NO996064D0 - Fremgangsmåte for knusing av glassvarer - Google Patents

Fremgangsmåte for knusing av glassvarer

Info

Publication number
NO996064D0
NO996064D0 NO996064A NO996064A NO996064D0 NO 996064 D0 NO996064 D0 NO 996064D0 NO 996064 A NO996064 A NO 996064A NO 996064 A NO996064 A NO 996064A NO 996064 D0 NO996064 D0 NO 996064D0
Authority
NO
Norway
Prior art keywords
subjected
laser radiation
cracked
action
glassware
Prior art date
Application number
NO996064A
Other languages
English (en)
Other versions
NO996064L (no
Inventor
Georges Cuvelier
Original Assignee
Georges Cuvelier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georges Cuvelier filed Critical Georges Cuvelier
Publication of NO996064D0 publication Critical patent/NO996064D0/no
Publication of NO996064L publication Critical patent/NO996064L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • C03B33/0955—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Magnetic Heads (AREA)
  • Disintegrating Or Milling (AREA)
  • Crushing And Grinding (AREA)
  • Manufacture, Treatment Of Glass Fibers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Pistons, Piston Rings, And Cylinders (AREA)
  • Pulleys (AREA)
  • Output Control And Ontrol Of Special Type Engine (AREA)
NO996064A 1997-06-11 1999-12-09 Fremgangsmåte for avknekking av glassvarer NO996064L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9700505A BE1011208A4 (fr) 1997-06-11 1997-06-11 Procede de decalottage de pieces en verre.
PCT/BE1998/000085 WO1998056722A1 (fr) 1997-06-11 1998-06-10 Procede de decalottage de pieces en verre

Publications (2)

Publication Number Publication Date
NO996064D0 true NO996064D0 (no) 1999-12-09
NO996064L NO996064L (no) 2000-02-09

Family

ID=3890567

Family Applications (1)

Application Number Title Priority Date Filing Date
NO996064A NO996064L (no) 1997-06-11 1999-12-09 Fremgangsmåte for avknekking av glassvarer

Country Status (22)

Country Link
US (1) US6438996B1 (no)
EP (1) EP0988255B1 (no)
JP (1) JP2002510271A (no)
KR (1) KR20010013481A (no)
CN (1) CN1248978C (no)
AT (1) ATE203229T1 (no)
AU (1) AU7752798A (no)
BE (1) BE1011208A4 (no)
CA (1) CA2291592A1 (no)
CZ (1) CZ437099A3 (no)
DE (1) DE69801160T2 (no)
DK (1) DK0988255T3 (no)
ES (1) ES2161054T3 (no)
HU (1) HU222139B1 (no)
NO (1) NO996064L (no)
PT (1) PT988255E (no)
RU (1) RU2193537C2 (no)
SI (1) SI0988255T1 (no)
SK (1) SK167399A3 (no)
TR (1) TR199902991T2 (no)
TW (1) TW416894B (no)
WO (1) WO1998056722A1 (no)

Families Citing this family (64)

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JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
BE1013787A3 (fr) * 2000-10-24 2002-08-06 Cuvelier Georges Procede et installation pour la decoupe de pieces en verre.
CN100410196C (zh) * 2001-11-08 2008-08-13 夏普株式会社 切割玻璃基体的方法和装置、液晶板以及制造液晶板的装置
ES2356817T3 (es) 2002-03-12 2011-04-13 Hamamatsu Photonics K.K. Método de corte de un objeto procesado.
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
ATE362653T1 (de) 2002-03-12 2007-06-15 Hamamatsu Photonics Kk Methode zur trennung von substraten
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
US8685838B2 (en) 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
DE102004035342B4 (de) 2004-07-21 2007-12-27 Schott Ag Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen
BE1016686A3 (fr) * 2005-07-18 2007-04-03 Georges Cuvelier Installation pour la realisation d'operations de mise en forme de pieces en verre ou en cristal.
ES2436775T3 (es) * 2007-02-28 2014-01-07 Ceramtec Gmbh Procedimiento para la producción de una pieza constructiva mediando utilización de una introducción asimétrica de energía a lo largo de la línea de separación o de rotura nominal
TWI414383B (zh) * 2008-06-25 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Angle processing device
CN102765876A (zh) * 2011-05-05 2012-11-07 上海镭立激光科技有限公司 一种激光自聚焦穿丝玻璃切割方法
RU2528287C2 (ru) * 2012-05-15 2014-09-10 Открытое Акционерное Общество "Научно-Исследовательский Институт Технического Стекла" Способ лазерной резки хрупких неметаллических материалов и устройство для его осуществления
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP6056564B2 (ja) * 2013-03-08 2017-01-11 株式会社Ihi セラミックマトリックス複合材の加工方法
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016007843A1 (en) * 2014-07-11 2016-01-14 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
JP2017530867A (ja) * 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
DE102014013262A1 (de) 2014-09-08 2016-03-10 Schott Ag Vorrichtung und Verfahren zum Durchtrennen von mit einer Geschwindigkeit bewegten Werkstücken mechanisch spröder und nichtmetallischer Werkstoffe
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
KR102499697B1 (ko) 2015-07-10 2023-02-14 코닝 인코포레이티드 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6673061B2 (ja) * 2016-07-04 2020-03-25 日本電気硝子株式会社 ガラス物品の製造方法
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
DE102018100443A1 (de) * 2018-01-10 2019-07-11 Schott Ag Verfahren und Vorrichtung zur Herstellung von Glasvorprodukten und von Glasprodukten
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
DE202019005592U1 (de) * 2019-01-22 2021-02-08 Hegla Gmbh & Co. Kg Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel
RU2719862C1 (ru) * 2019-08-29 2020-04-23 Общество С Ограниченной Ответственностью "Пелком Дубна Машиностроительный Завод" Способ обработки полых стеклоизделий и лазерная установка для его осуществления
FR3118025B3 (fr) * 2020-12-17 2022-12-09 Arc France Procédé de fabrication d’un article creux en verre
CN117464202B (zh) * 2023-12-27 2024-04-16 苏州禧屋新材料科技股份有限公司 一种玻璃钢复合板材用切割装置

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Also Published As

Publication number Publication date
BE1011208A4 (fr) 1999-06-01
DE69801160T2 (de) 2002-03-28
HUP0004651A2 (hu) 2001-05-28
SI0988255T1 (no) 2001-12-31
US6438996B1 (en) 2002-08-27
EP0988255B1 (fr) 2001-07-18
PT988255E (pt) 2001-12-28
ES2161054T3 (es) 2001-11-16
CN1248978C (zh) 2006-04-05
JP2002510271A (ja) 2002-04-02
CZ437099A3 (cs) 2000-07-12
EP0988255A1 (fr) 2000-03-29
NO996064L (no) 2000-02-09
TW416894B (en) 2001-01-01
CA2291592A1 (fr) 1998-12-17
DK0988255T3 (da) 2001-11-05
TR199902991T2 (xx) 2000-07-21
KR20010013481A (ko) 2001-02-26
CN1259924A (zh) 2000-07-12
ATE203229T1 (de) 2001-08-15
SK167399A3 (en) 2000-07-11
WO1998056722A1 (fr) 1998-12-17
HUP0004651A3 (en) 2001-06-28
HU222139B1 (hu) 2003-04-28
AU7752798A (en) 1998-12-30
DE69801160D1 (de) 2001-08-23
RU2193537C2 (ru) 2002-11-27

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application