ES2161054T3 - Procedimiento de descasquetado de piezas de vidrio. - Google Patents

Procedimiento de descasquetado de piezas de vidrio.

Info

Publication number
ES2161054T3
ES2161054T3 ES98925341T ES98925341T ES2161054T3 ES 2161054 T3 ES2161054 T3 ES 2161054T3 ES 98925341 T ES98925341 T ES 98925341T ES 98925341 T ES98925341 T ES 98925341T ES 2161054 T3 ES2161054 T3 ES 2161054T3
Authority
ES
Spain
Prior art keywords
stage
subjected
action
piece
beams
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98925341T
Other languages
English (en)
Inventor
Georges Cuvelier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2161054T3 publication Critical patent/ES2161054T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C03B33/0955—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Magnetic Heads (AREA)
  • Pulleys (AREA)
  • Output Control And Ontrol Of Special Type Engine (AREA)
  • Pistons, Piston Rings, And Cylinders (AREA)
  • Manufacture, Treatment Of Glass Fibers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Disintegrating Or Milling (AREA)
  • Crushing And Grinding (AREA)

Abstract

Procedimiento de decasquetado de una pieza de vidrio (1) en el cual la pieza de vidrio (1), puesta en rotación sobre un eje (A) queda sometida, en una primera etapa, a la acción de un haz de rayos láser continuo o a unos haces de rayos láser continuos, para definir sobre la pieza que se trata de cortar una zona continua con la que establecen contacto el haz o dichos haces láser continuos, y en una segunda etapa, se somete la zona que ha sido sometida en la primera etapa a la acción de uno o de varios haces de rayos láser continuos, a la acción de por lo menos un haz de láser pulsado enfocado, caracterizado porque en la primera etapa, dicho haz o dichos haces de rayos láser continuos entran en contacto con una parte o varias partes de la citada zona con una densidad de potencia por unidad de superficie inferior a 30 W/mm 2 , yporque, en la segunda etapa, durante sensiblemente una rotación de la pieza (1) que se trata de cortar o durante por lo menos una rotación de la pieza (1) en cuestión,se somete una zona que ha sido sometida en la primera etapa a la acción de uno o varios haces de rayos láser continuos, a la acción de por lo menos un haz de láser pulsado enfocado de una potencia inferior a 250 W, para formar una serie de puntos de impacto sucesivos distantes entre sí, definiendo dicha serie una línea sensiblemente continua en dicha parte, efectuándose el corte sensiblemente a lo largo de dicha línea.
ES98925341T 1997-06-11 1998-06-10 Procedimiento de descasquetado de piezas de vidrio. Expired - Lifetime ES2161054T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9700505A BE1011208A4 (fr) 1997-06-11 1997-06-11 Procede de decalottage de pieces en verre.

Publications (1)

Publication Number Publication Date
ES2161054T3 true ES2161054T3 (es) 2001-11-16

Family

ID=3890567

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98925341T Expired - Lifetime ES2161054T3 (es) 1997-06-11 1998-06-10 Procedimiento de descasquetado de piezas de vidrio.

Country Status (22)

Country Link
US (1) US6438996B1 (es)
EP (1) EP0988255B1 (es)
JP (1) JP2002510271A (es)
KR (1) KR20010013481A (es)
CN (1) CN1248978C (es)
AT (1) ATE203229T1 (es)
AU (1) AU7752798A (es)
BE (1) BE1011208A4 (es)
CA (1) CA2291592A1 (es)
CZ (1) CZ437099A3 (es)
DE (1) DE69801160T2 (es)
DK (1) DK0988255T3 (es)
ES (1) ES2161054T3 (es)
HU (1) HU222139B1 (es)
NO (1) NO996064L (es)
PT (1) PT988255E (es)
RU (1) RU2193537C2 (es)
SI (1) SI0988255T1 (es)
SK (1) SK167399A3 (es)
TR (1) TR199902991T2 (es)
TW (1) TW416894B (es)
WO (1) WO1998056722A1 (es)

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TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
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BE1016686A3 (fr) * 2005-07-18 2007-04-03 Georges Cuvelier Installation pour la realisation d'operations de mise en forme de pieces en verre ou en cristal.
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US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
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JP6056564B2 (ja) 2013-03-08 2017-01-11 株式会社Ihi セラミックマトリックス複合材の加工方法
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US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
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US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
RU2017104427A (ru) * 2014-07-11 2018-08-13 Корнинг Инкорпорейтед Системы и методы резки стекла путем создания перфорации в стеклянных изделиях с применением импульсного оптического квантового генератора
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
JP6788571B2 (ja) 2014-07-14 2020-11-25 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
DE102014013262A1 (de) 2014-09-08 2016-03-10 Schott Ag Vorrichtung und Verfahren zum Durchtrennen von mit einer Geschwindigkeit bewegten Werkstücken mechanisch spröder und nichtmetallischer Werkstoffe
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
KR102546692B1 (ko) 2015-03-24 2023-06-22 코닝 인코포레이티드 디스플레이 유리 조성물의 레이저 절단 및 가공
JP2018516215A (ja) 2015-03-27 2018-06-21 コーニング インコーポレイテッド 気体透過性窓、および、その製造方法
JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6673061B2 (ja) * 2016-07-04 2020-03-25 日本電気硝子株式会社 ガラス物品の製造方法
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JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) * 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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DE102018100443A1 (de) * 2018-01-10 2019-07-11 Schott Ag Verfahren und Vorrichtung zur Herstellung von Glasvorprodukten und von Glasprodukten
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Also Published As

Publication number Publication date
CN1259924A (zh) 2000-07-12
AU7752798A (en) 1998-12-30
BE1011208A4 (fr) 1999-06-01
CZ437099A3 (cs) 2000-07-12
JP2002510271A (ja) 2002-04-02
WO1998056722A1 (fr) 1998-12-17
SK167399A3 (en) 2000-07-11
PT988255E (pt) 2001-12-28
EP0988255B1 (fr) 2001-07-18
NO996064L (no) 2000-02-09
HUP0004651A2 (hu) 2001-05-28
DE69801160D1 (de) 2001-08-23
KR20010013481A (ko) 2001-02-26
HU222139B1 (hu) 2003-04-28
DK0988255T3 (da) 2001-11-05
CA2291592A1 (fr) 1998-12-17
TR199902991T2 (xx) 2000-07-21
TW416894B (en) 2001-01-01
SI0988255T1 (es) 2001-12-31
DE69801160T2 (de) 2002-03-28
NO996064D0 (no) 1999-12-09
RU2193537C2 (ru) 2002-11-27
HUP0004651A3 (en) 2001-06-28
CN1248978C (zh) 2006-04-05
US6438996B1 (en) 2002-08-27
ATE203229T1 (de) 2001-08-15
EP0988255A1 (fr) 2000-03-29

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