EP2978020A1 - Gehäusesubstrat - Google Patents
Gehäusesubstrat Download PDFInfo
- Publication number
- EP2978020A1 EP2978020A1 EP15174307.7A EP15174307A EP2978020A1 EP 2978020 A1 EP2978020 A1 EP 2978020A1 EP 15174307 A EP15174307 A EP 15174307A EP 2978020 A1 EP2978020 A1 EP 2978020A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- package substrate
- groove
- redistribution structure
- molding layer
- redistribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000000465 moulding Methods 0.000 claims abstract description 52
- 230000003044 adaptive effect Effects 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 20
- 238000005336 cracking Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 93
- 239000004065 semiconductor Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012956 testing procedure Methods 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/341,197 US9627285B2 (en) | 2014-07-25 | 2014-07-25 | Package substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2978020A1 true EP2978020A1 (de) | 2016-01-27 |
EP2978020B1 EP2978020B1 (de) | 2020-10-14 |
Family
ID=53969073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15174307.7A Active EP2978020B1 (de) | 2014-07-25 | 2015-06-29 | Gehäusesubstrat |
Country Status (5)
Country | Link |
---|---|
US (2) | US9627285B2 (de) |
EP (1) | EP2978020B1 (de) |
JP (1) | JP2016032102A (de) |
CN (1) | CN204651304U (de) |
TW (1) | TWI578458B (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10244793B2 (en) | 2005-07-19 | 2019-04-02 | Juul Labs, Inc. | Devices for vaporization of a substance |
US10279934B2 (en) | 2013-03-15 | 2019-05-07 | Juul Labs, Inc. | Fillable vaporizer cartridge and method of filling |
USD842536S1 (en) | 2016-07-28 | 2019-03-05 | Juul Labs, Inc. | Vaporizer cartridge |
US10058129B2 (en) | 2013-12-23 | 2018-08-28 | Juul Labs, Inc. | Vaporization device systems and methods |
US20160366947A1 (en) | 2013-12-23 | 2016-12-22 | James Monsees | Vaporizer apparatus |
US10159282B2 (en) | 2013-12-23 | 2018-12-25 | Juul Labs, Inc. | Cartridge for use with a vaporizer device |
USD825102S1 (en) | 2016-07-28 | 2018-08-07 | Juul Labs, Inc. | Vaporizer device with cartridge |
KR102256889B1 (ko) | 2013-12-23 | 2021-05-31 | 쥴 랩스, 인크. | 기화 디바이스 시스템 및 방법 |
US10076139B2 (en) | 2013-12-23 | 2018-09-18 | Juul Labs, Inc. | Vaporizer apparatus |
US9627285B2 (en) * | 2014-07-25 | 2017-04-18 | Dyi-chung Hu | Package substrate |
US10319607B2 (en) * | 2014-08-22 | 2019-06-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package structure with organic interposer |
JP2016058596A (ja) * | 2014-09-11 | 2016-04-21 | ソニー株式会社 | 電子デバイス、部品実装基板及び電子機器 |
KR102627987B1 (ko) | 2014-12-05 | 2024-01-22 | 쥴 랩스, 인크. | 교정된 투여량 제어 |
US9859202B2 (en) * | 2015-06-24 | 2018-01-02 | Dyi-chung Hu | Spacer connector |
US9735079B2 (en) * | 2015-10-08 | 2017-08-15 | Dyi-chung Hu | Molding compound wrapped package substrate |
DE202017007467U1 (de) | 2016-02-11 | 2021-12-08 | Juul Labs, Inc. | Befüllbare Verdampferkartusche |
EP3419443A4 (de) | 2016-02-11 | 2019-11-20 | Juul Labs, Inc. | Sicheres befestigen von kartuschen für verdampfervorrichtungen |
US10405582B2 (en) | 2016-03-10 | 2019-09-10 | Pax Labs, Inc. | Vaporization device with lip sensing |
US9806061B2 (en) | 2016-03-31 | 2017-10-31 | Altera Corporation | Bumpless wafer level fan-out package |
USD849996S1 (en) | 2016-06-16 | 2019-05-28 | Pax Labs, Inc. | Vaporizer cartridge |
USD836541S1 (en) | 2016-06-23 | 2018-12-25 | Pax Labs, Inc. | Charging device |
USD851830S1 (en) | 2016-06-23 | 2019-06-18 | Pax Labs, Inc. | Combined vaporizer tamp and pick tool |
JP2018006724A (ja) * | 2016-06-23 | 2018-01-11 | 京セラ株式会社 | 配線基板 |
TWI669797B (zh) * | 2016-11-16 | 2019-08-21 | 矽品精密工業股份有限公司 | 電子裝置及其製法與基板結構 |
US10541153B2 (en) * | 2017-08-03 | 2020-01-21 | General Electric Company | Electronics package with integrated interconnect structure and method of manufacturing thereof |
US20190043794A1 (en) * | 2017-08-03 | 2019-02-07 | General Electric Company | Electronics package including integrated structure with backside functionality and method of manufacturing thereof |
US10804115B2 (en) | 2017-08-03 | 2020-10-13 | General Electric Company | Electronics package with integrated interconnect structure and method of manufacturing thereof |
US10541209B2 (en) * | 2017-08-03 | 2020-01-21 | General Electric Company | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof |
USD887632S1 (en) | 2017-09-14 | 2020-06-16 | Pax Labs, Inc. | Vaporizer cartridge |
US10797007B2 (en) * | 2017-11-28 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
US10535622B2 (en) * | 2017-12-07 | 2020-01-14 | Dyi-chung Hu | Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer |
US11152315B2 (en) * | 2019-10-15 | 2021-10-19 | Advanced Semiconductor Engineering, Inc. | Electronic device package and method for manufacturing the same |
KR20210082638A (ko) * | 2019-12-26 | 2021-07-06 | 삼성전자주식회사 | 패키지 기판 및 이를 포함하는 반도체 패키지 |
TWI820402B (zh) | 2021-03-08 | 2023-11-01 | 欣興電子股份有限公司 | 嵌有中介基板之線路板及其形成方法 |
US20220361338A1 (en) * | 2021-05-07 | 2022-11-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package with stress reduction design and method for forming the same |
TWI788099B (zh) * | 2021-11-15 | 2022-12-21 | 大陸商芯愛科技(南京)有限公司 | 電子封裝件及其封裝基板 |
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US20040007770A1 (en) * | 2002-07-09 | 2004-01-15 | Kenichi Kurihara | Semiconductor-mounting substrate used to manufacture electronic packages, and production process for producing such semiconductor-mounting substrate |
US8269337B2 (en) | 2010-12-14 | 2012-09-18 | Unimicron Technology Corporation | Packaging substrate having through-holed interposer embedded therein and fabrication method thereof |
EP2555240A1 (de) * | 2011-08-05 | 2013-02-06 | Unimicron Technology Corp. | Verpackungssubstrat mit einem darin eingebetteten Interposer und Verfahren zur Herstellung davon |
US20130105213A1 (en) * | 2011-10-31 | 2013-05-02 | Unimicron Technology Corporation | Packaging substrate having embedded through-via interposer and method of fabricating the same |
EP2669935A2 (de) * | 2012-06-01 | 2013-12-04 | Unimicron Technology Corp. | Verpackungssubstrat mit Interposer |
US20140027925A1 (en) * | 2012-07-26 | 2014-01-30 | Unimicron Technology Corporation | Through-holed interposer, packaging substrate, and methods of fabricating the same |
US20140084413A1 (en) * | 2012-09-26 | 2014-03-27 | Unimicron Technology Corporation | Package substrate and method of fabricating the same |
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JPH1140901A (ja) * | 1997-07-23 | 1999-02-12 | Sharp Corp | 回路基板 |
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- 2015-06-04 TW TW105104857A patent/TWI578458B/zh active
- 2015-06-26 JP JP2015128278A patent/JP2016032102A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
US10373918B2 (en) | 2019-08-06 |
US9627285B2 (en) | 2017-04-18 |
CN204651304U (zh) | 2015-09-16 |
TW201620092A (zh) | 2016-06-01 |
TWI578458B (zh) | 2017-04-11 |
US20160027712A1 (en) | 2016-01-28 |
JP2016032102A (ja) | 2016-03-07 |
EP2978020B1 (de) | 2020-10-14 |
US20170162523A1 (en) | 2017-06-08 |
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