Osram Oled Gmbh | Optoelektronisches Bauelement |
US8120257B2 (en) | 2008-06-06 | 2012-02-21 | Rohm Co., Ltd. | Organic electroluminescence lighting device |
JP2009295487A (ja) * | 2008-06-06 | 2009-12-17 | Rohm Co Ltd | 有機el照明装置 |
JP2010003600A (ja) * | 2008-06-23 | 2010-01-07 | Panasonic Electric Works Co Ltd | 面状型照明器具 |
JP5541872B2 (ja) * | 2009-02-26 | 2014-07-09 | パナソニック株式会社 | 面状発光装置および照明器具 |
JP5394106B2 (ja) | 2009-03-26 | 2014-01-22 | パナソニック株式会社 | 面状発光素子に対する給電方法 |
JP5796171B2 (ja) * | 2009-10-27 | 2015-10-21 | パナソニックIpマネジメント株式会社 | 発光モジュール |
JP5559586B2 (ja) * | 2010-04-07 | 2014-07-23 | パナソニック株式会社 | 有機elモジュール |
JP5807177B2 (ja) * | 2010-05-26 | 2015-11-10 | パナソニックIpマネジメント株式会社 | 発光モジュール |
-
2010
- 2010-10-25 JP JP2010239103A patent/JP5830711B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-29 EP EP11835988.4A patent/EP2634474A4/en not_active Withdrawn
- 2011-09-29 CN CN201180051707.XA patent/CN103189679B/zh not_active Expired - Fee Related
- 2011-09-29 WO PCT/JP2011/072328 patent/WO2012056848A1/ja active Application Filing
- 2011-09-29 US US13/816,752 patent/US9013096B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20130134866A1 (en) | 2013-05-30 |
CN103189679A (zh) | 2013-07-03 |
EP2634474A4 (en) | 2018-01-17 |
EP2634474A1 (en) | 2013-09-04 |
JP2012094303A (ja) | 2012-05-17 |
US9013096B2 (en) | 2015-04-21 |
CN103189679B (zh) | 2015-06-03 |
WO2012056848A1 (ja) | 2012-05-03 |
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