JP2016032102A - パッケージ基板 - Google Patents
パッケージ基板 Download PDFInfo
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- JP2016032102A JP2016032102A JP2015128278A JP2015128278A JP2016032102A JP 2016032102 A JP2016032102 A JP 2016032102A JP 2015128278 A JP2015128278 A JP 2015128278A JP 2015128278 A JP2015128278 A JP 2015128278A JP 2016032102 A JP2016032102 A JP 2016032102A
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- package substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
21 再配線構造物
21a 第1側部
21b 第2側部
22 成形層
22a 第1表面
22b 第2表面
24 ビルドアップ構造物
24a 第1側部
24b 第2側部
26 半田ボール
27 半導体チップ
100 再配線構造物
100 コアシート
101 金属層
102 誘電体層
103 導電性ビア
104a 第1側部
104b 第2側部
105a 第1表面
105b 第2表面
106 電極パッド
200 ビルドアップ構造物
201 配線層
202 誘電体層
203 導電性ビア
204a 第1側部
204b 第2側部
206 電極パッド
207 保護絶縁層
208 開口部
210 導電性貫通孔
210a 第1端面
210b 第2端面
211 電極パッド
212 貫通孔インターポーザ
213 再配線層構造物
220 溝部
221 残留成形部
241 配線層
242 導電性ビア
243 電極パッド
270 アンダーフィル材
271 半田バンプ
272 導電性パッド
300 成形層
304a 第1表面
304b 第2表面
320 溝部
321 残留成形部
W1 幅
W2 幅
D 深さ
H 厚さ
Claims (20)
- 複数の上部電極パッドを有する再配線構造物と、
前記再配線構造物の底部に構成されるビルドアップ層と、
前記再配線構造物を埋め込む成形層と、
前記再配線構造物の周りに延在する溝部と、
を含み、
前記複数の上部電極パッドは、チップの取り付けに適合する第1密度で構成され、
前記ビルドアップ層は、複数の底部取り付けパッドを有し、
前記複数の底部取り付けパッドは、パッケージ基板のプリント回路板上への取り付けに適合する第2密度で構成され、
前記第2密度は、前記第1密度よりも低い、
パッケージ基板。 - 前記溝部の深さは、前記成形層の厚さよりも小さい、請求項1に記載のパッケージ基板。
- 前記溝部の前記深さは、前記再配線構造物の厚さよりも大きい、請求項2に記載のパッケージ基板。
- 前記溝部は、前記再配線構造物の周りに連続的に延在する、請求項1に記載のパッケージ基板。
- 前記成形層の一部は、前記溝部と前記再配線構造物との間で構成される、請求項1に記載のパッケージ基板。
- 前記成形層の前記一部の幅は、前記溝部の幅よりも小さい、請求項5に記載のパッケージ基板。
- 前記溝部は前記再配線構造物に隣接する、請求項1に記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される4つの独立区画溝部をそれぞれ含む、請求項1に記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される複数の穴を含む、請求項1に記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される複数の矩形の溝部を含む、請求項1に記載のパッケージ基板。
- 前記溝部に充填されるシリコーンを更に含む、請求項1に記載のパッケージ基板。
- 前記再配線構造物に埋め込まれるインターポーザを更に含む、請求項1に記載のパッケージ基板。
- 前記溝部の深さは、前記成形層の厚さよりも大きい、請求項12に記載のパッケージ基板。
- 前記溝部は、前記再配線構造物の周りに連続的に延在する、請求項12記載のパッケージ基板。
- 前記成形層の一部は、前記溝部と前記再配線構造物との間で構成される、請求項12記載のパッケージ基板。
- 前記溝部は前記再配線構造物と隣接する、請求項12記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される4つの独立区画溝部をそれぞれ含む、請求項12記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される複数の穴を含む、請求項12記載のパッケージ基板。
- 上面視において、前記溝部は、前記再配線構造物の4つの側部に沿って配置される複数の矩形の溝部を含む、請求項12記載のパッケージ基板。
- 前記溝部に充填されるシリコーンを更に含む、請求項12記載のパッケージ基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/341,197 | 2014-07-25 | ||
US14/341,197 US9627285B2 (en) | 2014-07-25 | 2014-07-25 | Package substrate |
Publications (1)
Publication Number | Publication Date |
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JP2016032102A true JP2016032102A (ja) | 2016-03-07 |
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ID=53969073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015128278A Pending JP2016032102A (ja) | 2014-07-25 | 2015-06-26 | パッケージ基板 |
Country Status (5)
Country | Link |
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US (2) | US9627285B2 (ja) |
EP (1) | EP2978020B1 (ja) |
JP (1) | JP2016032102A (ja) |
CN (1) | CN204651304U (ja) |
TW (1) | TWI578458B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018006724A (ja) * | 2016-06-23 | 2018-01-11 | 京セラ株式会社 | 配線基板 |
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US20160027712A1 (en) | 2016-01-28 |
US10373918B2 (en) | 2019-08-06 |
EP2978020B1 (en) | 2020-10-14 |
US20170162523A1 (en) | 2017-06-08 |
EP2978020A1 (en) | 2016-01-27 |
US9627285B2 (en) | 2017-04-18 |
TW201620092A (zh) | 2016-06-01 |
TWI578458B (zh) | 2017-04-11 |
CN204651304U (zh) | 2015-09-16 |
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