ES2138954T3 - Pegamento por fusion reactivo. - Google Patents

Pegamento por fusion reactivo.

Info

Publication number
ES2138954T3
ES2138954T3 ES89114490T ES89114490T ES2138954T3 ES 2138954 T3 ES2138954 T3 ES 2138954T3 ES 89114490 T ES89114490 T ES 89114490T ES 89114490 T ES89114490 T ES 89114490T ES 2138954 T3 ES2138954 T3 ES 2138954T3
Authority
ES
Spain
Prior art keywords
epoxy
resin component
groups
room temperature
polyoxypropylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES89114490T
Other languages
English (en)
Spanish (es)
Inventor
Hubert Dr Schenkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Teroson GmbH
Original Assignee
Henkel Teroson GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Teroson GmbH filed Critical Henkel Teroson GmbH
Application granted granted Critical
Publication of ES2138954T3 publication Critical patent/ES2138954T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/10Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
ES89114490T 1988-08-10 1989-08-05 Pegamento por fusion reactivo. Expired - Lifetime ES2138954T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3827626A DE3827626A1 (de) 1988-08-10 1988-08-10 Reaktiver schmelzklebstoff

Publications (1)

Publication Number Publication Date
ES2138954T3 true ES2138954T3 (es) 2000-02-01

Family

ID=6360865

Family Applications (1)

Application Number Title Priority Date Filing Date
ES89114490T Expired - Lifetime ES2138954T3 (es) 1988-08-10 1989-08-05 Pegamento por fusion reactivo.

Country Status (8)

Country Link
US (1) US5084532A (OSRAM)
EP (1) EP0354498B1 (OSRAM)
JP (1) JP2689992B2 (OSRAM)
AT (1) ATE185830T1 (OSRAM)
AU (1) AU627757B2 (OSRAM)
CA (1) CA1341122C (OSRAM)
DE (2) DE3827626A1 (OSRAM)
ES (1) ES2138954T3 (OSRAM)

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DE4342722A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
DE4342721A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
US6162504A (en) * 1997-12-04 2000-12-19 Henkel Corporation Adhesives and sealants containing adhesion promoter comprising waste powder prime
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
DE19909270A1 (de) 1999-03-03 2000-09-07 Henkel Teroson Gmbh Hitzehärtbarer, thermisch expandierbarer Formkörper
KR20020089439A (ko) 2000-04-10 2002-11-29 헨켈 코만디트게젤샤프트 아우프 악티엔 내충격성 에폭시 수지 조성물
DE10062009A1 (de) * 2000-12-13 2002-07-04 Henkel Teroson Gmbh Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US7176044B2 (en) 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
DE10312815A1 (de) 2003-03-22 2004-10-07 Henkel Kgaa Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
KR101352811B1 (ko) * 2006-07-31 2014-02-17 헨켈 아게 운트 코. 카게아아 경화성 에폭시 수지-기재 접착성 조성물
US7759435B2 (en) * 2006-09-26 2010-07-20 Loctite (R&D) Limited Adducts and curable compositions using same
CA2665551A1 (en) 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
KR101433982B1 (ko) * 2006-10-25 2014-08-25 헨켈 아일랜드 리미티드 이미늄염 및 이러한 신규 이미늄염을 사용하는 전자 결핍 올레핀의 제조 방법
DE102007027595A1 (de) 2007-06-12 2008-12-18 Henkel Ag & Co. Kgaa Klebstoffzusammensetzungen
EP2173810A4 (en) * 2007-07-26 2012-07-25 Henkel Corp CURABLE ADHESIVE COMPOSITIONS BASED ON EPOXY RESIN
US20090104448A1 (en) * 2007-10-17 2009-04-23 Henkel Ag & Co. Kgaa Preformed adhesive bodies useful for joining substrates
EP2205692B1 (en) * 2007-10-30 2020-02-19 Henkel AG & Co. KGaA Epoxy paste adhesives resistant to wash-off
US20090188269A1 (en) * 2008-01-25 2009-07-30 Henkel Corporation High pressure connection systems and methods for their manufacture
DE102008009371A1 (de) 2008-02-14 2009-08-20 Henkel Ag & Co. Kgaa Verfahren zur Herstellung eines Wärmetauschers
DE102008023276A1 (de) 2008-05-13 2009-11-19 Henkel Ag & Co. Kgaa Verbinden von Rohren mit thermisch härtbaren Klebstoffen
ES2662646T3 (es) * 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación
DE102008034105A1 (de) 2008-07-21 2010-01-28 Henkel Ag & Co. Kgaa Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff
DE102009028100A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis
DE102009028180A1 (de) 2009-08-03 2011-02-10 Henkel Ag & Co. Kgaa Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator
US8518208B2 (en) * 2009-08-31 2013-08-27 Cytec Technology Corp. High performance adhesive compositions
DE102009045903A1 (de) 2009-10-21 2011-04-28 Henkel Ag & Co. Kgaa Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis
DE102010004792A1 (de) 2010-01-16 2011-07-28 Aktiebolaget Skf Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil
JP5597498B2 (ja) * 2010-09-22 2014-10-01 電気化学工業株式会社 エポキシ樹脂組成物、回路基板及び発光装置
EP2619268A4 (en) 2010-09-23 2017-03-29 Henkel IP & Holding GmbH Chemical vapor resistant epoxy composition
DE102011003915A1 (de) 2011-02-10 2012-08-16 Aktiebolaget Skf Dichtungsanordnung
DE102011005500A1 (de) 2011-03-14 2012-09-20 Aktiebolaget Skf Lagerring eines Gleit- oder Wälzlagers
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
WO2016179010A1 (en) 2015-05-01 2016-11-10 Lord Corporation Adhesive for rubber bonding
WO2017150521A1 (ja) 2016-02-29 2017-09-08 三菱ケミカル株式会社 エポキシ樹脂組成物、成形材料および繊維強化複合材料
BR112019018954B1 (pt) 2017-03-13 2023-01-17 Zephyros, Inc Painel intercalado compósito que compreende núcleo alveolar e camada de material de amortecimento ou atenuação
CN110536914B (zh) 2017-04-12 2023-03-14 三菱化学株式会社 片状模塑料及纤维增强复合材料
WO2019116348A1 (en) 2017-12-15 2019-06-20 3M Innovative Properties Company High temperature structural adhesive films
WO2020022797A1 (ko) * 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
KR102230946B1 (ko) 2018-07-25 2021-03-23 주식회사 엘지화학 접착제 조성물
EP3816253B1 (en) 2018-07-25 2024-06-26 Lg Chem, Ltd. Adhesive composition
WO2020022795A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
US12146079B2 (en) 2018-07-25 2024-11-19 Lg Chem, Ltd. Adhesive composition
EP3816254B1 (en) 2018-07-25 2023-02-22 Lg Chem, Ltd. Adhesive composition
US12173194B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
EP3848405B1 (en) 2018-09-05 2024-01-17 Mitsubishi Chemical Corporation Sheet molding compound and fiber-reinforced composite material
WO2021060486A1 (ja) 2019-09-27 2021-04-01 株式会社カネカ 接着剤、および接着剤の製造方法
EP3822078A1 (de) * 2019-11-15 2021-05-19 voestalpine Stahl GmbH Elektroband oder -blech, verfahren zur herstellung solch eines elektrobands oder -blechs sowie blechpaket daraus

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DE2659928C2 (de) * 1976-01-22 1982-12-23 Hoechst Ag, 6000 Frankfurt Wäßrige Epoxidharzdispersionen, Verfahren zur Herstellung und Verwendung derselben
DE2659989C2 (de) * 1976-01-22 1982-10-21 Hoechst Ag, 6000 Frankfurt Wäßrige Epoxidharzdispersionen Verfahren zur Herstellung und Verwendung derselben
DE3108073C2 (de) * 1981-03-04 1983-10-06 Basf Farben + Fasern Ag, 2000 Hamburg Wasserdispergierbare Bindemittel für kationische Elektrotauchlacke
DE3202300C1 (de) * 1982-01-26 1983-07-28 Th. Goldschmidt Ag, 4300 Essen Verfahren zum Flexibilisieren von Epoxidharzen
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Also Published As

Publication number Publication date
AU627757B2 (en) 1992-09-03
DE3827626C2 (OSRAM) 1991-03-07
EP0354498A2 (de) 1990-02-14
JP2689992B2 (ja) 1997-12-10
DE58909861D1 (de) 1999-11-25
DE3827626A1 (de) 1990-03-08
EP0354498A3 (de) 1991-07-03
CA1341122C (en) 2000-10-17
JPH0288685A (ja) 1990-03-28
ATE185830T1 (de) 1999-11-15
EP0354498B1 (de) 1999-10-20
AU3932289A (en) 1990-02-15
US5084532A (en) 1992-01-28

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