CA1341122C - Reactive hot-melt adhesive - Google Patents
Reactive hot-melt adhesiveInfo
- Publication number
- CA1341122C CA1341122C CA000607945A CA607945A CA1341122C CA 1341122 C CA1341122 C CA 1341122C CA 000607945 A CA000607945 A CA 000607945A CA 607945 A CA607945 A CA 607945A CA 1341122 C CA1341122 C CA 1341122C
- Authority
- CA
- Canada
- Prior art keywords
- epoxy
- melt adhesive
- reactive hot
- epoxy resin
- adhesive according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- -1 polyoxypropylene Polymers 0.000 claims abstract description 10
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 9
- 125000003277 amino group Chemical group 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 5
- 239000000654 additive Substances 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 230000009974 thixotropic effect Effects 0.000 claims description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 20
- 230000001070 adhesive effect Effects 0.000 abstract description 20
- 239000013008 thixotropic agent Substances 0.000 abstract 1
- 206010040844 Skin exfoliation Diseases 0.000 description 11
- 239000002184 metal Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101100128404 Caenorhabditis elegans lir-3 gene Proteins 0.000 description 1
- 241000272470 Circus Species 0.000 description 1
- 101150013573 INVE gene Proteins 0.000 description 1
- 101100005318 Mus musculus Ctsr gene Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001298 alcohols Chemical group 0.000 description 1
- WMGSQTMJHBYJMQ-UHFFFAOYSA-N aluminum;magnesium;silicate Chemical compound [Mg+2].[Al+3].[O-][Si]([O-])([O-])[O-] WMGSQTMJHBYJMQ-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 101150076562 virB gene Proteins 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3827626A DE3827626A1 (de) | 1988-08-10 | 1988-08-10 | Reaktiver schmelzklebstoff |
| DEP3827626.7 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1341122C true CA1341122C (en) | 2000-10-17 |
Family
ID=6360865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000607945A Expired - Fee Related CA1341122C (en) | 1988-08-10 | 1989-08-10 | Reactive hot-melt adhesive |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5084532A (OSRAM) |
| EP (1) | EP0354498B1 (OSRAM) |
| JP (1) | JP2689992B2 (OSRAM) |
| AT (1) | ATE185830T1 (OSRAM) |
| AU (1) | AU627757B2 (OSRAM) |
| CA (1) | CA1341122C (OSRAM) |
| DE (2) | DE3827626A1 (OSRAM) |
| ES (1) | ES2138954T3 (OSRAM) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4023145A1 (de) * | 1990-07-20 | 1992-01-23 | Thera Ges Fuer Patente | Copolymerisierbare zusammensetzung, diese enthaltende haertbare harzmasse und ihre verwendung |
| CA2112410C (en) * | 1991-06-26 | 2003-12-09 | Norman E. Blank | Reactive hot-melt adhesive |
| DE4342722A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| DE4342721A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| US5708056A (en) * | 1995-12-04 | 1998-01-13 | Delco Electronics Corporation | Hot melt epoxy encapsulation material |
| US6162504A (en) * | 1997-12-04 | 2000-12-19 | Henkel Corporation | Adhesives and sealants containing adhesion promoter comprising waste powder prime |
| US20040181013A1 (en) * | 1998-10-06 | 2004-09-16 | Henkel Teroson Gmbh | Impact resistant epoxide resin compositions |
| DE19858921A1 (de) | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Schlagfeste Epoxidharz-Zusammensetzungen |
| DE19909270A1 (de) | 1999-03-03 | 2000-09-07 | Henkel Teroson Gmbh | Hitzehärtbarer, thermisch expandierbarer Formkörper |
| KR20020089439A (ko) | 2000-04-10 | 2002-11-29 | 헨켈 코만디트게젤샤프트 아우프 악티엔 | 내충격성 에폭시 수지 조성물 |
| DE10062009A1 (de) * | 2000-12-13 | 2002-07-04 | Henkel Teroson Gmbh | Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis |
| DE10163859A1 (de) * | 2001-12-22 | 2003-07-10 | Henkel Kgaa | Mehrphasige Strukturklebstoffe |
| US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
| US7176044B2 (en) | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
| KR101303246B1 (ko) * | 2005-08-24 | 2013-09-06 | 헨켈 아일랜드 리미티드 | 개선된 내충격성을 갖는 에폭시 조성물 |
| KR101352811B1 (ko) * | 2006-07-31 | 2014-02-17 | 헨켈 아게 운트 코. 카게아아 | 경화성 에폭시 수지-기재 접착성 조성물 |
| US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| CA2665551A1 (en) | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| KR101433982B1 (ko) * | 2006-10-25 | 2014-08-25 | 헨켈 아일랜드 리미티드 | 이미늄염 및 이러한 신규 이미늄염을 사용하는 전자 결핍 올레핀의 제조 방법 |
| DE102007027595A1 (de) | 2007-06-12 | 2008-12-18 | Henkel Ag & Co. Kgaa | Klebstoffzusammensetzungen |
| EP2173810A4 (en) * | 2007-07-26 | 2012-07-25 | Henkel Corp | CURABLE ADHESIVE COMPOSITIONS BASED ON EPOXY RESIN |
| US20090104448A1 (en) * | 2007-10-17 | 2009-04-23 | Henkel Ag & Co. Kgaa | Preformed adhesive bodies useful for joining substrates |
| EP2205692B1 (en) * | 2007-10-30 | 2020-02-19 | Henkel AG & Co. KGaA | Epoxy paste adhesives resistant to wash-off |
| US20090188269A1 (en) * | 2008-01-25 | 2009-07-30 | Henkel Corporation | High pressure connection systems and methods for their manufacture |
| DE102008009371A1 (de) | 2008-02-14 | 2009-08-20 | Henkel Ag & Co. Kgaa | Verfahren zur Herstellung eines Wärmetauschers |
| DE102008023276A1 (de) | 2008-05-13 | 2009-11-19 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mit thermisch härtbaren Klebstoffen |
| ES2662646T3 (es) * | 2008-06-12 | 2018-04-09 | Henkel IP & Holding GmbH | Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación |
| DE102008034105A1 (de) | 2008-07-21 | 2010-01-28 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff |
| DE102009028100A1 (de) * | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis |
| DE102009028180A1 (de) | 2009-08-03 | 2011-02-10 | Henkel Ag & Co. Kgaa | Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator |
| US8518208B2 (en) * | 2009-08-31 | 2013-08-27 | Cytec Technology Corp. | High performance adhesive compositions |
| DE102009045903A1 (de) | 2009-10-21 | 2011-04-28 | Henkel Ag & Co. Kgaa | Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis |
| DE102010004792A1 (de) | 2010-01-16 | 2011-07-28 | Aktiebolaget Skf | Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil |
| JP5597498B2 (ja) * | 2010-09-22 | 2014-10-01 | 電気化学工業株式会社 | エポキシ樹脂組成物、回路基板及び発光装置 |
| EP2619268A4 (en) | 2010-09-23 | 2017-03-29 | Henkel IP & Holding GmbH | Chemical vapor resistant epoxy composition |
| DE102011003915A1 (de) | 2011-02-10 | 2012-08-16 | Aktiebolaget Skf | Dichtungsanordnung |
| DE102011005500A1 (de) | 2011-03-14 | 2012-09-20 | Aktiebolaget Skf | Lagerring eines Gleit- oder Wälzlagers |
| US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
| DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| WO2016179010A1 (en) | 2015-05-01 | 2016-11-10 | Lord Corporation | Adhesive for rubber bonding |
| WO2017150521A1 (ja) | 2016-02-29 | 2017-09-08 | 三菱ケミカル株式会社 | エポキシ樹脂組成物、成形材料および繊維強化複合材料 |
| BR112019018954B1 (pt) | 2017-03-13 | 2023-01-17 | Zephyros, Inc | Painel intercalado compósito que compreende núcleo alveolar e camada de material de amortecimento ou atenuação |
| CN110536914B (zh) | 2017-04-12 | 2023-03-14 | 三菱化学株式会社 | 片状模塑料及纤维增强复合材料 |
| WO2019116348A1 (en) | 2017-12-15 | 2019-06-20 | 3M Innovative Properties Company | High temperature structural adhesive films |
| WO2020022797A1 (ko) * | 2018-07-25 | 2020-01-30 | 주식회사 엘지화학 | 접착제 조성물 |
| KR102230946B1 (ko) | 2018-07-25 | 2021-03-23 | 주식회사 엘지화학 | 접착제 조성물 |
| EP3816253B1 (en) | 2018-07-25 | 2024-06-26 | Lg Chem, Ltd. | Adhesive composition |
| WO2020022795A1 (ko) | 2018-07-25 | 2020-01-30 | 주식회사 엘지화학 | 접착제 조성물 |
| US12146079B2 (en) | 2018-07-25 | 2024-11-19 | Lg Chem, Ltd. | Adhesive composition |
| EP3816254B1 (en) | 2018-07-25 | 2023-02-22 | Lg Chem, Ltd. | Adhesive composition |
| US12173194B2 (en) | 2018-07-25 | 2024-12-24 | Lg Chem, Ltd. | Adhesive composition |
| EP3848405B1 (en) | 2018-09-05 | 2024-01-17 | Mitsubishi Chemical Corporation | Sheet molding compound and fiber-reinforced composite material |
| WO2021060486A1 (ja) | 2019-09-27 | 2021-04-01 | 株式会社カネカ | 接着剤、および接着剤の製造方法 |
| EP3822078A1 (de) * | 2019-11-15 | 2021-05-19 | voestalpine Stahl GmbH | Elektroband oder -blech, verfahren zur herstellung solch eines elektrobands oder -blechs sowie blechpaket daraus |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3299169A (en) * | 1961-09-18 | 1967-01-17 | Dow Chemical Co | Elastomeric epoxy resin |
| FR2125244A1 (en) * | 1971-02-11 | 1972-09-29 | Du Pont | Epoxy resin compn |
| DE2659928C2 (de) * | 1976-01-22 | 1982-12-23 | Hoechst Ag, 6000 Frankfurt | Wäßrige Epoxidharzdispersionen, Verfahren zur Herstellung und Verwendung derselben |
| DE2659989C2 (de) * | 1976-01-22 | 1982-10-21 | Hoechst Ag, 6000 Frankfurt | Wäßrige Epoxidharzdispersionen Verfahren zur Herstellung und Verwendung derselben |
| DE3108073C2 (de) * | 1981-03-04 | 1983-10-06 | Basf Farben + Fasern Ag, 2000 Hamburg | Wasserdispergierbare Bindemittel für kationische Elektrotauchlacke |
| DE3202300C1 (de) * | 1982-01-26 | 1983-07-28 | Th. Goldschmidt Ag, 4300 Essen | Verfahren zum Flexibilisieren von Epoxidharzen |
| US4403078A (en) * | 1982-09-07 | 1983-09-06 | Texaco Inc. | Epoxy resin composition |
| US4423170A (en) * | 1982-10-15 | 1983-12-27 | Texaco Inc. | One component water reduced epoxy adhesives |
| US4514530A (en) * | 1983-07-05 | 1985-04-30 | Texaco Inc. | Modified amine curing agents and epoxy resins cured therewith |
| US4552933A (en) * | 1983-07-05 | 1985-11-12 | Texaco Inc. | Extended amine curing agents and epoxy resins cured therewith |
| EP0130741A1 (en) * | 1983-07-05 | 1985-01-09 | Texaco Development Corporation | Extended amine curing agents and epoxy resins cured therewith |
| US4578412A (en) * | 1983-07-05 | 1986-03-25 | Texaco Inc. | Extended amine curing agents [and epoxy resins cured therewith] |
| DE3409188A1 (de) * | 1984-03-14 | 1985-09-19 | Basf Farben + Fasern Ag, 2000 Hamburg | Mit alkoholen modifizierte polyepoxide, ihre herstellung und verwendung in haertbaren mischungen |
| JPS61188478A (ja) * | 1985-02-18 | 1986-08-22 | Toagosei Chem Ind Co Ltd | 接着剤組成物 |
| US4734468A (en) * | 1986-02-28 | 1988-03-29 | Shell Oil Company | Epoxy resin composition |
| US4728384A (en) * | 1986-06-23 | 1988-03-01 | Ashland Oil, Inc. | Two component epoxy structural adhesives with improved flexibility |
| JPS63308026A (ja) * | 1987-06-09 | 1988-12-15 | Mitsubishi Kasei Corp | 繊維強化プラスチック用樹脂組成物 |
| US4912179A (en) * | 1988-03-30 | 1990-03-27 | Toa Nenryo Kogyo Kabushiki Kaisha | Bisphenol A epoxy resin mixtures with aromatic di-secondary amine |
-
1988
- 1988-08-10 DE DE3827626A patent/DE3827626A1/de active Granted
-
1989
- 1989-08-04 AU AU39322/89A patent/AU627757B2/en not_active Ceased
- 1989-08-05 EP EP89114490A patent/EP0354498B1/de not_active Expired - Lifetime
- 1989-08-05 ES ES89114490T patent/ES2138954T3/es not_active Expired - Lifetime
- 1989-08-05 DE DE58909861T patent/DE58909861D1/de not_active Expired - Lifetime
- 1989-08-05 AT AT89114490T patent/ATE185830T1/de not_active IP Right Cessation
- 1989-08-07 US US07/390,140 patent/US5084532A/en not_active Expired - Lifetime
- 1989-08-09 JP JP1204934A patent/JP2689992B2/ja not_active Expired - Lifetime
- 1989-08-10 CA CA000607945A patent/CA1341122C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU627757B2 (en) | 1992-09-03 |
| ES2138954T3 (es) | 2000-02-01 |
| DE3827626C2 (OSRAM) | 1991-03-07 |
| EP0354498A2 (de) | 1990-02-14 |
| JP2689992B2 (ja) | 1997-12-10 |
| DE58909861D1 (de) | 1999-11-25 |
| DE3827626A1 (de) | 1990-03-08 |
| EP0354498A3 (de) | 1991-07-03 |
| JPH0288685A (ja) | 1990-03-28 |
| ATE185830T1 (de) | 1999-11-15 |
| EP0354498B1 (de) | 1999-10-20 |
| AU3932289A (en) | 1990-02-15 |
| US5084532A (en) | 1992-01-28 |
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